James P. Letterman Jr.

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 11,049,843
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with leadframes and related methods
- Patent number 10,304,798
- Issue date May 28, 2019
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 9,899,349
- Issue date Feb 20, 2018
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector
- Patent number 8,253,239
- Issue date Aug 28, 2012
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector and method
- Patent number 7,875,964
- Issue date Jan 25, 2011
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leaded molded array package
- Patent number 7,820,528
- Issue date Oct 26, 2010
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 7,598,123
- Issue date Oct 6, 2009
- Semiconductor Components Industries, LLC
- Jay A. Yoder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leaded molded array package
- Patent number 7,588,999
- Issue date Sep 15, 2009
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assemblies
- Patent number 7,508,060
- Issue date Mar 24, 2009
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assembly method
- Patent number 7,498,195
- Issue date Mar 3, 2009
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assemblies
- Patent number 7,298,034
- Issue date Nov 20, 2007
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector assembly method
- Patent number 7,202,105
- Issue date Apr 10, 2007
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor connector and method
- Patent number 7,202,106
- Issue date Apr 10, 2007
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and laminated leadframe package
- Patent number 6,768,186
- Issue date Jul 27, 2004
- Semiconductor Components Industries, LLC
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming same
- Patent number 6,376,266
- Issue date Apr 23, 2002
- Semiconductor Components Industries LLC
- James Price Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,164,523
- Issue date Dec 26, 2000
- Semiconductor Components Industries, LLC
- Joseph K. Fauty
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package consisting of multiple conductive layers
- Patent number 6,081,031
- Issue date Jun 27, 2000
- Semiconductor Components Industries, LLC
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating layer and method for making
- Patent number 5,886,400
- Issue date Mar 23, 1999
- Motorola, Inc.
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor component
- Patent number 5,785,791
- Issue date Jul 28, 1998
- Motorola, Inc.
- James P. Letterman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Encapsulated semiconductor package having protectant circular insul...
- Patent number 5,309,027
- Issue date May 3, 1994
- Motorola, Inc.
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190244928
- Publication date Aug 8, 2019
- Semiconductor Components Industries, LLC
- Phillip CELAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20180138144
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Phillip CELAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20160190095
- Publication date Jun 30, 2016
- Semiconductor Components Industries, LLC
- Phillip CELAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20160027694
- Publication date Jan 28, 2016
- Semiconductor Components Industries, LLC
- Darrel Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
- Publication number 20150035166
- Publication date Feb 5, 2015
- Semiconductor Components Industries, LLC
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20140151883
- Publication date Jun 5, 2014
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR
- Publication number 20110068451
- Publication date Mar 24, 2011
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE
- Publication number 20090298232
- Publication date Dec 3, 2009
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20080217765
- Publication date Sep 11, 2008
- Jay A. Yoder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRU...
- Publication number 20080197459
- Publication date Aug 21, 2008
- Joseph K. Fauty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20080054424
- Publication date Mar 6, 2008
- Semiconductor Components Industries, LLC.
- Phillip Celaya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLIES
- Publication number 20080006920
- Publication date Jan 10, 2008
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR AND METHOD
- Publication number 20070126106
- Publication date Jun 7, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD
- Publication number 20070126107
- Publication date Jun 7, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a leaded molded array package
- Publication number 20070111393
- Publication date May 17, 2007
- Semiconductor Components Industries, LLC.
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a molded array package device having an exposed t...
- Publication number 20070075409
- Publication date Apr 5, 2007
- Semiconductor Components Industries, LLC.
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated chip scale package having flip-chip on lead frame stru...
- Publication number 20070040283
- Publication date Feb 22, 2007
- Semiconductor Components Industries, LLC.
- Joseph K. Fauty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor connector assemblies
- Publication number 20050285249
- Publication date Dec 29, 2005
- Semiconductor Components Industries, LLC.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor connector assembly method
- Publication number 20050287703
- Publication date Dec 29, 2005
- Semiconductor Components Industries, LLC.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor connector and method
- Publication number 20050285235
- Publication date Dec 29, 2005
- Semiconductor Components Industries, LLC.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a semiconductor package and leadframe therefor
- Publication number 20050127482
- Publication date Jun 16, 2005
- Semiconductor Components Industries, LLC.
- Joseph K. Fauty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and laminated leadframe package
- Publication number 20040070062
- Publication date Apr 15, 2004
- Semiconductor Components Industries, LLC.
- James P. Letterman
- H01 - BASIC ELECTRIC ELEMENTS

James P. Letterman Jr.

Person

Patents Grantslast 30 patents

Semiconductor packages

Semiconductor packages with leadframes and related methods

Semiconductor packages and related methods

Wafer level flat no-lead semiconductor packages and methods of manu...

Multi-chip semiconductor connector

Multi-chip semiconductor connector and method

Method of forming a leaded molded array package

Semiconductor component and method of manufacture

Method of forming a leaded molded array package

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector and method

Semiconductor device and laminated leadframe package

Semiconductor package and method for forming same

Electronic component and method of manufacture

Semiconductor package consisting of multiple conductive layers

Semiconductor device having an insulating layer and method for making

Method of manufacturing semiconductor component

Encapsulated semiconductor package having protectant circular insul...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGES AND RELATED METHODS

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...

MULTI-CHIP SEMICONDUCTOR CONNECTOR

METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRU...

SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLIES

MULTI-CHIP SEMICONDUCTOR CONNECTOR AND METHOD

MULTI-CHIP SEMICONDUCTOR CONNECTOR ASSEMBLY METHOD

Method of forming a leaded molded array package

Method of forming a molded array package device having an exposed t...

Encapsulated chip scale package having flip-chip on lead frame stru...

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector and method

Method of forming a semiconductor package and leadframe therefor

Semiconductor device and laminated leadframe package