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Entry |
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US 2002/0038905A1, Published Apr.4, 2002, Semiconductor Device Provided In Thin Package and Method For Manufacturing The Same, Sugizaki. |
US 2002/0140077A1, Published Oct. 3, 2002, Multichip Semiconductor Package, King et al. |
US 2002/0153615A1, Published Oct. 24, 2002, Multi-Chip Package Type Smeiconductor Device, Komiyama et al. |
http://www.amkor.com/enablingtechnologies/SIP/index.cfm Amkor Technology, System in Package (SiP) Technology Solution Sheet, at www.amkor.com. |