James Patrick Wood

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,448,169
- Issue date Sep 10, 2002
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seed metal delete process for thin film repair solutions using dire...
- Patent number 6,235,544
- Issue date May 22, 2001
- International Business Machines Corporation
- Peter A. Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement preventing damage during contact processing
- Patent number 6,188,124
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Gregory S. Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,149,048
- Issue date Nov 21, 2000
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for providing solder interconnections to semiconductor an...
- Patent number 6,099,935
- Issue date Aug 8, 2000
- International Business Machines Corporation
- William Brearley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array by partitioned lamination process
- Patent number 5,735,452
- Issue date Apr 7, 1998
- International Business Machines Corporation
- Roy Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bottom-surface-metallurgy rework process in ceramic modules
- Patent number 5,722,579
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS

James Patrick Wood

Person

Patents Grantslast 30 patents

Apparatus and method for use in manufacturing semiconductor devices

Seed metal delete process for thin film repair solutions using dire...

Semiconductor arrangement preventing damage during contact processing

Apparatus and method for use in manufacturing semiconductor devices

Apparatus for providing solder interconnections to semiconductor an...

Ball grid array by partitioned lamination process

Bottom-surface-metallurgy rework process in ceramic modules