James R. Wilcox

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature dependent semiconductor module connectors
- Patent number 7,255,571
- Issue date Aug 14, 2007
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature dependent semiconductor module connectors
- Patent number 7,137,826
- Issue date Nov 21, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hook interconnect
- Patent number 7,128,579
- Issue date Oct 31, 2006
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining member for Z-interconnect in electronic devices without con...
- Patent number 7,083,901
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 7,024,764
- Issue date Apr 11, 2006
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing dendrite interconnect for planarization
- Patent number 6,739,046
- Issue date May 25, 2004
- International Business Machines Corporation
- Bernd K. Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for injection molded flip chip encapsulation
- Patent number 6,570,261
- Issue date May 27, 2003
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tented plated through-holes and method for fabrication thereof
- Patent number 6,562,654
- Issue date May 13, 2003
- International Business Machines Corporation
- John S. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing conductor interconnect with dendrites
- Patent number 6,427,323
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Bernd K. Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,410,988
- Issue date Jun 25, 2002
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with high density interconnect layer
- Patent number 6,373,717
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for injection molded flip chip encapsulation
- Patent number 6,369,449
- Issue date Apr 9, 2002
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for electronic components and method of making same
- Patent number 6,351,393
- Issue date Feb 26, 2002
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor interconnect with dendrites through film
- Patent number 6,300,575
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor interconnect with dendrites through film and method for p...
- Patent number 6,256,874
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tented plated through-holes and method for fabrication thereof
- Patent number 6,249,045
- Issue date Jun 19, 2001
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for electronic components
- Patent number 6,228,470
- Issue date May 8, 2001
- International Business Machines Corporation
- John S. Kresge
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermally enhanced and mechanically balanced flip chip package and...
- Patent number 6,104,093
- Issue date Aug 15, 2000
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test head for applying signals in a burn-in test of an integrated c...
- Patent number 6,094,060
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Jerome A. Frankeny
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for burn-in/testing of integrated circuit devices
- Patent number 6,094,059
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Jerome A. Frankeny
- G01 - MEASURING TESTING
Information Patent Grant
High performance electrical cable and method of manufacture
- Patent number 5,993,579
- Issue date Nov 30, 1999
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for injection molded flip chip encapsulation
- Patent number 5,981,312
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dendrite interconnect for planarization and method for producing same
- Patent number 5,977,642
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Bernd K. Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test head for applying signals in a burn-in test of an integrated c...
- Patent number 5,949,246
- Issue date Sep 7, 1999
- International Business Machines
- Jerome A. Frankeny
- G01 - MEASURING TESTING
Information Patent Grant
Thermal stress relieving substrate
- Patent number 5,874,776
- Issue date Feb 23, 1999
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance electrical cable
- Patent number 5,847,324
- Issue date Dec 8, 1998
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for directing the input/output connection of i...
- Patent number 5,781,413
- Issue date Jul 14, 1998
- International Business Machines Corporation
- Wayne John Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable interconnect structure for connecting an internal plane...
- Patent number 5,736,679
- Issue date Apr 7, 1998
- International Business Machines Corporation
- John Steven Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making printed circuit board with flush surface lands
- Patent number 5,659,951
- Issue date Aug 26, 1997
- International Business Machines Corporation
- Thomas Patrick Gall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Temperature dependent semiconductor module connectors
- Publication number 20070010111
- Publication date Jan 11, 2007
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE DEPENDENT SEMICONDUCTOR MODULE CONNECTORS
- Publication number 20060205273
- Publication date Sep 14, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining member for Z-interconnect in electronic devices without con...
- Publication number 20040063040
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for injection molded flip chip encapsulation
- Publication number 20020111016
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package with high density interconnect layer
- Publication number 20020085364
- Publication date Jul 4, 2002
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package for electronic components and method of making same
- Publication number 20020059723
- Publication date May 23, 2002
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INJECTION MOLDED FLIP CHIP ENCAPSULATION
- Publication number 20010045637
- Publication date Nov 29, 2001
- DONALD SETON FARQUHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor interconnect with dendrites through film and method for p...
- Publication number 20010034937
- Publication date Nov 1, 2001
- International Business Machines Corporation
- Bernd K. Appelt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Tented plated through-holes and method for fabrication thereof
- Publication number 20010022392
- Publication date Sep 20, 2001
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS

James R. Wilcox

Person

Patents Grantslast 30 patents

Temperature dependent semiconductor module connectors

Temperature dependent semiconductor module connectors

Hook interconnect

Joining member for Z-interconnect in electronic devices without con...

Method of making an electronic package

Method of making a multi-layered interconnect structure

Method for producing dendrite interconnect for planarization

Method and apparatus for injection molded flip chip encapsulation

Tented plated through-holes and method for fabrication thereof

Method for producing conductor interconnect with dendrites

Thermally enhanced and mechanically balanced flip chip package and...

Electronic package with high density interconnect layer

Method and apparatus for injection molded flip chip encapsulation

Electronic package for electronic components and method of making same

Conductor interconnect with dendrites through film

Conductor interconnect with dendrites through film and method for p...

Tented plated through-holes and method for fabrication thereof

Composite substrate for electronic components

Thermally enhanced and mechanically balanced flip chip package and...

Test head for applying signals in a burn-in test of an integrated c...

Apparatus and method for burn-in/testing of integrated circuit devices

High performance electrical cable and method of manufacture

Method for injection molded flip chip encapsulation

Dendrite interconnect for planarization and method for producing same

Test head for applying signals in a burn-in test of an integrated c...

Thermal stress relieving substrate

High performance electrical cable

Method and apparatus for directing the input/output connection of i...

Deformable interconnect structure for connecting an internal plane...

Method for making printed circuit board with flush surface lands

Patents Applicationslast 30 patents

Temperature dependent semiconductor module connectors

TEMPERATURE DEPENDENT SEMICONDUCTOR MODULE CONNECTORS

Joining member for Z-interconnect in electronic devices without con...

Method and apparatus for injection molded flip chip encapsulation

Electronic package with high density interconnect layer

Electronic package for electronic components and method of making same

METHOD AND APPARATUS FOR INJECTION MOLDED FLIP CHIP ENCAPSULATION

Conductor interconnect with dendrites through film and method for p...

Tented plated through-holes and method for fabrication thereof