James S. Donley

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free integrated circuit package structure
- Patent number 7,180,170
- Issue date Feb 20, 2007
- Semiconductor Components Industries, LLC
- Phillip C. Celaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a lead-free integrated circuit package
- Patent number 6,889,429
- Issue date May 10, 2005
- Semiconductor Components Industries, LLC
- Phillip C. Celaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit package and method
- Publication number 20050121767
- Publication date Jun 9, 2005
- Phillip C. Celaya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated circuit package and method
- Publication number 20020134582
- Publication date Sep 26, 2002
- Semiconductor Components Industries, LLC.
- Phillip C. Celaya
- H01 - BASIC ELECTRIC ELEMENTS