Jan De Geest

Person

Wetteren, BE

People

Patents Grantslast 30 patents

Information Patent Grant
High speed connector
- Patent number 12,074,398
- Issue date Aug 27, 2024
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density direct mate orthogonal connector
- Patent number 11,817,657
- Issue date Nov 14, 2023
- FCI USA LLC
- Jason John Ellison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed connector
- Patent number 11,799,246
- Issue date Oct 24, 2023
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density connector
- Patent number 11,791,585
- Issue date Oct 17, 2023
- FCI USA LLC
- James J. Muha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed connector
- Patent number 11,469,553
- Issue date Oct 11, 2022
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density direct mate orthogonal connector
- Patent number 11,469,554
- Issue date Oct 11, 2022
- FCI USA LLC
- Jason John Ellison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance connector
- Patent number 11,258,205
- Issue date Feb 22, 2022
- Amphenol FCI Asia Pte Ltd
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential pair signal contacts with skew correction
- Patent number 10,498,086
- Issue date Dec 3, 2019
- FCI USA LLC
- Madhumitha Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly with low pair cross talk
- Patent number 10,418,753
- Issue date Sep 17, 2019
- Amphenol FCI Asia Pte Ltd
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed electrical connector
- Patent number 10,038,282
- Issue date Jul 31, 2018
- Amphenol FCI Asia Pte Ltd
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector footprints in printed circuit board (PCB)
- Patent number 9,545,003
- Issue date Jan 10, 2017
- FCI Americas Technology LLC
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed electrical connector
- Patent number 9,515,429
- Issue date Dec 6, 2016
- FCI Asia Pte. Ltd.
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed edge card connector
- Patent number 9,385,477
- Issue date Jul 5, 2016
- FCI
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cross-talk electrical connector
- Patent number 9,136,634
- Issue date Sep 15, 2015
- FCI Americas Technology LLC
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structured circuit board and method
- Patent number 9,084,353
- Issue date Jul 14, 2015
- FCI
- Jan De Geest
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cross talk reduction for high speed electrical connectors
- Patent number 8,764,464
- Issue date Jul 1, 2014
- FCI Americas Technology LLC
- Jonathan E. Buck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with ground plates
- Patent number 8,734,187
- Issue date May 27, 2014
- FCI
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having impedance tuning ribs
- Patent number 8,715,003
- Issue date May 6, 2014
- FCI Americas Technology LLC
- Jonathan E. Buck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Matched-impedance connector footprints
- Patent number 8,383,951
- Issue date Feb 26, 2013
- FCI
- Danny L. C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission for high speed interconnections
- Patent number 8,361,896
- Issue date Jan 29, 2013
- FCI
- Jan De Geest
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Matched-impedance connector footprints
- Patent number 8,183,466
- Issue date May 22, 2012
- FCI
- Danny L. C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Matched-impedance connector footprints
- Patent number 7,935,896
- Issue date May 3, 2011
- FCI
- Danny L. C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Broadside-coupled signal pair configurations for electrical connectors
- Patent number 7,713,088
- Issue date May 11, 2010
- FCI
- Stefaan Hendrik Jozef Sercu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadside-coupled signal pair configurations for electrical connectors
- Patent number 7,708,569
- Issue date May 4, 2010
- FCI Americas Technology, Inc.
- Stefaan Hendrik Jozef Sercu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Matched-impedance surface-mount technology footprints
- Patent number 7,709,747
- Issue date May 4, 2010
- FCI
- Danny L. C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing suck-out insertion loss
- Patent number 7,316,585
- Issue date Jan 8, 2008
- FCI Americas Technology, Inc.
- Stephen B. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH SPEED CONNECTOR
- Publication number 20240372302
- Publication date Nov 7, 2024
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED CONNECTOR
- Publication number 20240006822
- Publication date Jan 4, 2024
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY CONNECTOR
- Publication number 20230107361
- Publication date Apr 6, 2023
- FCI USA LLC
- James J. Muha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED CONNECTOR
- Publication number 20230062661
- Publication date Mar 2, 2023
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY DIRECT MATE ORTHOGONAL CONNECTOR
- Publication number 20220407269
- Publication date Dec 22, 2022
- FCI USA LLC
- Jason John Ellison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED CONNECTOR
- Publication number 20210234314
- Publication date Jul 29, 2021
- FCI USA LLC
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY DIRECT MATE ORTHOGONAL CONNECTOR
- Publication number 20210234315
- Publication date Jul 29, 2021
- FCI USA LLC
- Jason John Ellison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20200006897
- Publication date Jan 2, 2020
- AMPHENOL FCI ASIA PTE LTD
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL PAIR SIGNAL CONTACTS WITH SKEW CORRECTION
- Publication number 20190027869
- Publication date Jan 24, 2019
- FCI USA LLC
- Madhumitha Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED ELECTRICAL CONNECTOR
- Publication number 20170085034
- Publication date Mar 23, 2017
- FCI Asia PTE. LTD.
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Assembly
- Publication number 20150372427
- Publication date Dec 24, 2015
- FIC Asia Pte. Ltd.
- Jan DE GEEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS
- Publication number 20140182891
- Publication date Jul 3, 2014
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED ELECTRICAL CONNECTOR
- Publication number 20140057493
- Publication date Feb 27, 2014
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Edge Card Connector
- Publication number 20130309906
- Publication date Nov 21, 2013
- FCI
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-CROSS-TALK ELECTRICAL CONNECTOR
- Publication number 20120058684
- Publication date Mar 8, 2012
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION FOR HIGH SPEED INTERCONNECTIONS
- Publication number 20110318962
- Publication date Dec 29, 2011
- Jan De Geest
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR WITH GROUND PLATES
- Publication number 20110318945
- Publication date Dec 29, 2011
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATION OF CROSSTALK RESONANCES IN INTERCONNECTS
- Publication number 20110256763
- Publication date Oct 20, 2011
- Jan De Geest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Matched-Impedance Connector Footprints
- Publication number 20100048043
- Publication date Feb 25, 2010
- FCI AMERICAS TECHNOLOGY, INC.
- Danny L.C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Matched-Impedance Connector Footprints
- Publication number 20100041275
- Publication date Feb 18, 2010
- FCI AMERICAS TECHNOLOGY, INC.
- Danny L.C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Matched-Impedance Connector Footprints
- Publication number 20100041256
- Publication date Feb 18, 2010
- FCI AMERICAS TECHNOLOGY, INC.
- Danny L.C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Broadside-Coupled Signal Pair Configurations For Electrical Connectors
- Publication number 20080102702
- Publication date May 1, 2008
- Stefaan Hendrik Jozef Sercu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Broadside-Coupled Signal Pair Configurations For Electrical Connectors
- Publication number 20080085618
- Publication date Apr 10, 2008
- FCI
- Stefaan Hendrik Jozef Sercu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Suck-Out Insertion Loss
- Publication number 20070279158
- Publication date Dec 6, 2007
- Stephen B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Matched-impedance surface-mount technology footprints
- Publication number 20060232301
- Publication date Oct 19, 2006
- FCI Americas Technology, Inc.
- Danny L.C. Morlion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jan De Geest

Person

Patents Grantslast 30 patents

High speed connector

High speed, high density direct mate orthogonal connector

High speed connector

High speed, high density connector

High speed connector

High speed, high density direct mate orthogonal connector

High performance connector

Differential pair signal contacts with skew correction

Connector assembly with low pair cross talk

High speed electrical connector

Connector footprints in printed circuit board (PCB)

High speed electrical connector

High speed edge card connector

Low-cross-talk electrical connector

Structured circuit board and method

Cross talk reduction for high speed electrical connectors

Electrical connector with ground plates

Electrical connector having impedance tuning ribs

Matched-impedance connector footprints

Signal transmission for high speed interconnections

Matched-impedance connector footprints

Matched-impedance connector footprints

Broadside-coupled signal pair configurations for electrical connectors

Broadside-coupled signal pair configurations for electrical connectors

Matched-impedance surface-mount technology footprints

Reducing suck-out insertion loss

Patents Applicationslast 30 patents

HIGH SPEED CONNECTOR

HIGH SPEED CONNECTOR

HIGH SPEED, HIGH DENSITY CONNECTOR

HIGH SPEED CONNECTOR

HIGH SPEED, HIGH DENSITY DIRECT MATE ORTHOGONAL CONNECTOR

HIGH SPEED CONNECTOR

HIGH SPEED, HIGH DENSITY DIRECT MATE ORTHOGONAL CONNECTOR

CONNECTOR ASSEMBLY

DIFFERENTIAL PAIR SIGNAL CONTACTS WITH SKEW CORRECTION

HIGH SPEED ELECTRICAL CONNECTOR

Connector Assembly

GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS

HIGH SPEED ELECTRICAL CONNECTOR

High Speed Edge Card Connector

LOW-CROSS-TALK ELECTRICAL CONNECTOR

SIGNAL TRANSMISSION FOR HIGH SPEED INTERCONNECTIONS

ELECTRICAL CONNECTOR WITH GROUND PLATES

MITIGATION OF CROSSTALK RESONANCES IN INTERCONNECTS

Matched-Impedance Connector Footprints

Matched-Impedance Connector Footprints

Matched-Impedance Connector Footprints

Broadside-Coupled Signal Pair Configurations For Electrical Connectors

Broadside-Coupled Signal Pair Configurations For Electrical Connectors

Reducing Suck-Out Insertion Loss

Matched-impedance surface-mount technology footprints