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Jan I. Strandberg
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San Jose, CA, US
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Patents Grants
last 30 patents
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Patent Grant
High density chip level package for the packaging of integrated cir...
Patent number
6,953,999
Issue date
Oct 11, 2005
Kulicke & Soffa Investments, Inc.
Jan I. Strandberg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density chip level package for the packaging of integrated cir...
Patent number
6,872,589
Issue date
Mar 29, 2005
Kulicke & Soffa Investments, Inc.
Jan I. Strandberg
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
High density chip level package for the packaging of integrated cir...
Publication number
20050146033
Publication date
Jul 7, 2005
Kulicke & Soffa Investments, Inc.
Jan I. Strandberg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High density chip level package for the packaging of integrated cir...
Publication number
20040155337
Publication date
Aug 12, 2004
Kulicke & Soffa Investments, Inc.
Jan I. Strandberg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High density substrate for the packaging of integrated circuits
Publication number
20030197285
Publication date
Oct 23, 2003
Kulicke & Soffa Investments, Inc.
Jan I. Strandberg
H01 - BASIC ELECTRIC ELEMENTS