Jan Proschwitz

Person

Riesa, DE

People

Patents Grantslast 30 patents

Information Patent Grant
WLCSP reliability improvement for package edges including package s...
- Patent number 11,990,408
- Issue date May 21, 2024
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Snap button fastener providing electrical connection
- Patent number 11,804,683
- Issue date Oct 31, 2023
- Intel Corporation
- Hans-Joachim Barth
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Snap button fastener providing electrical connection
- Patent number 11,342,720
- Issue date May 24, 2022
- Intel Corporation
- Hans-Joachim Barth
- A41 - WEARING APPAREL
Information Patent Grant
Snap button fastener providing electrical connection
- Patent number 10,886,680
- Issue date Jan 5, 2021
- Intel Corporation
- Hans-Joachim Barth
- A41 - WEARING APPAREL
Information Patent Grant
Low thermal resistance hanging die package
- Patent number 10,347,558
- Issue date Jul 9, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Snap button fastener providing electrical connection
- Patent number 10,193,288
- Issue date Jan 29, 2019
- Intel Corporation
- Hans-Joachim Barth
- A41 - WEARING APPAREL
Information Patent Grant
Wearable computing device
- Patent number 9,921,694
- Issue date Mar 20, 2018
- Intel Corporation
- Sven Albers
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Snap button fastener providing electrical connection
- Patent number 9,627,804
- Issue date Apr 18, 2017
- Intel Corporation
- Hans-Joachim Barth
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Semiconductor device with chip having low-k-layers
- Patent number 8,786,105
- Issue date Jul 22, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
- Publication number 20230317562
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
- Publication number 20230317544
- Publication date Oct 5, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAYERS FOR STRESS MONITORING AND METHOD
- Publication number 20230307300
- Publication date Sep 28, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
- Publication number 20230299032
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...
- Publication number 20230299043
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
- Publication number 20230300975
- Publication date Sep 21, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH ACTIVE COOLING
- Publication number 20230282546
- Publication date Sep 7, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
- Publication number 20230282615
- Publication date Sep 7, 2023
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION
- Publication number 20220285898
- Publication date Sep 8, 2022
- Intel Corporation
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL WLCSP RELIABILITY IMPROVEMENT FOR PACKAGE EDGES INCLUDING PAC...
- Publication number 20210305158
- Publication date Sep 30, 2021
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION
- Publication number 20210044065
- Publication date Feb 11, 2021
- Intel Corporation
- Hans-Joachim Barth
- A41 - WEARING APPAREL
Information Patent Application
SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION
- Publication number 20190393659
- Publication date Dec 26, 2019
- Intel Corporation
- Hans-Joachim Barth
- A41 - WEARING APPAREL
Information Patent Application
LOW THERMAL RESISTANCE HANGING DIE PACKAGE
- Publication number 20180218962
- Publication date Aug 2, 2018
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE COMPUTING DEVICE
- Publication number 20180150156
- Publication date May 31, 2018
- Intel Corporation
- Sven Albers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION
- Publication number 20170244208
- Publication date Aug 24, 2017
- Intel Corporation
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE COMPUTING DEVICE
- Publication number 20160224148
- Publication date Aug 4, 2016
- Sven ALBERS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION
- Publication number 20160181729
- Publication date Jun 23, 2016
- Intel Corporation
- Hans-Joachim Barth
- A41 - WEARING APPAREL
Information Patent Application
SEMICONDUCTOR DEVICE WITH CHIP HAVING LOW-K-LAYERS
- Publication number 20140197530
- Publication date Jul 17, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

Jan Proschwitz

Person

Patents Grantslast 30 patents

WLCSP reliability improvement for package edges including package s...

Snap button fastener providing electrical connection

Snap button fastener providing electrical connection

Snap button fastener providing electrical connection

Low thermal resistance hanging die package

Snap button fastener providing electrical connection

Wearable computing device

Snap button fastener providing electrical connection

Semiconductor device with chip having low-k-layers

Patents Applicationslast 30 patents

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH

THREE-DIMENSIONAL STACK COOLING WINGS

PACKAGE LAYERS FOR STRESS MONITORING AND METHOD

MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS

PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

PACKAGING ARCHITECTURE WITH ACTIVE COOLING

STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER

SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION

NOVEL WLCSP RELIABILITY IMPROVEMENT FOR PACKAGE EDGES INCLUDING PAC...

SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION

SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION

LOW THERMAL RESISTANCE HANGING DIE PACKAGE

WEARABLE COMPUTING DEVICE

SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION

WEARABLE COMPUTING DEVICE

SNAP BUTTON FASTENER PROVIDING ELECTRICAL CONNECTION

SEMICONDUCTOR DEVICE WITH CHIP HAVING LOW-K-LAYERS