Jan Willem Bergman

Person

Veghel, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Grounding assembly for a semiconductor device
- Patent number 12,315,995
- Issue date May 27, 2025
- NXP B.V.
- Mustafa Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single die design for different polarizations
- Patent number 12,212,074
- Issue date Jan 28, 2025
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having uniform multi-package antenna array and...
- Patent number 12,199,333
- Issue date Jan 14, 2025
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF component and method
- Patent number 12,114,472
- Issue date Oct 8, 2024
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single inline no-lead semiconductor package
- Patent number 9,379,071
- Issue date Jun 28, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ON-CHIP SHIELDED DEVICE
- Publication number 20240237316
- Publication date Jul 11, 2024
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP SHIELDED DEVICE
- Publication number 20240138129
- Publication date Apr 25, 2024
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE
- Publication number 20230402410
- Publication date Dec 14, 2023
- NXP B.V.
- Mustafa Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT
- Publication number 20230290737
- Publication date Sep 14, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF COMPONENT AND METHOD
- Publication number 20230189492
- Publication date Jun 15, 2023
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20220384943
- Publication date Dec 1, 2022
- NXP B.V.
- Mustafa Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DIE DESIGN FOR DIFFERENT POLARIZATIONS
- Publication number 20220311137
- Publication date Sep 29, 2022
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM MULTI-PACKAGE ANTENNA ARRAY
- Publication number 20220263222
- Publication date Aug 18, 2022
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20150303156
- Publication date Oct 22, 2015
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS

Jan Willem Bergman

Person

Patents Grantslast 30 patents

Grounding assembly for a semiconductor device

Single die design for different polarizations

Semiconductor device having uniform multi-package antenna array and...

RF component and method

Single inline no-lead semiconductor package

Patents Applicationslast 30 patents

ON-CHIP SHIELDED DEVICE

ON-CHIP SHIELDED DEVICE

RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE

FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT

RF COMPONENT AND METHOD

GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE

SINGLE DIE DESIGN FOR DIFFERENT POLARIZATIONS

UNIFORM MULTI-PACKAGE ANTENNA ARRAY

SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE