Janos Farkas

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a multiple thickness interconnect
- Patent number 7,176,574
- Issue date Feb 13, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor interconnect with multiple thick...
- Patent number 6,815,820
- Issue date Nov 9, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,573,173
- Issue date Jun 3, 2003
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,444,569
- Issue date Sep 3, 2002
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,313,024
- Issue date Nov 6, 2001
- Motorola, Inc.
- Nigel G. Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,274,478
- Issue date Aug 14, 2001
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing for polishing dissimilar conductive layers in a semicond...
- Patent number 6,204,169
- Issue date Mar 20, 2001
- Motorola Inc.
- Rajeev Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chemical mechanical planarization using copper coordinati...
- Patent number 6,096,652
- Issue date Aug 1, 2000
- Motorola, Inc.
- David K. Watts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit having a support structure
- Patent number 6,037,668
- Issue date Mar 14, 2000
- Motorola, Inc.
- Nigel G. Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing (CMP) slurry for polishing copper int...
- Patent number 6,001,730
- Issue date Dec 14, 1999
- Motorola, Inc.
- Janos Farkas
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Processing for polishing dissimilar conductive layers in a semicond...
- Patent number 5,985,755
- Issue date Nov 16, 1999
- Rajeev Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device
- Patent number 5,935,871
- Issue date Aug 10, 1999
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device
- Patent number 5,928,962
- Issue date Jul 27, 1999
- Motorola, Inc.
- Janos Farkas
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing (CMP) slurry for copper and method of...
- Patent number 5,897,375
- Issue date Apr 27, 1999
- Motorola, Inc.
- David Watts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for chemically-mechanically polishing a metal layer
- Patent number 5,863,838
- Issue date Jan 26, 1999
- Motorola, Inc.
- Janos Farkas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for using ammonium salt slurries for chemical mechanical pol...
- Patent number 5,773,364
- Issue date Jun 30, 1998
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using additives with silica-based slurries to enhance sel...
- Patent number 5,614,444
- Issue date Mar 25, 1997
- Sematech, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Point of use slurry dispensing system
- Patent number 5,478,435
- Issue date Dec 26, 1995
- National Semiconductor Corp.
- James J. Murphy
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A COUPLING LAYER
- Publication number 20160172240
- Publication date Jun 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- PHILIPPE MONNOYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING LAYER COMPOSITION FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTO...
- Publication number 20100200995
- Publication date Aug 12, 2010
- Freeescale Semiconductor, Inc
- Philippe Monnoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Cleaning After Via-Etching
- Publication number 20080207005
- Publication date Aug 28, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multiple thickness interconnect
- Publication number 20050035459
- Publication date Feb 17, 2005
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple thickness semiconductor interconnect and method therefor
- Publication number 20030209779
- Publication date Nov 13, 2003
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20020151167
- Publication date Oct 17, 2002
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20010027083
- Publication date Oct 4, 2001
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS

Janos Farkas

Person

Patents Grantslast 30 patents

Semiconductor device having a multiple thickness interconnect

Method for forming a semiconductor interconnect with multiple thick...

Method for forming a copper interconnect using a multi-platen chemi...

Method for forming a copper interconnect using a multi-platen chemi...

Method for forming a semiconductor device

Method for forming a copper interconnect using a multi-platen chemi...

Processing for polishing dissimilar conductive layers in a semicond...

Method of chemical mechanical planarization using copper coordinati...

Integrated circuit having a support structure

Chemical mechanical polishing (CMP) slurry for polishing copper int...

Processing for polishing dissimilar conductive layers in a semicond...

Process for forming a semiconductor device

Process for forming a semiconductor device

Chemical mechanical polishing (CMP) slurry for copper and method of...

Method for chemically-mechanically polishing a metal layer

Method for using ammonium salt slurries for chemical mechanical pol...

Method of using additives with silica-based slurries to enhance sel...

Point of use slurry dispensing system

Patents Applicationslast 30 patents

METHOD FOR FORMING A COUPLING LAYER

COUPLING LAYER COMPOSITION FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTO...

Wafer Cleaning After Via-Etching

Semiconductor device having a multiple thickness interconnect

Multiple thickness semiconductor interconnect and method therefor

Method for forming a copper interconnect using a multi-platen chemi...

Method for forming a copper interconnect using a multi-platen chemi...