Jao-Sheng Huang

Person

Hsin - chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Air curtain device and workpiece processing tool
- Patent number 12,188,686
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,112,953
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle removing assembly and method of servicing assembly
- Patent number 11,779,967
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Hsueh Wu
- B08 - CLEANING
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,776,818
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 10,985,028
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,522,382
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Jean Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,786,540
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Jean Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer carrier and method of manufacturing
- Patent number 8,859,424
- Issue date Oct 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Jean Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer carrier
- Patent number 8,820,728
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jao Sheng Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked integrated chips and methods of fabrication thereof
- Patent number 8,816,491
- Issue date Aug 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated chips and methods of fabrication thereof
- Patent number 8,501,587
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an STI feature to avoid electrical charge leakage
- Patent number 6,972,241
- Issue date Dec 6, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yih Song Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20240395559
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20240021431
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE REMOVING ASSEMBLY AND METHOD OF SERVICING ASSEMBLY
- Publication number 20240001414
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsueh WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CURTAIN DEVICE AND WORKPIECE PROCESSING TOOL
- Publication number 20230349574
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE REMOVING ASSEMBLY AND METHOD OF SERVICING ASSEMBLY
- Publication number 20210268558
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- M.H. WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20210257218
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20210118689
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20180019149
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Jean Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Carrier and Method of Manufacturing
- Publication number 20150040387
- Publication date Feb 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Jean Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Chips and Methods of Fabrication Thereof
- Publication number 20130320531
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Carrier and Method of Manufacturing
- Publication number 20110035937
- Publication date Feb 17, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Jean Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Carrier
- Publication number 20100194014
- Publication date Aug 5, 2010
- Jao Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Chips and Methods of Fabrication Thereof
- Publication number 20100178761
- Publication date Jul 15, 2010
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Feed forward spacer width control in semiconductor manufacturing
- Publication number 20060019479
- Publication date Jan 26, 2006
- Yih-Song Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an STI feature to avoid electrical charge leakage
- Publication number 20050158964
- Publication date Jul 21, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yih Song Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel multi-gate formation procedure for gate oxide quality improve...
- Publication number 20050124160
- Publication date Jun 9, 2005
- Taiwan Semiconductor Manufacturing Co.
- Yi Song Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Jao-Sheng Huang

Person

Patents Grantslast 30 patents

Air curtain device and workpiece processing tool

Semiconductor devices and methods of manufacturing

Particle removing assembly and method of servicing assembly

Semiconductor devices and methods of manufacturing

Semiconductor devices and methods of manufacturing

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor wafer carrier and method of manufacturing

Semiconductor wafer carrier

Stacked integrated chips and methods of fabrication thereof

Stacked integrated chips and methods of fabrication thereof

Method of forming an STI feature to avoid electrical charge leakage

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

PARTICLE REMOVING ASSEMBLY AND METHOD OF SERVICING ASSEMBLY

AIR CURTAIN DEVICE AND WORKPIECE PROCESSING TOOL

PARTICLE REMOVING ASSEMBLY AND METHOD OF SERVICING ASSEMBLY

Semiconductor Devices and Methods of Manufacturing

Semiconductor Devices and Methods of Manufacturing

Method of Manufacturing a Semiconductor Device

Semiconductor Wafer Carrier and Method of Manufacturing

Stacked Integrated Chips and Methods of Fabrication Thereof

Semiconductor Wafer Carrier and Method of Manufacturing

Semiconductor Wafer Carrier

Stacked Integrated Chips and Methods of Fabrication Thereof

Feed forward spacer width control in semiconductor manufacturing

Method of forming an STI feature to avoid electrical charge leakage

Novel multi-gate formation procedure for gate oxide quality improve...