Jason R. Fender

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits and devices with interleaved transistor element...
- Patent number 10,366,986
- Issue date Jul 30, 2019
- NXP USA, INC.
- Jason R. Fender
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Universal SPI (Serial Peripheral Interface)
- Patent number 10,318,447
- Issue date Jun 11, 2019
- NXP USA, INC.
- Nicholas J. Spence
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of fabricating integrated circuits and devices with interle...
- Patent number 10,283,500
- Issue date May 7, 2019
- NXP USA, INC.
- Michael L. Fraser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and devices with interleaved transistor element...
- Patent number 9,780,090
- Issue date Oct 3, 2017
- NXP USA, INC.
- Michael L. Fraser
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Universal SPI (serial peripheral interface)
- Patent number 9,658,971
- Issue date May 23, 2017
- NXP USA, INC.
- Nicholas J. Spence
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die fracture detection and humidity protection with double guard ri...
- Patent number 9,070,683
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jason R. Fender
- G01 - MEASURING TESTING
Information Patent Grant
Integrated passive device with a high resistivity substrate and met...
- Patent number 7,935,607
- Issue date May 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jonathan K. Abrokwah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with back side metallization and method fo...
- Patent number 7,723,224
- Issue date May 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming the same
- Patent number 7,339,267
- Issue date Mar 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Vasile Romega Thompson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS AND DEVICES WITH INTERLEAVED TRANSISTOR ELEMENT...
- Publication number 20190221561
- Publication date Jul 18, 2019
- NXP USA, Inc.
- Jason R. FENDER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS OF FABRICATING INTEGRATED CIRCUITS AND DEVICES WITH INTERLE...
- Publication number 20180033787
- Publication date Feb 1, 2018
- NXP USA, Inc.
- Michael L. FRASER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SPI (SERIAL PERIPHERAL INTERFACE)
- Publication number 20170220519
- Publication date Aug 3, 2017
- NXP USA, Inc.
- Nicholas J. Spence
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUITS AND DEVICES WITH INTERLEAVED TRANSISTOR ELEMENT...
- Publication number 20170110451
- Publication date Apr 20, 2017
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL L. FRASER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SPI (SERIAL PERIPHERAL INTERFACE)
- Publication number 20150074319
- Publication date Mar 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Nicholas J. Spence
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die Fracture Detection and Humidity Protection with Double Guard Ri...
- Publication number 20140375341
- Publication date Dec 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jason R. Fender
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED PASSIVE DEVICE AND METHOD WITH LOW COST SUBSTRATE
- Publication number 20090236689
- Publication date Sep 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Terry K. Daly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE WITH A HIGH RESISTIVITY SUBSTRATE AND MET...
- Publication number 20080246114
- Publication date Oct 9, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Jonathan K. Abrokwah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly with back side metallization and method fo...
- Publication number 20070293033
- Publication date Dec 20, 2007
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming solder contacts on mounted substrates
- Publication number 20070090156
- Publication date Apr 26, 2007
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for forming the same
- Publication number 20060270194
- Publication date Nov 30, 2006
- Vasile Romega Thompson
- H01 - BASIC ELECTRIC ELEMENTS

Jason R. Fender

Person

Patents Grantslast 30 patents

Integrated circuits and devices with interleaved transistor element...

Universal SPI (Serial Peripheral Interface)

Methods of fabricating integrated circuits and devices with interle...

Integrated circuits and devices with interleaved transistor element...

Universal SPI (serial peripheral interface)

Die fracture detection and humidity protection with double guard ri...

Integrated passive device with a high resistivity substrate and met...

Microelectronic assembly with back side metallization and method fo...

Semiconductor package and method for forming the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS AND DEVICES WITH INTERLEAVED TRANSISTOR ELEMENT...

METHODS OF FABRICATING INTEGRATED CIRCUITS AND DEVICES WITH INTERLE...

UNIVERSAL SPI (SERIAL PERIPHERAL INTERFACE)

INTEGRATED CIRCUITS AND DEVICES WITH INTERLEAVED TRANSISTOR ELEMENT...

UNIVERSAL SPI (SERIAL PERIPHERAL INTERFACE)

Die Fracture Detection and Humidity Protection with Double Guard Ri...

INTEGRATED PASSIVE DEVICE AND METHOD WITH LOW COST SUBSTRATE

INTEGRATED PASSIVE DEVICE WITH A HIGH RESISTIVITY SUBSTRATE AND MET...

Microelectronic assembly with back side metallization and method fo...

Method for forming solder contacts on mounted substrates

Semiconductor package and method for forming the same