Jay Mathews

Person

Huntersville, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical assembly
- Patent number 8,532,445
- Issue date Sep 10, 2013
- Digitaloptics Corporation East
- James E. Morris
- G02 - OPTICS
Information Patent Grant
Optical assembly and method of making same
- Patent number 7,817,883
- Issue date Oct 19, 2010
- Tessera North America, Inc.
- James Morris
- G02 - OPTICS
Information Patent Grant
Optical wavelength division coupler and associated methods
- Patent number 7,466,502
- Issue date Dec 16, 2008
- Tessera North America, Inc.
- James E. Morris
- G02 - OPTICS
Information Patent Grant
Separating of optical integrated modules and structures formed thereby
- Patent number 7,208,771
- Issue date Apr 24, 2007
- Digital Optics Corporation
- Alan D Kathman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer of optical element patterns on a same side of a substrate...
- Patent number 6,869,754
- Issue date Mar 22, 2005
- Digital Optics Corp.
- Thomas J. Suleski
- G02 - OPTICS
Information Patent Grant
Separating of optical integrated modules and structures formed thereby
- Patent number 6,798,931
- Issue date Sep 28, 2004
- Digital Optics Corp.
- Alan D Kathman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick wafer processing and resultant products
- Patent number 6,777,311
- Issue date Aug 17, 2004
- Digital Optics Corp.
- Hongtao Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL ASSEMBLY
- Publication number 20110033152
- Publication date Feb 10, 2011
- TESSERA NORTH AMERICA, INC.
- JAMES E. MORRIS
- G02 - OPTICS
Information Patent Application
Transfer of optical element patterns on a same side of a substrate...
- Publication number 20090225422
- Publication date Sep 10, 2009
- TESSERA NORTH AMERICA, INC., (FORMERLY DIGITAL OPTICS CORPORATION)
- Thomas J. Suleski
- G02 - OPTICS
Information Patent Application
Optical assembly and method of making same
- Publication number 20090103866
- Publication date Apr 23, 2009
- Digital Optics Corporation
- James Morris
- G02 - OPTICS
Information Patent Application
Optical wavelength division coupler and associated methods
- Publication number 20080013886
- Publication date Jan 17, 2008
- Digital Optics Corporation
- James Morris
- G02 - OPTICS
Information Patent Application
Electrical connection for optoelectronic devices
- Publication number 20070200132
- Publication date Aug 30, 2007
- DIGITAL OPTICS CORPORATION
- Alan D. Kathman
- G02 - OPTICS
Information Patent Application
Transfer of optical element patterns on a same side of a substrate...
- Publication number 20050094276
- Publication date May 5, 2005
- DIGITAL OPTICS CORPORATION
- Thomas J. Suleski
- G02 - OPTICS
Information Patent Application
Separating of optical integrated modules and structures formed thereby
- Publication number 20050035463
- Publication date Feb 17, 2005
- DIGITAL OPTICS CORPORATION
- Alan D. Kathman
- G02 - OPTICS
Information Patent Application
Transfer of optical element patterns on a same side of a substrate...
- Publication number 20030076589
- Publication date Apr 24, 2003
- Thomas J. Suleski
- G02 - OPTICS
Information Patent Application
Thick wafer processing and resultant products
- Publication number 20020126941
- Publication date Sep 12, 2002
- Hongtao Han
- G02 - OPTICS

Jay Mathews

Person

Patents Grantslast 30 patents

Optical assembly

Optical assembly and method of making same

Optical wavelength division coupler and associated methods

Separating of optical integrated modules and structures formed thereby

Transfer of optical element patterns on a same side of a substrate...

Separating of optical integrated modules and structures formed thereby

Thick wafer processing and resultant products

Patents Applicationslast 30 patents

OPTICAL ASSEMBLY

Transfer of optical element patterns on a same side of a substrate...

Optical assembly and method of making same

Optical wavelength division coupler and associated methods

Electrical connection for optoelectronic devices

Transfer of optical element patterns on a same side of a substrate...

Separating of optical integrated modules and structures formed thereby

Transfer of optical element patterns on a same side of a substrate...

Thick wafer processing and resultant products