Jayesh Bharathan

Person

Santa Barbara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High powered light emitter packages with compact optics
- Patent number 9,666,772
- Issue date May 30, 2017
- Cree, Inc.
- James Ibbetson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,878,209
- Issue date Nov 4, 2014
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,759,868
- Issue date Jun 24, 2014
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency Group III nitride LED with lenticular surface
- Patent number 8,692,267
- Issue date Apr 8, 2014
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,686,460
- Issue date Apr 1, 2014
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,183,588
- Issue date May 22, 2012
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,174,037
- Issue date May 8, 2012
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride LED with lenticular surface
- Patent number 8,154,039
- Issue date Apr 10, 2012
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,089,090
- Issue date Jan 3, 2012
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,044,425
- Issue date Oct 25, 2011
- Cree, Inc.
- Mark Raffetto
Information Patent Grant
Methods of forming thermoelectric devices using islands of thermoel...
- Patent number 7,679,203
- Issue date Mar 16, 2010
- Nextreme Thermal Solutions, Inc.
- Jayesh Bharathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting devices suitable for flip-chip bonding
- Patent number 7,608,860
- Issue date Oct 27, 2009
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of light emitting diodes having shaped substrates
- Patent number 7,341,175
- Issue date Mar 11, 2008
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding of light emitting devices
- Patent number 7,259,033
- Issue date Aug 21, 2007
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency group III nitride-silicon carbide light emitting diode
- Patent number 7,259,402
- Issue date Aug 21, 2007
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding of light emitting devices and light emitting devi...
- Patent number 6,888,167
- Issue date May 3, 2005
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collets for bonding of light emitting diodes having shaped substrates
- Patent number 6,747,298
- Issue date Jun 8, 2004
- Cree, Inc.
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH EFFICIENCY GROUP III NITRIDE LED WITH LENTICULAR SURFACE
- Publication number 20140167089
- Publication date Jun 19, 2014
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN OHMIC CONTACTS FOR P-TYPE NITRIDE LIGHT EMITTING DEVICES
- Publication number 20120080688
- Publication date Apr 5, 2012
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY GROUP III NITRIDE LED WITH LENTICULAR SURFACE
- Publication number 20110284875
- Publication date Nov 24, 2011
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Efficiency Group III Nitride LED with Lenticular Surface
- Publication number 20090242918
- Publication date Oct 1, 2009
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Efficiency Group III Nitride LED with Lenticular Surface
- Publication number 20090166659
- Publication date Jul 2, 2009
- Cree, Inc.
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING
- Publication number 20070241360
- Publication date Oct 18, 2007
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOEL...
- Publication number 20070215194
- Publication date Sep 20, 2007
- Jayesh Bharathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High efficiency group III nitride LED with lenticular surface
- Publication number 20060060874
- Publication date Mar 23, 2006
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High efficiency group III nitride-silicon carbide light emitting diode
- Publication number 20060060877
- Publication date Mar 23, 2006
- John Adam Edmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin ohmic contacts for p-type nitride light emitting devices...
- Publication number 20060046328
- Publication date Mar 2, 2006
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip bonding of light emitting devices
- Publication number 20050017256
- Publication date Jan 27, 2005
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High powered light emitter packages with compact optics
- Publication number 20040227149
- Publication date Nov 18, 2004
- Cree, Inc.
- James Ibbetson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES
- Publication number 20040200882
- Publication date Oct 14, 2004
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Saturated phosphor solid state emitter
- Publication number 20040012027
- Publication date Jan 22, 2004
- CREE LIGHTING COMPANY
- Bernd Keller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding of light emitting diodes having shaped substrates and colle...
- Publication number 20030042507
- Publication date Mar 6, 2003
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip bonding of light emitting devices and light emitting devi...
- Publication number 20030045015
- Publication date Mar 6, 2003
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS

Jayesh Bharathan

Person

Patents Grantslast 30 patents

High powered light emitter packages with compact optics

High efficiency group III nitride LED with lenticular surface

Ultra-thin ohmic contacts for p-type nitride light emitting devices

High efficiency Group III nitride LED with lenticular surface

Ultra-thin ohmic contacts for p-type nitride light emitting devices

High efficiency group III nitride LED with lenticular surface

High efficiency group III nitride LED with lenticular surface

High efficiency group III nitride LED with lenticular surface

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Methods of forming thermoelectric devices using islands of thermoel...

Light emitting devices suitable for flip-chip bonding

Bonding of light emitting diodes having shaped substrates

Flip-chip bonding of light emitting devices

High efficiency group III nitride-silicon carbide light emitting diode

Flip-chip bonding of light emitting devices and light emitting devi...

Collets for bonding of light emitting diodes having shaped substrates

Patents Applicationslast 30 patents

HIGH EFFICIENCY GROUP III NITRIDE LED WITH LENTICULAR SURFACE

ULTRA-THIN OHMIC CONTACTS FOR P-TYPE NITRIDE LIGHT EMITTING DEVICES

HIGH EFFICIENCY GROUP III NITRIDE LED WITH LENTICULAR SURFACE

High Efficiency Group III Nitride LED with Lenticular Surface

High Efficiency Group III Nitride LED with Lenticular Surface

LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING

METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOEL...

High efficiency group III nitride LED with lenticular surface

High efficiency group III nitride-silicon carbide light emitting diode

Ultra-thin ohmic contacts for p-type nitride light emitting devices...

Flip-chip bonding of light emitting devices

High powered light emitter packages with compact optics

BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES

Saturated phosphor solid state emitter

Bonding of light emitting diodes having shaped substrates and colle...

Flip-chip bonding of light emitting devices and light emitting devi...