Jaynal Abedin Molla

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
- Patent number 11,749,639
- Issue date Sep 5, 2023
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
- Patent number 11,616,040
- Issue date Mar 28, 2023
- NXP USA, INC.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages containing peripherally-encapsulated dies...
- Patent number 11,128,268
- Issue date Sep 21, 2021
- NXP USA, INC.
- Sharan Kishore
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
- Patent number 10,923,451
- Issue date Feb 16, 2021
- NXP USA, INC.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer dicing for wafers with backside metallization and p...
- Patent number 10,741,446
- Issue date Aug 11, 2020
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 10,727,153
- Issue date Jul 28, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,529,638
- Issue date Jan 7, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,485,091
- Issue date Nov 19, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
- Patent number 10,431,449
- Issue date Oct 1, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,396,006
- Issue date Aug 27, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,303
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,302
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
- Patent number 10,141,182
- Issue date Nov 27, 2018
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with protruding conductive vias and methods o...
- Patent number 9,941,210
- Issue date Apr 10, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity packages and methods for the production thereof
- Patent number 9,922,894
- Issue date Mar 20, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 9,799,580
- Issue date Oct 24, 2017
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface for a semiconductor die and correspond...
- Patent number 9,698,116
- Issue date Jul 4, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder wettable flanges and devices and systems incorporating solde...
- Patent number 9,538,659
- Issue date Jan 3, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor devices and methods of their fabrication
- Patent number 9,099,567
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetoresistive device and method of packaging same
- Patent number 7,829,980
- Issue date Nov 9, 2010
- EVERSPIN TECHNOLOGIES, INC.
- Jaynal A. Molla
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods and apparatus for a dual-metal magnetic shield structure
- Patent number 7,598,596
- Issue date Oct 6, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Jaynal A. Molla
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of applying cladding material on conductive lines of MRAM de...
- Patent number 7,402,529
- Issue date Jul 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Jaynal A. Molla
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS THERMAL INTERFACE
- Publication number 20240213114
- Publication date Jun 27, 2024
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...
- Publication number 20230111320
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...
- Publication number 20210167033
- Publication date Jun 3, 2021
- NXP USA, Inc.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...
- Publication number 20210020595
- Publication date Jan 21, 2021
- NXP USA, Inc.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20200335420
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
- Publication number 20200335398
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...
- Publication number 20190148138
- Publication date May 16, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190109060
- Publication date Apr 11, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20190098743
- Publication date Mar 28, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190051571
- Publication date Feb 14, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043774
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043775
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...
- Publication number 20190013242
- Publication date Jan 10, 2019
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20180082915
- Publication date Mar 22, 2018
- Freescale Semiconductor Inc.
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20180012815
- Publication date Jan 11, 2018
- NXP USA, Inc.
- LI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
- Publication number 20170278763
- Publication date Sep 28, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Li LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20170263529
- Publication date Sep 14, 2017
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH ATTACHED DIE STRUCTURES AND METHODS OF FORM...
- Publication number 20160365323
- Publication date Dec 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20160126206
- Publication date May 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH SOLDERABLE DIE STRUCTURES AND METHODS OF FO...
- Publication number 20160099199
- Publication date Apr 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICO...
- Publication number 20150333031
- Publication date Nov 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION
- Publication number 20150146399
- Publication date May 28, 2015
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDE...
- Publication number 20150055310
- Publication date Feb 26, 2015
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETORESISTIVE DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20080266938
- Publication date Oct 30, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Jaynal A. Molla
- G11 - INFORMATION STORAGE
Information Patent Application
Methods and apparatus for a dual-metal magnetic shield structure
- Publication number 20080116535
- Publication date May 22, 2008
- Jaynal A. Molla
- G11 - INFORMATION STORAGE
Information Patent Application
Method of applying cladding material on conductive lines of MRAM de...
- Publication number 20050263400
- Publication date Dec 1, 2005
- Jaynal A. Molla
- G11 - INFORMATION STORAGE
Information Patent Application
Method for fabricating a flux concentrating system for use in a mag...
- Publication number 20050208681
- Publication date Sep 22, 2005
- Thomas V. Meixner
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FABRICATING A FLUX CONCENTRATING SYSTEM FOR USE IN A MAG...
- Publication number 20050164413
- Publication date Jul 28, 2005
- Thomas V. Meixner
- G11 - INFORMATION STORAGE

Jaynal Abedin Molla

Person

Patents Grantslast 30 patents

Thick-silver layer interface

Die-substrate assemblies having sinter-bonded backside via structur...

Semiconductor dies having ultra-thin wafer backmetal systems, micro...

Packaged dies with metal outer layers extending from die back sides...

Power amplifier packages containing peripherally-encapsulated dies...

Semiconductor dies having ultra-thin wafer backmetal systems, micro...

Microelectronic components having integrated heat dissipation posts...

Semiconductor device package and methods of manufacture thereof

Method of wafer dicing for wafers with backside metallization and p...

Thick-silver layer interface

Molded air cavity packages and methods for the production thereof

Microelectronic modules with sinter-bonded heat dissipation structu...

Microelectronic systems containing embedded heat dissipation struct...

Molded air cavity packages and methods for the production thereof

Microelectronic components having integrated heat dissipation posts...

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Microelectronic systems containing embedded heat dissipation struct...

Semiconductor devices with protruding conductive vias and methods o...

Air cavity packages and methods for the production thereof

Electronic devices with semiconductor die attached with sintered me...

Semiconductor device package and methods of manufacture thereof

Thick-silver layer interface for a semiconductor die and correspond...

Electronic devices with semiconductor die coupled to a thermally co...

Solder wettable flanges and devices and systems incorporating solde...

Semiconductor device with mechanical lock features between a semico...

Packaged semiconductor devices and methods of their fabrication

Magnetoresistive device and method of packaging same

Methods and apparatus for a dual-metal magnetic shield structure

Method of applying cladding material on conductive lines of MRAM de...

Patents Applicationslast 30 patents

THICK-SILVER LAYER INTERFACE

LOW-STRESS THERMAL INTERFACE

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...

SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...

THICK-SILVER LAYER INTERFACE

PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...

AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF

THICK-SILVER LAYER INTERFACE

ELECTRONIC DEVICES WITH ATTACHED DIE STRUCTURES AND METHODS OF FORM...

THICK-SILVER LAYER INTERFACE

ELECTRONIC DEVICES WITH SOLDERABLE DIE STRUCTURES AND METHODS OF FO...

SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICO...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION

SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDE...

MAGNETORESISTIVE DEVICE AND METHOD OF PACKAGING SAME

Methods and apparatus for a dual-metal magnetic shield structure

Method of applying cladding material on conductive lines of MRAM de...

Method for fabricating a flux concentrating system for use in a mag...

METHOD FOR FABRICATING A FLUX CONCENTRATING SYSTEM FOR USE IN A MAG...