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Jaynal Abedin Molla
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Thick-silver layer interface
Patent number
12,094,801
Issue date
Sep 17, 2024
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
Patent number
11,749,639
Issue date
Sep 5, 2023
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
Patent number
11,616,040
Issue date
Mar 28, 2023
NXP USA, INC.
Tianwei Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged dies with metal outer layers extending from die back sides...
Patent number
11,437,276
Issue date
Sep 6, 2022
NXP USA, INC.
Jaynal A Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier packages containing peripherally-encapsulated dies...
Patent number
11,128,268
Issue date
Sep 21, 2021
NXP USA, INC.
Sharan Kishore
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
Patent number
10,923,451
Issue date
Feb 16, 2021
NXP USA, INC.
Tianwei Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic components having integrated heat dissipation posts...
Patent number
10,861,764
Issue date
Dec 8, 2020
NXP USA, INC.
Lakshminarayan Viswanathan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device package and methods of manufacture thereof
Patent number
10,825,747
Issue date
Nov 3, 2020
NXP USA, INC.
Li Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of wafer dicing for wafers with backside metallization and p...
Patent number
10,741,446
Issue date
Aug 11, 2020
NXP USA, INC.
Jaynal A Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thick-silver layer interface
Patent number
10,727,153
Issue date
Jul 28, 2020
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded air cavity packages and methods for the production thereof
Patent number
10,529,638
Issue date
Jan 7, 2020
NXP USA, INC.
Audel Sanchez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
Patent number
10,485,091
Issue date
Nov 19, 2019
NXP USA, INC.
Jaynal A. Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
Patent number
10,431,449
Issue date
Oct 1, 2019
NXP USA, INC.
Jaynal A. Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded air cavity packages and methods for the production thereof
Patent number
10,396,006
Issue date
Aug 27, 2019
NXP USA, INC.
Audel Sanchez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic components having integrated heat dissipation posts...
Patent number
10,269,678
Issue date
Apr 23, 2019
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded air cavity packages and methods for the production thereof
Patent number
10,199,303
Issue date
Feb 5, 2019
NXP USA, INC.
Audel Sanchez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded air cavity packages and methods for the production thereof
Patent number
10,199,302
Issue date
Feb 5, 2019
NXP USA, INC.
Audel Sanchez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
Patent number
10,141,182
Issue date
Nov 27, 2018
NXP USA, INC.
Jaynal A. Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with protruding conductive vias and methods o...
Patent number
9,941,210
Issue date
Apr 10, 2018
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air cavity packages and methods for the production thereof
Patent number
9,922,894
Issue date
Mar 20, 2018
NXP USA, INC.
Lakshminarayan Viswanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic devices with semiconductor die attached with sintered me...
Patent number
9,875,987
Issue date
Jan 23, 2018
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and methods of manufacture thereof
Patent number
9,799,580
Issue date
Oct 24, 2017
NXP USA, INC.
Li Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thick-silver layer interface for a semiconductor die and correspond...
Patent number
9,698,116
Issue date
Jul 4, 2017
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
Patent number
9,589,860
Issue date
Mar 7, 2017
NXP USA, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder wettable flanges and devices and systems incorporating solde...
Patent number
9,538,659
Issue date
Jan 3, 2017
NXP USA, INC.
Lakshminarayan Viswanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with mechanical lock features between a semico...
Patent number
9,425,161
Issue date
Aug 23, 2016
FREESCALE SEMICONDUCTOR, INC.
Lakshminarayan Viswanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaged semiconductor devices and methods of their fabrication
Patent number
9,099,567
Issue date
Aug 4, 2015
FREESCALE SEMICONDUCTOR, INC.
Lakshminarayan Viswanathan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Magnetoresistive device and method of packaging same
Patent number
7,829,980
Issue date
Nov 9, 2010
EVERSPIN TECHNOLOGIES, INC.
Jaynal A. Molla
G11 - INFORMATION STORAGE
Information
Patent Grant
Methods and apparatus for a dual-metal magnetic shield structure
Patent number
7,598,596
Issue date
Oct 6, 2009
FREESCALE SEMICONDUCTOR, INC.
Jaynal A. Molla
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of applying cladding material on conductive lines of MRAM de...
Patent number
7,402,529
Issue date
Jul 22, 2008
FREESCALE SEMICONDUCTOR, INC.
Jaynal A. Molla
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
Information
Patent Application
LOW-STRESS THERMAL INTERFACE
Publication number
20240213114
Publication date
Jun 27, 2024
NXP USA, Inc.
Sharan Kishore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...
Publication number
20230111320
Publication date
Apr 13, 2023
NXP USA, Inc.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...
Publication number
20210167033
Publication date
Jun 3, 2021
NXP USA, Inc.
Tianwei Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...
Publication number
20210020595
Publication date
Jan 21, 2021
NXP USA, Inc.
Tianwei Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK-SILVER LAYER INTERFACE
Publication number
20200335420
Publication date
Oct 22, 2020
NXP USA, Inc.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
Publication number
20200335398
Publication date
Oct 22, 2020
NXP USA, Inc.
Jaynal A. Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
Publication number
20190206759
Publication date
Jul 4, 2019
NXP USA, Inc.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...
Publication number
20190148138
Publication date
May 16, 2019
NXP USA, Inc.
JAYNAL A. MOLLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Publication number
20190109060
Publication date
Apr 11, 2019
NXP USA, Inc.
AUDEL SANCHEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
Publication number
20190098743
Publication date
Mar 28, 2019
NXP USA, Inc.
JAYNAL A. MOLLA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Publication number
20190051571
Publication date
Feb 14, 2019
NXP USA, Inc.
AUDEL SANCHEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Publication number
20190043774
Publication date
Feb 7, 2019
NXP USA, Inc.
AUDEL SANCHEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Publication number
20190043775
Publication date
Feb 7, 2019
NXP USA, Inc.
AUDEL SANCHEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...
Publication number
20190013242
Publication date
Jan 10, 2019
NXP USA, Inc.
Jaynal A. Molla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
Publication number
20180082915
Publication date
Mar 22, 2018
Freescale Semiconductor Inc.
LAKSHMINARAYAN VISWANATHAN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
Publication number
20180012815
Publication date
Jan 11, 2018
NXP USA, Inc.
LI LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE THEREOF
Publication number
20170278763
Publication date
Sep 28, 2017
FREESCALE SEMICONDUCTOR, INC.
Li LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK-SILVER LAYER INTERFACE
Publication number
20170263529
Publication date
Sep 14, 2017
NXP USA, Inc.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES WITH ATTACHED DIE STRUCTURES AND METHODS OF FORM...
Publication number
20160365323
Publication date
Dec 15, 2016
FREESCALE SEMICONDUCTOR, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK-SILVER LAYER INTERFACE
Publication number
20160126206
Publication date
May 5, 2016
FREESCALE SEMICONDUCTOR, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES WITH SOLDERABLE DIE STRUCTURES AND METHODS OF FO...
Publication number
20160099199
Publication date
Apr 7, 2016
FREESCALE SEMICONDUCTOR, INC.
Lakshminarayan Viswanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH MECHANICAL LOCK FEATURES BETWEEN A SEMICO...
Publication number
20150333031
Publication date
Nov 19, 2015
FREESCALE SEMICONDUCTOR, INC.
LAKSHMINARAYAN VISWANATHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION
Publication number
20150146399
Publication date
May 28, 2015
LAKSHMINARAYAN VISWANATHAN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDE...
Publication number
20150055310
Publication date
Feb 26, 2015
LAKSHMINARAYAN VISWANATHAN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MAGNETORESISTIVE DEVICE AND METHOD OF PACKAGING SAME
Publication number
20080266938
Publication date
Oct 30, 2008
FREESCALE SEMICONDUCTOR, INC.
Jaynal A. Molla
G11 - INFORMATION STORAGE
Information
Patent Application
Methods and apparatus for a dual-metal magnetic shield structure
Publication number
20080116535
Publication date
May 22, 2008
Jaynal A. Molla
G11 - INFORMATION STORAGE
Information
Patent Application
Method of applying cladding material on conductive lines of MRAM de...
Publication number
20050263400
Publication date
Dec 1, 2005
Jaynal A. Molla
G11 - INFORMATION STORAGE
Information
Patent Application
Method for fabricating a flux concentrating system for use in a mag...
Publication number
20050208681
Publication date
Sep 22, 2005
Thomas V. Meixner
G11 - INFORMATION STORAGE
Information
Patent Application
METHOD FOR FABRICATING A FLUX CONCENTRATING SYSTEM FOR USE IN A MAG...
Publication number
20050164413
Publication date
Jul 28, 2005
Thomas V. Meixner
G11 - INFORMATION STORAGE
Information
Patent Application
Cladded conductor for use in a magnetoelectronics device and method...
Publication number
20050158992
Publication date
Jul 21, 2005
Mark A. Durlam
G11 - INFORMATION STORAGE