Jayne L. Mershon

Person

Corbett, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Connecting a component with an embedded optical fiber
- Patent number 7,630,601
- Issue date Dec 8, 2009
- Intel Corporation
- Jayne L. Mershon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting a component with an embedded optical fiber
- Patent number 7,373,068
- Issue date May 13, 2008
- Intel Corporation
- Jayne L. Mershon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for an embedded air dielectric for a package a...
- Patent number 7,361,842
- Issue date Apr 22, 2008
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for improving coupling across plane discontinu...
- Patent number 7,334,325
- Issue date Feb 26, 2008
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for improving coupling across plane discontinuities on ci...
- Patent number 7,282,647
- Issue date Oct 16, 2007
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical socket with compressible domed contacts
- Patent number 7,234,947
- Issue date Jun 26, 2007
- Intel Corporation
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical socket with compressible domed contacts
- Patent number 7,121,841
- Issue date Oct 17, 2006
- Intel Corporation
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing via intersect pad for electronic components
- Patent number 7,036,217
- Issue date May 2, 2006
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via intersect pad for electronic components and methods of manufacture
- Patent number 6,509,530
- Issue date Jan 21, 2003
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Connecting a component with an embedded optical fiber
- Publication number 20080159689
- Publication date Jul 3, 2008
- Jayne L. Mershon
- G02 - OPTICS
Information Patent Application
Built up printed circuit boards
- Publication number 20070037432
- Publication date Feb 15, 2007
- Jayne L. Mershon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING A COMPONENT WITH AN EMBEDDED OPTICAL FIBER
- Publication number 20070025667
- Publication date Feb 1, 2007
- Jayne L. Mershon
- G02 - OPTICS
Information Patent Application
Apparatus and method for an embedded air dielectric for a package a...
- Publication number 20070000687
- Publication date Jan 4, 2007
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical socket with compressible domed contacts
- Publication number 20060258184
- Publication date Nov 16, 2006
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical socket with compressible domed contacts
- Publication number 20060099835
- Publication date May 11, 2006
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming electrical connections and resulting devices
- Publication number 20050208749
- Publication date Sep 22, 2005
- Michael W. Beckman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and method for improving coupling across plane discontinu...
- Publication number 20050082088
- Publication date Apr 21, 2005
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting a component with an embedded optical fiber
- Publication number 20050063637
- Publication date Mar 24, 2005
- Jayne L. Mershon
- G02 - OPTICS
Information Patent Application
Optical fibers embedded in a printed circuit board
- Publication number 20050063638
- Publication date Mar 24, 2005
- William O. Alger
- G02 - OPTICS
Information Patent Application
Apparatus and method for improving coupling across plane discontinu...
- Publication number 20040118597
- Publication date Jun 24, 2004
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of manufacturing via intersect pad for electronic components
- Publication number 20030101585
- Publication date Jun 5, 2003
- Intel Corporation
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
VIA INTERSECT PAD FOR ELECTRONIC COMPONENTS AND METHODS OF MANUFACTURE
- Publication number 20020195269
- Publication date Dec 26, 2002
- Intel Corporation
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Jayne L. Mershon

Person

Patents Grantslast 30 patents

Connecting a component with an embedded optical fiber

Connecting a component with an embedded optical fiber

Apparatus and method for an embedded air dielectric for a package a...

Apparatus and method for improving coupling across plane discontinu...

Apparatus for improving coupling across plane discontinuities on ci...

Electrical socket with compressible domed contacts

Electrical socket with compressible domed contacts

Methods of manufacturing via intersect pad for electronic components

Via intersect pad for electronic components and methods of manufacture

Patents Applicationslast 30 patents

Connecting a component with an embedded optical fiber

Built up printed circuit boards

CONNECTING A COMPONENT WITH AN EMBEDDED OPTICAL FIBER

Apparatus and method for an embedded air dielectric for a package a...

Electrical socket with compressible domed contacts

Electrical socket with compressible domed contacts

Methods for forming electrical connections and resulting devices

Apparatus and method for improving coupling across plane discontinu...

Connecting a component with an embedded optical fiber

Optical fibers embedded in a printed circuit board

Apparatus and method for improving coupling across plane discontinu...

Methods of manufacturing via intersect pad for electronic components

VIA INTERSECT PAD FOR ELECTRONIC COMPONENTS AND METHODS OF MANUFACTURE