Je-Young Chang

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with enhanced vapor chamber for multichip...
- Patent number 12,046,536
- Issue date Jul 23, 2024
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device having shielding/containment extensions
- Patent number 12,048,123
- Issue date Jul 23, 2024
- Intel Corporation
- Aastha Uppal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,935,808
- Issue date Mar 19, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die with solderable thermal interface structures for assemblies...
- Patent number 11,923,267
- Issue date Mar 5, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package wrap-around heat spreader
- Patent number 11,854,932
- Issue date Dec 26, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate heat sink for bottom side cooling
- Patent number 11,830,783
- Issue date Nov 28, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid micro jet (DLMJ) structures for addressing thermal pe...
- Patent number 11,804,418
- Issue date Oct 31, 2023
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit assemblies having metal foam structures
- Patent number 11,721,607
- Issue date Aug 8, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric coolers combined with phase-change material in integ...
- Patent number 11,676,883
- Issue date Jun 13, 2023
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D buildup of thermally conductive layers to resolve die height dif...
- Patent number 11,670,561
- Issue date Jun 6, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change materials for electromagnetic interference shielding a...
- Patent number 11,664,294
- Issue date May 30, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular technique for die-level liquid cooling
- Patent number 11,508,645
- Issue date Nov 22, 2022
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff members for semiconductor package
- Patent number 11,469,185
- Issue date Oct 11, 2022
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal assemblies for multi-chip packages
- Patent number 11,456,232
- Issue date Sep 27, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-phase metallic alloys to facilitate thermal energy storage of a...
- Patent number 11,378,346
- Issue date Jul 5, 2022
- Intel Corporation
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Die back side structures for warpage control
- Patent number 11,322,456
- Issue date May 3, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation shield around a component on a substrate
- Patent number 11,081,450
- Issue date Aug 3, 2021
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management component
- Patent number 10,727,160
- Issue date Jul 28, 2020
- Intel Corporation
- Devdatta P. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for inspection of a package assembly with a thermal solution
- Patent number 10,600,699
- Issue date Mar 24, 2020
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING
Information Patent Grant
Heat management system
- Patent number 10,468,331
- Issue date Nov 5, 2019
- Intel Corporation
- Je-young Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of direct cooling of packaged devices and structures formed...
- Patent number 10,228,735
- Issue date Mar 12, 2019
- Intel Corporation
- Devdatta P. Kulkarni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation lid having direct liquid contact conduits
- Patent number 9,686,888
- Issue date Jun 20, 2017
- Intel Corporation
- David W. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enabling an aluminum heat exchanger with a working fluid
- Patent number 9,574,832
- Issue date Feb 21, 2017
- Intel Corporation
- Je-Young Chang
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20240136244
- Publication date Apr 25, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS
- Publication number 20240032248
- Publication date Jan 25, 2024
- Intel Corporation
- Sandeep AHUJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR REAL TIME, IN-SITU IMMERSION COOLANT CHARA...
- Publication number 20240008226
- Publication date Jan 4, 2024
- Intel Corporation
- Je-Young CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230253288
- Publication date Aug 10, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230125822
- Publication date Apr 27, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP
- Publication number 20230108843
- Publication date Apr 6, 2023
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED, CONFIGURABLE MICRO HEAT PUMP AND MICROCHANNELS
- Publication number 20230091720
- Publication date Mar 23, 2023
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20220201889
- Publication date Jun 23, 2022
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20210305120
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES...
- Publication number 20210305119
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20210305121
- Publication date Sep 30, 2021
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COOLING USING HEAT PIPE VAPOR CHAMBER STIFFENER AND IHS LEGS
- Publication number 20210259134
- Publication date Aug 19, 2021
- Intel Corporation
- Aastha UPPAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...
- Publication number 20210249326
- Publication date Aug 12, 2021
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES
- Publication number 20210233832
- Publication date Jul 29, 2021
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE HAVING SHIELDING/CONTAINMENT EXTENSIONS
- Publication number 20210235596
- Publication date Jul 29, 2021
- Intel Corporation
- Aastha Uppal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D BUILDUP OF THERMALLY CONDUCTIVE LAYERS TO RESOLVE DIE HEIGHT DIF...
- Publication number 20210193547
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WRAP-AROUND HEAT SPREADER
- Publication number 20210193549
- Publication date Jun 24, 2021
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL PACKAGE VAPOR CHAMBER WITH IHS
- Publication number 20210195798
- Publication date Jun 24, 2021
- Intel Corporation
- Nicholas NEAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A NOVEL MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING
- Publication number 20210183741
- Publication date Jun 17, 2021
- Intel Corporation
- Chandra M. JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK
- Publication number 20210118756
- Publication date Apr 22, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING
- Publication number 20210111091
- Publication date Apr 15, 2021
- Intel Corporation
- Aastha UPPAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL HEAT REMOVAL FOR 3D STACK THERMAL MANAGEMENT
- Publication number 20210104448
- Publication date Apr 8, 2021
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP...
- Publication number 20200350229
- Publication date Nov 5, 2020
- Intel Corporation
- Je-Young Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...
- Publication number 20200294884
- Publication date Sep 17, 2020
- Intel Corporation
- Javed Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
- Publication number 20200273772
- Publication date Aug 27, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200260609
- Publication date Aug 13, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...
- Publication number 20200243418
- Publication date Jul 30, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PE...
- Publication number 20200227341
- Publication date Jul 16, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...
- Publication number 20200219789
- Publication date Jul 9, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS

Je-Young Chang

Person

Patents Grantslast 30 patents

Immersion cooling for integrated circuit devices

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Integrated heat spreader with enhanced vapor chamber for multichip...

Heat dissipation device having shielding/containment extensions

IC die and heat spreaders with solderable thermal interface structu...

IC die and heat spreaders with solderable thermal interface structu...

IC die with solderable thermal interface structures for assemblies...

Cooling solution including microchannel arrays and methods of formi...

Package wrap-around heat spreader

Full package vapor chamber with IHS

Embedded substrate heat sink for bottom side cooling

Direct liquid micro jet (DLMJ) structures for addressing thermal pe...

Integrated circuit assemblies having metal foam structures

Thermoelectric coolers combined with phase-change material in integ...

3D buildup of thermally conductive layers to resolve die height dif...

Phase change materials for electromagnetic interference shielding a...

Coupled cooling fins in ultra-small systems

Modular technique for die-level liquid cooling

Multi-surface heat sink suitable for multi-chip packages

Standoff members for semiconductor package

Thermal assemblies for multi-chip packages

Two-phase metallic alloys to facilitate thermal energy storage of a...

Die back side structures for warpage control

Radiation shield around a component on a substrate

Thermal management component

Apparatus for inspection of a package assembly with a thermal solution

Heat management system

Methods of direct cooling of packaged devices and structures formed...

Heat dissipation lid having direct liquid contact conduits

Enabling an aluminum heat exchanger with a working fluid

Patents Applicationslast 30 patents

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS

METHOD AND APPARATUS FOR REAL TIME, IN-SITU IMMERSION COOLANT CHARA...

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

INTEGRATED, CONFIGURABLE, TRIANGULAR MICROCHANNEL HEAT PUMP

INTEGRATED, CONFIGURABLE MICRO HEAT PUMP AND MICROCHANNELS

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

IC DIE WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR ASSEMBLIES...

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

SUBSTRATE COOLING USING HEAT PIPE VAPOR CHAMBER STIFFENER AND IHS LEGS

HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...

INTEGRATED CIRCUIT ASSEMBLIES HAVING METAL FOAM STRUCTURES

HEAT DISSIPATION DEVICE HAVING SHIELDING/CONTAINMENT EXTENSIONS

3D BUILDUP OF THERMALLY CONDUCTIVE LAYERS TO RESOLVE DIE HEIGHT DIF...

PACKAGE WRAP-AROUND HEAT SPREADER

FULL PACKAGE VAPOR CHAMBER WITH IHS

A NOVEL MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING

HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK

EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING

LATERAL HEAT REMOVAL FOR 3D STACK THERMAL MANAGEMENT

INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP...

THERMOELECTRIC COOLERS COMBINED WITH PHASE-CHANGE MATERIAL IN INTEG...

COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES

COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...

DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PE...

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USIN...