Jean Wang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Preventing contamination in integrated circuit manufacturing lines
- Patent number 9,177,843
- Issue date Nov 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ming Sung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip on wafer bonder
- Patent number 9,093,447
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Clustering for prediction models in process control and for optimal...
- Patent number 9,037,279
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wafer's ambiance control
- Patent number 8,827,695
- Issue date Sep 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
PVD target with end of service life detection capability
- Patent number 8,795,486
- Issue date Aug 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Automatic virtual metrology for semiconductor wafer result prediction
- Patent number 8,682,466
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Grant
Near non-adaptive virtual metrology and chamber control
- Patent number 8,433,434
- Issue date Apr 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amy Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and system for controlling copper chemical mechanical polish...
- Patent number 8,409,993
- Issue date Apr 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on wafer bonder
- Patent number 8,387,674
- Issue date Mar 5, 2013
- Taiwan Semiconductor Manufacturing Comany, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
PVD target with end of service life detection capability
- Patent number 8,276,648
- Issue date Oct 2, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMP by controlling polish temperature
- Patent number 8,172,641
- Issue date May 8, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Che Ho
- B24 - GRINDING POLISHING
Information Patent Grant
Methodology to enable wafer result prediction of semiconductor wafe...
- Patent number 8,145,337
- Issue date Mar 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Grant
Polishing apparatus
- Patent number 8,133,097
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Liang Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for storing substrates
- Patent number 8,109,407
- Issue date Feb 7, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable anode assembly for a substrate wet processing apparatus
- Patent number 8,101,052
- Issue date Jan 24, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System for extraction of key process parameters from fault detectio...
- Patent number 7,974,728
- Issue date Jul 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,956,448
- Issue date Jun 7, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated etch and supercritical CO2 process and chamber design
- Patent number 7,951,723
- Issue date May 31, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
PVD target with end of service life detection capability
- Patent number 7,891,536
- Issue date Feb 22, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,879,711
- Issue date Feb 1, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System and method for enhanced control of copper trench sheet resis...
- Patent number 7,851,234
- Issue date Dec 14, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable electrodes and coils for plasma density distribution con...
- Patent number 7,829,815
- Issue date Nov 9, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Auto routing for optimal uniformity control
- Patent number 7,767,471
- Issue date Aug 3, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate carrier, port apparatus and facility interface and appara...
- Patent number 7,758,338
- Issue date Jul 20, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prediction of uniformity of a wafer
- Patent number 7,634,325
- Issue date Dec 15, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- G01 - MEASURING TESTING
Information Patent Grant
Method to implement stress free polishing
- Patent number 7,544,606
- Issue date Jun 9, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming dual damascenes with supercritical fluid treatments
- Patent number 7,332,449
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ON WAFER BONDER
- Publication number 20130157412
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY
- Publication number 20120131784
- Publication date May 31, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY
- Publication number 20110126397
- Publication date Jun 2, 2011
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Clustering for Prediction Models in Process Control and for Optimal...
- Publication number 20110060441
- Publication date Mar 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Application
Near Non-Adaptive Virtual Metrology and Chamber Control
- Publication number 20110009998
- Publication date Jan 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amy Wang
- G05 - CONTROLLING REGULATING
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20100327463
- Publication date Dec 30, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS
- Publication number 20100285723
- Publication date Nov 11, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Liang Lin
- B24 - GRINDING POLISHING
Information Patent Application
CMP by Controlling Polish Temperature
- Publication number 20100015894
- Publication date Jan 21, 2010
- Ming-Che Ho
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL WAFER'S AMBIANCE CONTROL
- Publication number 20090317214
- Publication date Dec 24, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ENHANCED CONTROL OF COPPER TRENCH SHEET RESIS...
- Publication number 20090142860
- Publication date Jun 4, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON WAFER BONDER
- Publication number 20090142903
- Publication date Jun 4, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auto Routing for Optimal Uniformity Control
- Publication number 20090035883
- Publication date Feb 5, 2009
- Jean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for controlling copper chemical mechanical polish...
- Publication number 20080305563
- Publication date Dec 11, 2008
- Francis Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing Contamination in Integrated Circuit Manufacturing Lines
- Publication number 20080304944
- Publication date Dec 11, 2008
- Chien-Ming Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER, PORT APPARATUS AND FACILITY INTERFACE AND APPARA...
- Publication number 20080298933
- Publication date Dec 4, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STORING SUBSTRATES
- Publication number 20080295412
- Publication date Dec 4, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRACTION OF KEY PROCESS PARAMETER
- Publication number 20080275585
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
METHODOLOGY TO ENABLE WAFER RESULT PREDICTION OF BATCH TOOLS
- Publication number 20080275676
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Lin
- G05 - CONTROLLING REGULATING
Information Patent Application
Novel Methodology To Realize Automatic Virtual Metrology
- Publication number 20080275586
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Francis Ko
- G05 - CONTROLLING REGULATING
Information Patent Application
PREDICTION OF UNIFORMITY OF A WAFER
- Publication number 20080275588
- Publication date Nov 6, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean Wang
- G01 - MEASURING TESTING
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20080124845
- Publication date May 29, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE ANODE ASSEMBLY FOR A SUBSTRATE WET PROCESSING APPARATUS
- Publication number 20080121526
- Publication date May 29, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Integrated Etch and Supercritical CO2 Process and Chamber Design
- Publication number 20080108223
- Publication date May 8, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ADJUSTABLE ELECTRODES AND COILS FOR PLASMA DENSITY DISTRIBUTION CON...
- Publication number 20080083710
- Publication date Apr 10, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Ying-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING CLOGGING OF REACTION CHAMBER EXHAUST LINES
- Publication number 20080047578
- Publication date Feb 28, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Feng Yoo
- B08 - CLEANING
Information Patent Application
Method for forming dual damascenes with supercritical fluid treatments
- Publication number 20070241455
- Publication date Oct 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas distribution apparatuses and methods for controlling gas distri...
- Publication number 20070163716
- Publication date Jul 19, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY
- Publication number 20070068804
- Publication date Mar 29, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF USING A TARGET HAVING END OF SERVICE LIFE DETECTION CAPAB...
- Publication number 20070068796
- Publication date Mar 29, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY
- Publication number 20070068803
- Publication date Mar 29, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Li Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Preventing contamination in integrated circuit manufacturing lines

Chip on wafer bonder

Clustering for prediction models in process control and for optimal...

Wafer's ambiance control

PVD target with end of service life detection capability

Automatic virtual metrology for semiconductor wafer result prediction

Near non-adaptive virtual metrology and chamber control

Method and system for controlling copper chemical mechanical polish...

Chip on wafer bonder

PVD target with end of service life detection capability

CMP by controlling polish temperature

Methodology to enable wafer result prediction of semiconductor wafe...

Polishing apparatus

Apparatus for storing substrates

Adjustable anode assembly for a substrate wet processing apparatus

System for extraction of key process parameters from fault detectio...

Stacked structures and methods of fabricating stacked structures

Integrated etch and supercritical CO2 process and chamber design

PVD target with end of service life detection capability

Stacked structures and methods of fabricating stacked structures

System and method for enhanced control of copper trench sheet resis...

Adjustable electrodes and coils for plasma density distribution con...

Auto routing for optimal uniformity control

Substrate carrier, port apparatus and facility interface and appara...

Prediction of uniformity of a wafer

Method to implement stress free polishing

Method for forming dual damascenes with supercritical fluid treatments

Patents Applicationslast 30 patents

CHIP ON WAFER BONDER

PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY

PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY

Clustering for Prediction Models in Process Control and for Optimal...

Near Non-Adaptive Virtual Metrology and Chamber Control

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

POLISHING APPARATUS

CMP by Controlling Polish Temperature

NOVEL WAFER'S AMBIANCE CONTROL

SYSTEM AND METHOD FOR ENHANCED CONTROL OF COPPER TRENCH SHEET RESIS...

CHIP ON WAFER BONDER

Auto Routing for Optimal Uniformity Control

Method and system for controlling copper chemical mechanical polish...

Preventing Contamination in Integrated Circuit Manufacturing Lines

SUBSTRATE CARRIER, PORT APPARATUS AND FACILITY INTERFACE AND APPARA...

APPARATUS FOR STORING SUBSTRATES

EXTRACTION OF KEY PROCESS PARAMETER

METHODOLOGY TO ENABLE WAFER RESULT PREDICTION OF BATCH TOOLS

Novel Methodology To Realize Automatic Virtual Metrology

PREDICTION OF UNIFORMITY OF A WAFER

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

ADJUSTABLE ANODE ASSEMBLY FOR A SUBSTRATE WET PROCESSING APPARATUS

Integrated Etch and Supercritical CO2 Process and Chamber Design

ADJUSTABLE ELECTRODES AND COILS FOR PLASMA DENSITY DISTRIBUTION CON...

METHOD FOR PREVENTING CLOGGING OF REACTION CHAMBER EXHAUST LINES

Method for forming dual damascenes with supercritical fluid treatments

Gas distribution apparatuses and methods for controlling gas distri...

PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY

METHOD OF USING A TARGET HAVING END OF SERVICE LIFE DETECTION CAPAB...

PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY