Jeanne L. LUCE

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fin end plug structures for advanced integrated circuit structure f...
- Patent number 11,961,838
- Issue date Apr 16, 2024
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin end plug structures for advanced integrated circuit structure f...
- Patent number 11,380,683
- Issue date Jul 5, 2022
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric for non-planar transistors
- Patent number 10,998,445
- Issue date May 4, 2021
- Intel Corporation
- Sameer S. Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin-end stress-inducing features
- Patent number 10,964,800
- Issue date Mar 30, 2021
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin end plug structures for advanced integrated circuit structure f...
- Patent number 10,861,850
- Issue date Dec 8, 2020
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gap-fill material deposition
- Patent number 10,811,251
- Issue date Oct 20, 2020
- Intel Corporation
- Jeanne L. Luce
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fin end plug structures for advanced integrated circuit structure f...
- Patent number 10,734,379
- Issue date Aug 4, 2020
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric for non-planar transistors
- Patent number 10,693,006
- Issue date Jun 23, 2020
- Intel Corporation
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for trench isolation using flowable dielectric materials
- Patent number 10,147,634
- Issue date Dec 4, 2018
- Intel Corporation
- Ritesh Jhaveri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric for non-planar transistors
- Patent number 10,056,488
- Issue date Aug 21, 2018
- Intel Corporation
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric for non-planar transistors
- Patent number 9,634,124
- Issue date Apr 25, 2017
- Intel Corporation
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for trench isolation using flowable dielectric materials
- Patent number 9,406,547
- Issue date Aug 2, 2016
- Intel Corporation
- Ritesh Jhaveri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric for non-planar transistors
- Patent number 9,087,915
- Issue date Jul 21, 2015
- Intel Corporation
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...
- Publication number 20240153947
- Publication date May 9, 2024
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...
- Publication number 20220262795
- Publication date Aug 18, 2022
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...
- Publication number 20210035972
- Publication date Feb 4, 2021
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...
- Publication number 20200321333
- Publication date Oct 8, 2020
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS
- Publication number 20200279950
- Publication date Sep 3, 2020
- Intel Corporation
- Sameer S. Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING FIN-END STRESS-INDUCING FEATURES
- Publication number 20200058761
- Publication date Feb 20, 2020
- Intel Corporation
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC GAP-FILL MATERIAL DEPOSITION
- Publication number 20190181003
- Publication date Jun 13, 2019
- Intel Corporation
- Jeanne L. LUCE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...
- Publication number 20190164961
- Publication date May 30, 2019
- Byron HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOWABLE DIELECTRICS FROM VAPOR PHASE PRECURSORS
- Publication number 20190035673
- Publication date Jan 31, 2019
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS
- Publication number 20190013406
- Publication date Jan 10, 2019
- Intel Corporation
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS
- Publication number 20170125596
- Publication date May 4, 2017
- Intel Corporation
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR TRENCH ISOLATION USING FLOWABLE DIELECTRIC MATERIALS
- Publication number 20160343609
- Publication date Nov 24, 2016
- Intel Corporation
- Ritesh JHAVERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS
- Publication number 20160020304
- Publication date Jan 21, 2016
- INTEL CORPORATON
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR TRENCH ISOLATION USING FLOWABLE DIELECTRIC MATERIALS
- Publication number 20150179501
- Publication date Jun 25, 2015
- Ritesh Jhaveri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS
- Publication number 20140117425
- Publication date May 1, 2014
- Sameer Pradhan
- H01 - BASIC ELECTRIC ELEMENTS

Jeanne L. LUCE

Person

Patents Grantslast 30 patents

Fin end plug structures for advanced integrated circuit structure f...

Fin end plug structures for advanced integrated circuit structure f...

Interlayer dielectric for non-planar transistors

Semiconductor device having fin-end stress-inducing features

Fin end plug structures for advanced integrated circuit structure f...

Dielectric gap-fill material deposition

Fin end plug structures for advanced integrated circuit structure f...

Interlayer dielectric for non-planar transistors

Techniques for trench isolation using flowable dielectric materials

Interlayer dielectric for non-planar transistors

Interlayer dielectric for non-planar transistors

Techniques for trench isolation using flowable dielectric materials

Interlayer dielectric for non-planar transistors

Patents Applicationslast 30 patents

FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...

FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...

FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...

FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...

INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS

SEMICONDUCTOR DEVICE HAVING FIN-END STRESS-INDUCING FEATURES

DIELECTRIC GAP-FILL MATERIAL DEPOSITION

FIN END PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE F...

FLOWABLE DIELECTRICS FROM VAPOR PHASE PRECURSORS

INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS

INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS

TECHNIQUES FOR TRENCH ISOLATION USING FLOWABLE DIELECTRIC MATERIALS

INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS

TECHNIQUES FOR TRENCH ISOLATION USING FLOWABLE DIELECTRIC MATERIALS

INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS