Jeannine M. Trewhella

Person

Peekskill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Crack stop with overlapping vias
- Patent number 10,153,232
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack-stop structure for an IC product and methods of making such a...
- Patent number 10,090,258
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Kevin Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing for overcoming extreme topography
- Patent number 9,263,292
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Inc.
- Guy M. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Processing for overcoming extreme topography
- Patent number 8,603,846
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Processing for overcoming extreme topography
- Patent number 7,915,064
- Issue date Mar 29, 2011
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level I/O test, repair and/or customization enabled by I/O layer
- Patent number 7,913,202
- Issue date Mar 22, 2011
- International Business Machines Corporation
- Kerry Bernstein
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...
- Patent number 7,883,277
- Issue date Feb 8, 2011
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Wafer level I/O test and repair enabled by I/O layer
- Patent number 7,521,950
- Issue date Apr 21, 2009
- International Business Machines Corporation
- Kerry Bernstein
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and methods for integrally packaging optoelectronic devic...
- Patent number 7,496,251
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Guy Moshe Cohen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...
- Patent number 7,474,815
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Apparatus and methods for integrally packaging optoelectronic devic...
- Patent number 7,336,863
- Issue date Feb 26, 2008
- International Business Machines Corporation
- Guy Moshe Cohen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical assembly with optoelectronic device alignment
- Patent number 7,308,167
- Issue date Dec 11, 2007
- Agilent Technologies, Inc.
- Gary R. Trott
- G02 - OPTICS
Information Patent Grant
Method and apparatus for a scalable parallel computer based on opti...
- Patent number 7,062,121
- Issue date Jun 13, 2006
- International Business Machines Corporation
- Blake G. Fitch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Via and via landing structures for smoothing transitions in multi-l...
- Patent number 6,992,255
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Modest Oprysko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for integrally packaging optoelectronic devic...
- Patent number 6,985,645
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Guy Moshe Cohen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical fiber space transformation
- Patent number 6,976,792
- Issue date Dec 20, 2005
- International Business Machines Corporation
- Mitchell S. Cohen
- G02 - OPTICS
Information Patent Grant
Impedance matched electrical interconnect using dielectric compounds
- Patent number 6,940,165
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Modest M. Oprysko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical subassembly for optical communications
- Patent number 6,873,799
- Issue date Mar 29, 2005
- JDS Uniphase Corporation
- Mitchell Simmons Cohen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Redundant configurable VCSEL laser array optical light source
- Patent number 6,821,026
- Issue date Nov 23, 2004
- International Business Machines Corporation
- William T. Devine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guides lithographically fabricated on semiconductor devices
- Patent number 6,798,953
- Issue date Sep 28, 2004
- International Business Machines Corporation
- Mitchell S. Cohen
- G02 - OPTICS
Information Patent Grant
Micro-structures and methods for their manufacture
- Patent number 6,713,827
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Guy Moshe Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-structures and methods for their manufacture
- Patent number 6,562,642
- Issue date May 13, 2003
- International Business Machines Corporation
- Guy Moshe Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitter control system
- Patent number 6,527,460
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Grant
Opto-electronic transceiver module and hermetically sealed housing...
- Patent number 6,502,999
- Issue date Jan 7, 2003
- JDS Uniphase Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Grant
Small form factor optoelectronic transceivers
- Patent number 6,302,596
- Issue date Oct 16, 2001
- International Business Machines Corporation
- Mitchell S. Cohen
- G02 - OPTICS
Information Patent Grant
Leadframe and leadframe assembly for parallel optical computer link
- Patent number 6,137,158
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Grant
Low-cost packaging for parallel optical computer link
- Patent number 5,781,682
- Issue date Jul 14, 1998
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Grant
Plastic optical subassemblies for light transfer between an optical...
- Patent number 5,631,991
- Issue date May 20, 1997
- International Business Machines Corporation
- Mitchell S. Cohen
- G02 - OPTICS
Information Patent Grant
Molded plastic optical fiber-optoelectronic converter subassembly
- Patent number 5,537,504
- Issue date Jul 16, 1996
- International Business Machines Corporation
- Michael F. Cina
- G02 - OPTICS
Information Patent Grant
Molded plastic optical fiber-optoelectronic converter subassembly
- Patent number 5,511,140
- Issue date Apr 23, 1996
- International Business Machines Corporation
- Michael F. Cina
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CRACK STOP WITH OVERLAPPING VIAS
- Publication number 20180315707
- Publication date Nov 1, 2018
- GLOBALFOUNDRIES INC.
- Robert J. Fox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY
- Publication number 20140141618
- Publication date May 22, 2014
- International Business Machines Corporation
- Guy M. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY
- Publication number 20110130005
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY
- Publication number 20090298292
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD OF VIA-STUB RESONANCE EXTINCTION
- Publication number 20090295498
- Publication date Dec 3, 2009
- Lei Shan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTERCONNECTING (MAPPING) A TWO-DIMENSIONAL OPTOELECTRONIC (OE) DEV...
- Publication number 20080205817
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL ARCHITECTURE FOR SELF-CHECKING AND SELF-REPAIRING...
- Publication number 20080165521
- Publication date Jul 10, 2008
- KERRY BERNSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level I/O Test, Repair and/or Customization Enabled by I/O layer
- Publication number 20080068039
- Publication date Mar 20, 2008
- Kerry Bernstein
- G11 - INFORMATION STORAGE
Information Patent Application
Apparatus and Methods for Integrally Packaging Optoelectronic Devic...
- Publication number 20080019633
- Publication date Jan 24, 2008
- Guy Moshe Cohen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...
- Publication number 20070217750
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Apparatus and methods for integrally packaging optoelectronic devic...
- Publication number 20070206908
- Publication date Sep 6, 2007
- Guy Moshe Cohen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus and method of via-stub resonance extinction
- Publication number 20070152771
- Publication date Jul 5, 2007
- Lei Shan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WAFER LEVEL I/O TEST AND REPAIR ENABLED BY I/O LAYER
- Publication number 20070081410
- Publication date Apr 12, 2007
- International Business Machines Corporation
- Kerry Bernstein
- G11 - INFORMATION STORAGE
Information Patent Application
Optical assembly with optoelectronic device alignment
- Publication number 20060045410
- Publication date Mar 2, 2006
- Gary R. Trott
- G02 - OPTICS
Information Patent Application
Processing for overcoming extreme topography
- Publication number 20060009038
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Guy A. Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and methods for integrally packaging optoelectronic devic...
- Publication number 20050063634
- Publication date Mar 24, 2005
- International Business Machiness Corporation
- Guy Moshe Cohen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Via and via landing structures for smoothing transitions in multi-l...
- Publication number 20050011674
- Publication date Jan 20, 2005
- Modest Oprysko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for a scalable parallel computer based on opti...
- Publication number 20040096147
- Publication date May 20, 2004
- International Business Machines Corporation
- Blake G. Fitch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Impedance-Matched electrical interconnect
- Publication number 20040046235
- Publication date Mar 11, 2004
- International Business Machines Corporation
- Modest M. Oprysko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redundant configurable VCSEL laser array optical light source
- Publication number 20040042737
- Publication date Mar 4, 2004
- International Business Machines Corporation
- William T. Devine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-structures and methods for their manufacture
- Publication number 20030148548
- Publication date Aug 7, 2003
- International Business Machines Corporation
- Guy Moshe Cohen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTER CONTROL SYSTEM
- Publication number 20030002826
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Application
Optical subassembly for optical communications
- Publication number 20020196500
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS

Jeannine M. Trewhella

Person

Patents Grantslast 30 patents

Crack stop with overlapping vias

Crack-stop structure for an IC product and methods of making such a...

Processing for overcoming extreme topography

Processing for overcoming extreme topography

Processing for overcoming extreme topography

Wafer level I/O test, repair and/or customization enabled by I/O layer

Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...

Wafer level I/O test and repair enabled by I/O layer

Apparatus and methods for integrally packaging optoelectronic devic...

Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...

Apparatus and methods for integrally packaging optoelectronic devic...

Optical assembly with optoelectronic device alignment

Method and apparatus for a scalable parallel computer based on opti...

Via and via landing structures for smoothing transitions in multi-l...

Apparatus and methods for integrally packaging optoelectronic devic...

Optical fiber space transformation

Impedance matched electrical interconnect using dielectric compounds

Optical subassembly for optical communications

Redundant configurable VCSEL laser array optical light source

Guides lithographically fabricated on semiconductor devices

Micro-structures and methods for their manufacture

Micro-structures and methods for their manufacture

Light emitter control system

Opto-electronic transceiver module and hermetically sealed housing...

Small form factor optoelectronic transceivers

Leadframe and leadframe assembly for parallel optical computer link

Low-cost packaging for parallel optical computer link

Plastic optical subassemblies for light transfer between an optical...

Molded plastic optical fiber-optoelectronic converter subassembly

Molded plastic optical fiber-optoelectronic converter subassembly

Patents Applicationslast 30 patents

CRACK STOP WITH OVERLAPPING VIAS

PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

APPARATUS AND METHOD OF VIA-STUB RESONANCE EXTINCTION

INTERCONNECTING (MAPPING) A TWO-DIMENSIONAL OPTOELECTRONIC (OE) DEV...

THREE-DIMENSIONAL ARCHITECTURE FOR SELF-CHECKING AND SELF-REPAIRING...

Wafer Level I/O Test, Repair and/or Customization Enabled by I/O layer

Apparatus and Methods for Integrally Packaging Optoelectronic Devic...

Interconnecting (mapping) a two-dimensional optoelectronic (OE) dev...

Apparatus and methods for integrally packaging optoelectronic devic...

Apparatus and method of via-stub resonance extinction

WAFER LEVEL I/O TEST AND REPAIR ENABLED BY I/O LAYER

Optical assembly with optoelectronic device alignment

Processing for overcoming extreme topography

Apparatus and methods for integrally packaging optoelectronic devic...

Via and via landing structures for smoothing transitions in multi-l...

Method and apparatus for a scalable parallel computer based on opti...

Impedance-Matched electrical interconnect

Redundant configurable VCSEL laser array optical light source

Micro-structures and methods for their manufacture

LIGHT EMITTER CONTROL SYSTEM

Optical subassembly for optical communications