Jee Soo MOK

Person

Suwon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with dam around cavity and manufacturing meth...
- Patent number 10,306,778
- Issue date May 28, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae-Ean Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, package and method of manufacturing the same
- Patent number 10,045,444
- Issue date Aug 7, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae-Ean Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded electronic component and manufa...
- Patent number 9,999,131
- Issue date Jun 12, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung-Hwan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,848,492
- Issue date Dec 19, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae-Ean Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die mounting substrate and method of fabricating the same
- Patent number 8,633,396
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Eung Suek Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,592,135
- Issue date Nov 26, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Printed circuit board using bump and method for manufacturing thereof
- Patent number 8,549,744
- Issue date Oct 8, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing cooling fin and package substrate with cool...
- Patent number 8,377,748
- Issue date Feb 19, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Eung Suek Lee
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Conductive paste, printed circuit board, and manufacturing method t...
- Patent number 8,298,447
- Issue date Oct 30, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ki-Hwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 8,222,534
- Issue date Jul 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jun-Heyoung Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,220,149
- Issue date Jul 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,198,550
- Issue date Jun 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,166,647
- Issue date May 1, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jun-Oh Hwang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of fabricating a printed circuit board
- Patent number 8,161,634
- Issue date Apr 24, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing printed circuit board
- Patent number 8,151,446
- Issue date Apr 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 8,058,558
- Issue date Nov 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board using paste bump and manufacturing method the...
- Patent number 7,973,248
- Issue date Jul 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing package on package with cavity
- Patent number 7,901,985
- Issue date Mar 8, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board using paste bumps
- Patent number 7,859,106
- Issue date Dec 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating paste bump for printed circuit board
- Patent number 7,841,074
- Issue date Nov 30, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for printed circuit board
- Patent number 7,836,590
- Issue date Nov 23, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board having embedded comp...
- Patent number 7,653,991
- Issue date Feb 2, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating core substrate using paste bumps
- Patent number 7,622,329
- Issue date Nov 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless substrate and manufacturing thereof
- Patent number 7,605,459
- Issue date Oct 20, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder resist pattern
- Patent number 7,435,352
- Issue date Oct 14, 2008
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel multi-layer printed circuit board having improved intercon...
- Patent number 7,279,412
- Issue date Oct 9, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing package substrate with fine circuit pattern...
- Patent number 7,169,707
- Issue date Jan 30, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Duck Young Maeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160381792
- Publication date Dec 29, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160374196
- Publication date Dec 22, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Ean LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160374197
- Publication date Dec 22, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Ean LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160242277
- Publication date Aug 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Ean LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFA...
- Publication number 20160219712
- Publication date Jul 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyung-Hwan Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160205780
- Publication date Jul 14, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Ean Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160081191
- Publication date Mar 17, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160037645
- Publication date Feb 4, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ean LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140185254
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo MOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20140106510
- Publication date Apr 17, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Suek LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20120266463
- Publication date Oct 25, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Bo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120255769
- Publication date Oct 11, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Bum Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20120222299
- Publication date Sep 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120175162
- Publication date Jul 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20120168205
- Publication date Jul 5, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun-Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20120148960
- Publication date Jun 14, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20120111611
- Publication date May 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120080401
- Publication date Apr 5, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120055706
- Publication date Mar 8, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jee Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20120030938
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120018195
- Publication date Jan 26, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120012379
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayered printed circuit board
- Publication number 20120005894
- Publication date Jan 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing cooling fin and package substrate with cool...
- Publication number 20110308069
- Publication date Dec 22, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Eung Suek LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20110120758
- Publication date May 26, 2011
- Eung Suek Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRIS...
- Publication number 20110114380
- Publication date May 19, 2011
- Jee Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive paste and method of manufacturing printed circuit board...
- Publication number 20110073252
- Publication date Mar 31, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100230146
- Publication date Sep 16, 2010
- Eung Suek LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20100175915
- Publication date Jul 15, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core substrate and multilayer printed circuit board using paste bumps
- Publication number 20100025092
- Publication date Feb 4, 2010
- Samsung Electro Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jee Soo MOK

Person

Patents Grantslast 30 patents

Printed circuit board with dam around cavity and manufacturing meth...

Printed circuit board, package and method of manufacturing the same

Printed circuit board with embedded electronic component and manufa...

Printed circuit board and method of manufacturing the same

Die mounting substrate and method of fabricating the same

Method of manufacturing printed circuit board

Printed circuit board using bump and method for manufacturing thereof

Method of manufacturing cooling fin and package substrate with cool...

Conductive paste, printed circuit board, and manufacturing method t...

Printed circuit board and manufacturing method thereof

Method of manufacturing a printed circuit board

Printed circuit board and method of manufacturing the same

Method of manufacturing a printed circuit board

Method of fabricating a printed circuit board

Apparatus for manufacturing printed circuit board

Printed circuit board and manufacturing method thereof

Printed circuit board using paste bump and manufacturing method the...

Method for manufacturing package on package with cavity

Multilayer printed circuit board using paste bumps

Method of fabricating paste bump for printed circuit board

Manufacturing method for printed circuit board

Method for manufacturing printed circuit board having embedded comp...

Method for fabricating core substrate using paste bumps

Coreless substrate and manufacturing thereof

Method of forming solder resist pattern

Parallel multi-layer printed circuit board having improved intercon...

Method of manufacturing package substrate with fine circuit pattern...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFA...

PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Printed circuit board and method of manufacturing the same

METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing printed circuit board

Printed circuit board

Printed circuit board

Method of manufacturing multilayered printed circuit board

Method of manufacturing cooling fin and package substrate with cool...

DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRIS...

Conductive paste and method of manufacturing printed circuit board...

CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME

Printed circuit board and method of manufacturing the same

Core substrate and multilayer printed circuit board using paste bumps