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Jeff Reeder
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Transfer mold semiconductor packaging processes
Patent number
7,384,805
Issue date
Jun 10, 2008
Micron Technology, Inc.
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer mold semiconductor packaging processes
Patent number
7,148,083
Issue date
Dec 12, 2006
Micron Technology, Inc.
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit substrates, semiconductor packages, and ball grid arrays
Patent number
7,095,115
Issue date
Aug 22, 2006
Micron Technology, Inc.
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Transfer mold semiconductor packaging processes, circuit substrates...
Publication number
20050101061
Publication date
May 12, 2005
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit substrates, semiconductor packages, and ball grid arrays
Publication number
20040097011
Publication date
May 20, 2004
Micron Technology, Inc.
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT SUBSTRATES, SEMICONDUCTOR PACKAGES, AND BALL GRID ARRAYS
Publication number
20030205828
Publication date
Nov 6, 2003
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transfer mold semiconductor packaging processes
Publication number
20030104657
Publication date
Jun 5, 2003
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transfer mold semiconductor packaging processes, circuit substrates...
Publication number
20020145208
Publication date
Oct 10, 2002
Larry Kinsman
H01 - BASIC ELECTRIC ELEMENTS