Jeffrey A. Zitz

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Rotating lid for module cooler
- Patent number 12,028,997
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary removable module lid
- Patent number 11,800,666
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid TIMs for electronic package cooling
- Patent number 11,264,306
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal integrated circuit (IC) device package lid
- Patent number 11,158,562
- Issue date Oct 26, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Coolant-cooled heat sinks with internal thermally-conductive fins j...
- Patent number 11,156,409
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi integrated circuit chip carrier package
- Patent number 10,978,314
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,905,029
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating coolant-cooled heat sinks with internal thermally-condu...
- Patent number 10,842,043
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,757,833
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,593,564
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,542,636
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi integrated circuit chip carrier package
- Patent number 10,541,156
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with stiffening frame and orthogonal heat spreader
- Patent number 10,424,494
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test cell for laminate and method
- Patent number 10,381,276
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,332,813
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test cell for laminate and method
- Patent number 10,249,548
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling structure for electronic boards
- Patent number 10,172,258
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating a chip module with stiffening frame and direc...
- Patent number 10,090,173
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,083,886
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,049,896
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 9,947,603
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic boards
- Patent number 9,721,870
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Paul F. Bodenweber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing directional stress in an orthotropic encapsulation member...
- Patent number 9,583,408
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer with high thermal conductivity
- Patent number 9,437,515
- Issue date Sep 6, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Determining magnitude of compressive loading
- Patent number 9,366,591
- Issue date Jun 14, 2016
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Grant
Heatsink attachment module
- Patent number 9,153,460
- Issue date Oct 6, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-hermetic sealed multi-chip module package
- Patent number 9,105,500
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Paul F. Bodenweber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 9,087,834
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLD PLATE PLACEMENT AND RETRACTION APPARATUS WITH PREDEFINED TRAVE...
- Publication number 20240155796
- Publication date May 9, 2024
- International Business Machines Corporation
- Madhana Sunder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTATING LID FOR MODULE COOLER
- Publication number 20220418134
- Publication date Dec 29, 2022
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY REMOVABLE MODULE LID
- Publication number 20220418129
- Publication date Dec 29, 2022
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FATIGUE FAILURE RESISTANT ELETRONIC PACKAGE
- Publication number 20220157685
- Publication date May 19, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Integrated Circuit (IC) Device Package Lid
- Publication number 20210249333
- Publication date Aug 12, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...
- Publication number 20210222956
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING
- Publication number 20210098334
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi Integrated Circuit Chip Carrier Package
- Publication number 20200135495
- Publication date Apr 30, 2020
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20200068744
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Paul F. BODENWEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20190335617
- Publication date Oct 31, 2019
- International Business Machines Corporation
- Paul F. BODENWEBER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20180338390
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Paul F. BODENWEBER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180277396
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180233381
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20180076101
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180068916
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180068917
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061732
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061733
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20170196119
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Paul F. BODENWEBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20170178982
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20170170030
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20170170086
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER...
- Publication number 20170053845
- Publication date Feb 23, 2017
- International Business Machines Corporation
- Marcus E. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20160358836
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20160165755
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Paul F. BODENWEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150373879
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371922
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371917
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371918
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371919
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey A. Zitz

Person

Patents Grantslast 30 patents

Rotating lid for module cooler

Temporary removable module lid

Hybrid TIMs for electronic package cooling

Conformal integrated circuit (IC) device package lid

Coolant-cooled heat sinks with internal thermally-conductive fins j...

Multi integrated circuit chip carrier package

Cooling structure for electronic boards

Fabricating an integrated circuit chip module with stiffening frame...

Fabricating coolant-cooled heat sinks with internal thermally-condu...

Cooling structure for electronic boards

Lid attach optimization to limit electronic package warpage

Method of fabricating a chip module with stiffening frame and ortho...

Cooling structure for electronic boards

Multi integrated circuit chip carrier package

Chip module with stiffening frame and orthogonal heat spreader

Test cell for laminate and method

Lid attach optimization to limit electronic package warpage

Test cell for laminate and method

Cooling structure for electronic boards

Method of fabricating a chip module with stiffening frame and direc...

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Cooling structure for electronic boards

Reducing directional stress in an orthotropic encapsulation member...

Heat spreading layer with high thermal conductivity

Determining magnitude of compressive loading

Heatsink attachment module

Non-hermetic sealed multi-chip module package

Multichip electronic packages and methods of manufacture

Patents Applicationslast 30 patents

COLD PLATE PLACEMENT AND RETRACTION APPARATUS WITH PREDEFINED TRAVE...

ROTATING LID FOR MODULE COOLER

TEMPORARY REMOVABLE MODULE LID

FATIGUE FAILURE RESISTANT ELETRONIC PACKAGE

Conformal Integrated Circuit (IC) Device Package Lid

COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...

HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING

Multi Integrated Circuit Chip Carrier Package

COOLING STRUCTURE FOR ELECTRONIC BOARDS

COOLING STRUCTURE FOR ELECTRONIC BOARDS

COOLING STRUCTURE FOR ELECTRONIC BOARDS

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

TEST CELL FOR LAMINATE AND METHOD

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

COOLING STRUCTURE FOR ELECTRONIC BOARDS

TEST CELL FOR LAMINATE AND METHOD

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER...

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

COOLING STRUCTURE FOR ELECTRONIC BOARDS

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY