Jeffrey Hartman

Person

Severn, MD, US

People

Patents Grantslast 30 patents

Information Patent Grant
Superconducting bump bond electrical characterization
- Patent number 11,616,187
- Issue date Mar 28, 2023
- Northrop Grumman Systems Corporation
- Aurelius L. Graninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bond electrical characterization
- Patent number 10,950,778
- Issue date Mar 16, 2021
- Northrop Grumman Systems Corporation
- Aurelius L. Graninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a flexible connector
- Patent number 10,681,812
- Issue date Jun 9, 2020
- Northrop Grumman Systems Corporation
- Jeffrey David Hartman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming superconducting structures
- Patent number 10,651,233
- Issue date May 12, 2020
- Northrop Grumman Systems Corporation
- Jeffrey David Hartman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage controlled tunable filter
- Patent number 10,340,568
- Issue date Jul 2, 2019
- Northrop Grumman Systems Corporation
- Matthew S. Torpey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage controlled tunable filter
- Patent number 10,027,005
- Issue date Jul 17, 2018
- Northrop Grumman Systems Corporation
- Matthew S. Torpey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled circuit board connector
- Patent number 9,780,465
- Issue date Oct 3, 2017
- Northrop Grumman Systems Corporation
- Jeffrey David Hartman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superlattice crenelated gate field effect transistor
- Patent number 9,202,906
- Issue date Dec 1, 2015
- Northrop Grumman Systems Corporation
- Robert S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing metallic nanotubes without transf...
- Patent number 8,836,033
- Issue date Sep 16, 2014
- Northrop Grumman Systems Corporation
- Silai Krishnaswamy
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for integrating silicon CMOS and AlGaN/GaN wideband amplifie...
- Patent number 7,420,226
- Issue date Sep 2, 2008
- Northrop Grumman Corporation
- Godfrey Augustine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thinning a semiconductor structure
- Patent number 7,253,083
- Issue date Aug 7, 2007
- Northrop Grumman Corporation
- Rowland C. Clarke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON FLEXIBLE CONNECTORS
- Publication number 20240204435
- Publication date Jun 20, 2024
- Northrop Grumman Systems Corporation
- EDWARD R. ENGBRECHT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING
- Publication number 20230369270
- Publication date Nov 16, 2023
- Northrop Grumman Systems Corporation
- JUSTIN C. HACKLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION
- Publication number 20210257532
- Publication date Aug 19, 2021
- Northrop Grumman Systems Corporation
- AURELIUS L. GRANINGER
- G01 - MEASURING TESTING
Information Patent Application
SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION
- Publication number 20200220064
- Publication date Jul 9, 2020
- Northrop Grumman Systems Corporation
- AURELIUS L. GRANINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SUPERCONDUCTING STRUCTURES
- Publication number 20200066789
- Publication date Feb 27, 2020
- Northrop Grumman Systems Corporation
- JEFFREY DAVID HARTMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CONNECTOR
- Publication number 20190313530
- Publication date Oct 10, 2019
- Northrop Grumman Systems Corporation
- JEFFREY DAVID HARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE CONTROLLED TUNABLE FILTER
- Publication number 20180301780
- Publication date Oct 18, 2018
- Northrop Grumman Systems Corporation
- Matthew S. TORPEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CONNECTOR
- Publication number 20180168042
- Publication date Jun 14, 2018
- Northrop Grumman Systems Corporation
- JEFFREY DAVID HARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE CONTROLLED TUNABLE FILTER
- Publication number 20170222292
- Publication date Aug 3, 2017
- Northrop Grumman Systems Corporation
- Matthew S. TORPEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERLATTICE CRENELATED GATE FIELD EFFECT TRANSISTOR
- Publication number 20140264273
- Publication date Sep 18, 2014
- Northrop Grumman Systems Corporation
- Robert S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transplanted epitaxial regrowth for fabricating large area substrat...
- Publication number 20080157090
- Publication date Jul 3, 2008
- Darren Brent Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method for integrating silicon CMOS and AlGaN/GaN wideband am...
- Publication number 20060284247
- Publication date Dec 21, 2006
- Godfrey Augustine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel thinning process for 3 - dimensional integration via wafer bo...
- Publication number 20060286767
- Publication date Dec 21, 2006
- Rowland C. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered substrate obtained via wafer bonding for power applica...
- Publication number 20060284167
- Publication date Dec 21, 2006
- Godfrey Augustine
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey Hartman

Person

Patents Grantslast 30 patents

Superconducting bump bond electrical characterization

Superconducting bump bond electrical characterization

Method of providing a flexible connector

Method for forming superconducting structures

Voltage controlled tunable filter

Voltage controlled tunable filter

Angled circuit board connector

Superlattice crenelated gate field effect transistor

Method and apparatus for removing metallic nanotubes without transf...

Method for integrating silicon CMOS and AlGaN/GaN wideband amplifie...

Method of thinning a semiconductor structure

Patents Applicationslast 30 patents

SILICON FLEXIBLE CONNECTORS

BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING

SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION

SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION

METHOD FOR FORMING SUPERCONDUCTING STRUCTURES

FLEXIBLE CONNECTOR

VOLTAGE CONTROLLED TUNABLE FILTER

FLEXIBLE CONNECTOR

VOLTAGE CONTROLLED TUNABLE FILTER

SUPERLATTICE CRENELATED GATE FIELD EFFECT TRANSISTOR

Transplanted epitaxial regrowth for fabricating large area substrat...

Novel method for integrating silicon CMOS and AlGaN/GaN wideband am...

Novel thinning process for 3 - dimensional integration via wafer bo...

Multilayered substrate obtained via wafer bonding for power applica...