Jeffrey Marks

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma etching chemistries of high aspect ratio features in dielect...
- Patent number 12,119,243
- Issue date Oct 15, 2024
- Lam Research Corporation
- Keren J. Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist development with halide chemistries
- Patent number 12,105,422
- Issue date Oct 1, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Plasma etching chemistries of high aspect ratio features in dielect...
- Patent number 11,594,429
- Issue date Feb 28, 2023
- Lam Research Corporation
- Keren J. Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum-integrated hardmask processes and apparatus
- Patent number 11,209,729
- Issue date Dec 28, 2021
- Lam Research Corporation
- Jeffrey Marks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum-integrated hardmask processes and apparatus
- Patent number 10,831,096
- Issue date Nov 10, 2020
- Lam Research Corporation
- Jeffrey Marks
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Directional deposition on patterned structures
- Patent number 10,825,680
- Issue date Nov 3, 2020
- Lam Research Corporation
- Alexander Kabansky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 10,749,103
- Issue date Aug 18, 2020
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum-integrated hardmask processes and apparatus
- Patent number 10,514,598
- Issue date Dec 24, 2019
- Lam Research Corporation
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 10,515,816
- Issue date Dec 24, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 10,374,144
- Issue date Aug 6, 2019
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ale smoothness: in and outside semiconductor industry
- Patent number 10,304,659
- Issue date May 28, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 10,186,426
- Issue date Jan 22, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten and other metals
- Patent number 10,096,487
- Issue date Oct 9, 2018
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of GaN and other III-V materials
- Patent number 10,056,264
- Issue date Aug 21, 2018
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALE smoothness: in and outside semiconductor industry
- Patent number 9,984,858
- Issue date May 29, 2018
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry plasma etch method to pattern MRAM stack
- Patent number 9,806,252
- Issue date Oct 31, 2017
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 9,805,941
- Issue date Oct 31, 2017
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum-integrated hardmask processes and apparatus
- Patent number 9,778,561
- Issue date Oct 3, 2017
- Lam Research Corporation
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrating atomic scale processes: ALD (atomic layer deposition) a...
- Patent number 9,576,811
- Issue date Feb 21, 2017
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,391,267
- Issue date Jul 12, 2016
- Lam Research Corporation
- Meihua Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,257,638
- Issue date Feb 9, 2016
- Lam Research Corporation
- Samantha S.H. Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD based metal/semiconductor OHMIC contact for high volume manufac...
- Patent number 9,153,486
- Issue date Oct 6, 2015
- Lam Research Corporation
- Reza Arghavani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,130,158
- Issue date Sep 8, 2015
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction
- Patent number 7,429,533
- Issue date Sep 30, 2008
- Lam Research Corporation
- Zhisong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple frequency plasma processor method and apparatus
- Patent number 7,405,521
- Issue date Jul 29, 2008
- Lam Research Corporation
- Raj Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of feature critical dimensions using multiple masks
- Patent number 7,271,107
- Issue date Sep 18, 2007
- Lam Research Corporation
- Jeffrey Marks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting endpoint during plasma etching o...
- Patent number 6,908,846
- Issue date Jun 21, 2005
- Lam Research Corporation
- Brian K. McMillin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor using inductive RF coupling, and processes
- Patent number 6,545,420
- Issue date Apr 8, 2003
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor using inductive RF coupling, and processes
- Patent number 6,518,195
- Issue date Feb 11, 2003
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Magnetic confinement in a plasma reactor having an RF bias electrode
- Patent number 6,488,807
- Issue date Dec 3, 2002
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240258127
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240258128
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240203759
- Publication date Jun 20, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240203760
- Publication date Jun 20, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20240178014
- Publication date May 30, 2024
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20230273516
- Publication date Aug 31, 2023
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20230266662
- Publication date Aug 24, 2023
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20230187234
- Publication date Jun 15, 2023
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOASSAY SUBSTRATE HAVING FIDUCIAL DOMAINS AND METHODS OF MANUFACTU...
- Publication number 20230149931
- Publication date May 18, 2023
- NANOSTRING TECHNOLOGIES, INC.
- Camelia RUSU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20220244645
- Publication date Aug 4, 2022
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20220075260
- Publication date Mar 10, 2022
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...
- Publication number 20210005472
- Publication date Jan 7, 2021
- LAM RESEARCH CORPORATION
- Keren J. KANARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20200161139
- Publication date May 21, 2020
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20200089104
- Publication date Mar 19, 2020
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20190312194
- Publication date Oct 10, 2019
- LAM RESEARCH CORPORATION
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20190139778
- Publication date May 9, 2019
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20190094685
- Publication date Mar 28, 2019
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY
- Publication number 20180233325
- Publication date Aug 16, 2018
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTIONAL DEPOSITION ON PATTERNED STRUCTURES
- Publication number 20180233357
- Publication date Aug 16, 2018
- LAM RESEARCH CORPORATION
- Alexander Kabansky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20180033635
- Publication date Feb 1, 2018
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20180019387
- Publication date Jan 18, 2018
- LAM RESEARCH CORPORATION
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20180004083
- Publication date Jan 4, 2018
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIRECTIONAL DEPOSITION ON PATTERNED STRUCTURES
- Publication number 20170178899
- Publication date Jun 22, 2017
- LAM RESEARCH CORPORATION
- Alexander Kabansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20170117159
- Publication date Apr 27, 2017
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY
- Publication number 20170069462
- Publication date Mar 9, 2017
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS
- Publication number 20170053810
- Publication date Feb 23, 2017
- LAM RESEARCH CORPORATION
- Wenbing Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS
- Publication number 20160358782
- Publication date Dec 8, 2016
- LAM RESEARCH CORPORATION
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK
- Publication number 20160308112
- Publication date Oct 20, 2016
- LAM RESEARCH CORPORATION
- Samantha Tan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...
- Publication number 20160203995
- Publication date Jul 14, 2016
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ETCH NON-VOLATILE METAL MATERIALS
- Publication number 20150340603
- Publication date Nov 26, 2015
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS

Jeffrey Marks

Person

Patents Grantslast 30 patents

Plasma etching chemistries of high aspect ratio features in dielect...

Photoresist development with halide chemistries

Plasma etching chemistries of high aspect ratio features in dielect...

Vacuum-integrated hardmask processes and apparatus

Vacuum-integrated hardmask processes and apparatus

Directional deposition on patterned structures

Dry plasma etch method to pattern MRAM stack

Vacuum-integrated hardmask processes and apparatus

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Dry plasma etch method to pattern MRAM stack

Ale smoothness: in and outside semiconductor industry

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Atomic layer etching of tungsten and other metals

Atomic layer etching of GaN and other III-V materials

ALE smoothness: in and outside semiconductor industry

Dry plasma etch method to pattern MRAM stack

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Vacuum-integrated hardmask processes and apparatus

Integrating atomic scale processes: ALD (atomic layer deposition) a...

Method to etch non-volatile metal materials

Method to etch non-volatile metal materials

CVD based metal/semiconductor OHMIC contact for high volume manufac...

Method to etch non-volatile metal materials

Pitch reduction

Multiple frequency plasma processor method and apparatus

Reduction of feature critical dimensions using multiple masks

Method and apparatus for detecting endpoint during plasma etching o...

Plasma reactor using inductive RF coupling, and processes

Plasma reactor using inductive RF coupling, and processes

Magnetic confinement in a plasma reactor having an RF bias electrode

Patents Applicationslast 30 patents

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

BIOASSAY SUBSTRATE HAVING FIDUCIAL DOMAINS AND METHODS OF MANUFACTU...

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

PLASMA ETCHING CHEMISTRIES OF HIGH ASPECT RATIO FEATURES IN DIELECT...

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY

DIRECTIONAL DEPOSITION ON PATTERNED STRUCTURES

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

DIRECTIONAL DEPOSITION ON PATTERNED STRUCTURES

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY

ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS

ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS

DRY PLASMA ETCH METHOD TO PATTERN MRAM STACK

INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) A...

METHOD TO ETCH NON-VOLATILE METAL MATERIALS