Jeffrey N. Miller

Person

Allen, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 11,942,391
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields with bonding wires for sub-modules
- Patent number 11,515,282
- Issue date Nov 29, 2022
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields for sub-modules
- Patent number 11,219,144
- Issue date Jan 4, 2022
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shields for sub-modules
- Patent number 11,058,038
- Issue date Jul 6, 2021
- Qorvo US, Inc.
- Kelly M. Lear
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20240178096
- Publication date May 30, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20230170275
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY
- Publication number 20230145639
- Publication date May 11, 2023
- Qorvo US, Inc.
- MD Hasnine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
- Publication number 20230075555
- Publication date Mar 9, 2023
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
- Publication number 20200373273
- Publication date Nov 26, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS FOR SUB-MODULES
- Publication number 20200305314
- Publication date Sep 24, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDS FOR SUB-MODULES
- Publication number 20200008327
- Publication date Jan 2, 2020
- Qorvo US, Inc.
- Kelly M. Lear
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED MINIATURE MICROELECTRONIC DEVICE FACTORY
- Publication number 20090326703
- Publication date Dec 31, 2009
- BRYAN S. PRESLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MINIATURE MICROFLUIDICS DEVICE FACTORY AND METHOD FOR USE
- Publication number 20090178751
- Publication date Jul 16, 2009
- MICRO FOUNDRY INC.
- BRYAN S. PRESLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MINIATURE DEVICE FACTORY
- Publication number 20090056116
- Publication date Mar 5, 2009
- MICRO FOUNDRY INC.
- Bryan S. Presley
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jeffrey N. Miller

Person

Patents Grantslast 30 patents

System in package with flip chip die over multi-layer heatsink stan...

Electromagnetic shields with bonding wires for sub-modules

Electromagnetic shields for sub-modules

Electromagnetic shields for sub-modules

Patents Applicationslast 30 patents

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY

ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES

ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES

ELECTROMAGNETIC SHIELDS FOR SUB-MODULES

ELECTROMAGNETIC SHIELDS FOR SUB-MODULES

INTEGRATED MINIATURE MICROELECTRONIC DEVICE FACTORY

INTEGRATED MINIATURE MICROFLUIDICS DEVICE FACTORY AND METHOD FOR USE

INTEGRATED MINIATURE DEVICE FACTORY