Jeffrey Toh Tuck Fook

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for ball grind array chip packages having improved testing a...
- Patent number 6,740,983
- Issue date May 25, 2004
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,740,984
- Issue date May 25, 2004
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,693,363
- Issue date Feb 17, 2004
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,674,175
- Issue date Jan 6, 2004
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Method for ball grid array chip packages having improved testing an...
- Patent number 6,600,335
- Issue date Jul 29, 2003
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,522,018
- Issue date Feb 18, 2003
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,522,019
- Issue date Feb 18, 2003
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,448,664
- Issue date Sep 10, 2002
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array chip packages having improved testing and stacking...
- Patent number 6,420,789
- Issue date Jul 16, 2002
- Micron Technology, Inc.
- Wuu Yean Tay
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method for ball grid array chip packages having improved testing an...
- Publication number 20050127531
- Publication date Jun 16, 2005
- Wuu Yean Tay
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating semiconductor component with chip on board l...
- Publication number 20050023654
- Publication date Feb 3, 2005
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having chip on board leadframe and method o...
- Publication number 20050023651
- Publication date Feb 3, 2005
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array chip packages having improved testing and stacking...
- Publication number 20030001288
- Publication date Jan 2, 2003
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Application
Ball grid array chip packages having improved testing and stacking...
- Publication number 20020153602
- Publication date Oct 24, 2002
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Application
Ball grid array chip packages having improved testing and stacking...
- Publication number 20020130413
- Publication date Sep 19, 2002
- Wuu Yean Tay
- G01 - MEASURING TESTING
Information Patent Application
Ball grid array chip packages having improved testing and stacking...
- Publication number 20020043986
- Publication date Apr 18, 2002
- Wuu Yean Tay
- G01 - MEASURING TESTING

Jeffrey Toh Tuck Fook

Person

Patents Grantslast 30 patents

Method for ball grind array chip packages having improved testing a...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Method for ball grid array chip packages having improved testing an...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Patents Applicationslast 30 patents

Method for ball grid array chip packages having improved testing an...

Method for fabricating semiconductor component with chip on board l...

Semiconductor component having chip on board leadframe and method o...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...

Ball grid array chip packages having improved testing and stacking...