Claims
- 1. An assembly comprising:
a board having a first surface and having a second surface, said module including at least one electrical circuit for electrical contact with at least one ball grid array of a semiconductor package; at least one of the first and the second surfaces of the board comprising:
a first ball grid array semiconductor package attached to the at least one of the first and the second surfaces of the board by a plurality of mutually complementary connective elements connected to the at least one electrical circuit of the board, the first ball grid array semiconductor package comprising:
a substrate having a first surface, having a second surface, and having an aperture extending therethrough, a plurality of substrate bond pads located on the first surface adjacent the aperture, a plurality of mutually discrete conductive circuit traces, each circuit trace of the plurality of circuit traces for extending from at least one of the plurality of substrate bond pads; the plurality of connective elements connected to the board being attached to and extending from the second surface of the substrate being arranged in a preselected grid array pattern having at least one preselected pitch dimension between adjacent connective elements, each connective element connected to a circuit trace of the plurality of circuit traces; a semiconductor device having an active surface and a plurality of bond pads located thereon, the semiconductor device attached to the second surface of the substrate being positioned adjacent the board; and a plurality of bond wires extending through the aperture, each of the plurality of bond wires connecting one of the plurality of bond pads on the active surface of the semiconductor device with one of the plurality of bond pads on the on the first surface of the substrate.
- 2. The assembly of claim 1, further comprising:
at least one second ball grid array semiconductor package having a substrate having at least one electrical circuit; the at least one second ball grid array semiconductor package stacked onto and mechanically and electrically attached to the at least one first ball grid array semiconductor package by a second plurality of mutually complementary connective elements extending from the first surface of the substrate of the at least one first ball grid array semiconductor package to the substrate of the at least one second ball grid array semiconductor package; and the second plurality of mutually complementary connective elements being arranged in a preselected grid array pattern and at least one of the second plurality of connective elements being in contact with the at least one electrical circuit of the substrate of the at least one second ball grid array semiconductor package.
- 3. The assembly of claim 2, further comprising:
at least one additional first ball grid array semiconductor package attached to the remaining opposite surface of the board in which the at least one first ball grid array semiconductor package is attached; the at least one additional first ball grid array semiconductor package mechanically and electrically attached to the opposite surface of the board by a third plurality of mutually complementary connective elements extending between the opposite surface of the board and the substrate of the at least one additional first ball grid array semiconductor package; and the third plurality of connective elements being in electrical communication with the at least one electrical circuit of the board.
- 4. The assembly of claim 3, further comprising:
at least one additional second ball grid array semiconductor package having a substrate having at least one electrical circuit; the at least one additional second ball grid array semiconductor package stacked onto and mechanically and electrically attached to the at least one additional first ball grid array semiconductor package by a fourth plurality of mutually complementary connective elements extending from the first surface of the substrate of the at least one additional first ball grid array semiconductor package to the substrate of the at least one additional second ball grid array semiconductor package; and the fourth plurality of mutually complementary connective elements being arranged in a preselected grid array pattern and at least one of the fourth plurality of connective elements being in contact with the at least one electrical circuit of the substrate of the at least one additional second ball grid array semiconductor package.
- 5. The assembly of claim 4, wherein at least one of the pluralities of mutually complementary connective elements comprises a solder ball.
- 6. The assembly of claim 5, wherein at least one of the pluralities of mutually complementary connective elements further comprises a solder ball contact pad.
- 7. The assembly of claim 6, wherein at least one of the pluralities of mutually complementary connective elements further comprises two solder ball contact pads, each of said solder ball contact pads accommodating the solder ball therebetween.
- 8. The assembly of claim 7, wherein at least one of the solder ball contact pads comprises a concave-shaped surface for accommodating the solder ball.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 10/152,246, filed May 21, 2002, pending, which is a continuation of application Ser. No. 10/011,196, filed Nov. 13, 2001, pending, which is a divisional of application Ser. No. 09/571,190, filed May 16, 2000, pending.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09571190 |
May 2000 |
US |
Child |
10011196 |
Nov 2001 |
US |
Continuations (2)
|
Number |
Date |
Country |
Parent |
10152246 |
May 2002 |
US |
Child |
10231729 |
Aug 2002 |
US |
Parent |
10011196 |
Nov 2001 |
US |
Child |
10152246 |
May 2002 |
US |