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Pade City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Electrically stackable semiconductor wafer and chip packages
Patent number
9,601,474
Issue date
Mar 21, 2017
Invensas Corporation
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer leveled chip packaging structure and method thereof
Patent number
9,059,181
Issue date
Jun 16, 2015
Invensas Corporation
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-leveled chip packaging structure and method thereof
Patent number
8,587,091
Issue date
Nov 19, 2013
Invensas Corporation
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device
Patent number
8,314,482
Issue date
Nov 20, 2012
Invensas Corporation
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and method of manufacturing the same
Patent number
7,838,333
Issue date
Nov 23, 2010
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and method of manufacturing the same
Patent number
7,632,707
Issue date
Dec 15, 2009
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-leveled chip packaging structure and method thereof
Patent number
7,528,009
Issue date
May 5, 2009
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-leveled chip packaging structure and method thereof
Patent number
7,294,920
Issue date
Nov 13, 2007
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Wafer Leveled Chip Packaging Structure and Method Thereof
Publication number
20150364457
Publication date
Dec 17, 2015
Invensas Corporation
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Leveled Chip Packaging Structure and Method Thereof
Publication number
20140217587
Publication date
Aug 7, 2014
Invensas Corporation
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF
Publication number
20120267765
Publication date
Oct 25, 2012
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20100112757
Publication date
May 6, 2010
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-leveled chip packaging structure and method thereof
Publication number
20080029870
Publication date
Feb 7, 2008
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-leveled chip packaging structure and method thereof
Publication number
20070197018
Publication date
Aug 23, 2007
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device package and method of manufacturing the same
Publication number
20060157864
Publication date
Jul 20, 2006
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-leveled chip packaging structure and method thereof
Publication number
20060019484
Publication date
Jan 26, 2006
Industrial Technology Research Institute
Shou-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS