Jengyi Yu

Person

San Ramon, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Removing metal contamination from surfaces of a processing chamber
- Patent number 12,191,125
- Issue date Jan 7, 2025
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated dry processes for patterning radiation photoresist patte...
- Patent number 12,183,604
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photoresist development with halide chemistries
- Patent number 12,105,422
- Issue date Oct 1, 2024
- Lam Research Corporation
- Samantha Siamhwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 12,094,711
- Issue date Sep 17, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch and selective deposition process for extreme ultr...
- Patent number 12,062,538
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch using a sacrificial mask
- Patent number 12,027,375
- Issue date Jul 2, 2024
- Lam Research Corporation
- Daniel Peter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlayer for photoresist adhesion and dose reduction
- Patent number 11,988,965
- Issue date May 21, 2024
- Lam Research Corporation
- Samantha S. H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alternating etch and passivation process
- Patent number 11,848,212
- Issue date Dec 19, 2023
- Lam Research Corporation
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing metal contamination from surfaces of a processing chamber
- Patent number 11,842,888
- Issue date Dec 12, 2023
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alternating etch and passivation process
- Patent number 11,551,938
- Issue date Jan 10, 2023
- Lam Research Corporation
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 11,355,353
- Issue date Jun 7, 2022
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 11,322,351
- Issue date May 3, 2022
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlayer for photoresist adhesion and dose reduction
- Patent number 11,314,168
- Issue date Apr 26, 2022
- Lam Research Corporation
- Samantha S. H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 11,257,674
- Issue date Feb 22, 2022
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 10,796,912
- Issue date Oct 6, 2020
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching substrates using ALE and selective deposition
- Patent number 10,685,836
- Issue date Jun 16, 2020
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide films in semiconductor device manufacturing
- Patent number 10,546,748
- Issue date Jan 28, 2020
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching substrates using ale and selective deposition
- Patent number 10,269,566
- Issue date Apr 23, 2019
- Lam Research Corporation
- Samantha Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Atomic layer etching for enhanced bottom-up feature fill
- Patent number 9,837,312
- Issue date Dec 5, 2017
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal and silicon containing capping layers for interconnects
- Patent number 8,753,978
- Issue date Jun 17, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial capping layers for interconnects
- Patent number 8,268,722
- Issue date Sep 18, 2012
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress profile modulation in STI gap fill
- Patent number 7,482,245
- Issue date Jan 27, 2009
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biased H2 etch process in deposition-etch-deposition gap fill
- Patent number 7,163,896
- Issue date Jan 16, 2007
- Novellus Systems, Inc.
- Wenxian Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of filling constrained spaces with insulating materials and...
- Patent number 6,822,333
- Issue date Nov 23, 2004
- Cypress Semiconductor Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to retard copper diffusion and improve film adh...
- Patent number 6,764,952
- Issue date Jul 20, 2004
- Novellus Systems, Inc.
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of filling constrained spaces with insulating materials and...
- Patent number 6,303,496
- Issue date Oct 16, 2001
- Cypress Semiconductor Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
- Publication number 20240429045
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20240419078
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20240361696
- Publication date Oct 31, 2024
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20240255850
- Publication date Aug 1, 2024
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND PROCESS FOR EUV DRY RESIST SENSITIZATION BY GAS PHASE...
- Publication number 20240192590
- Publication date Jun 13, 2024
- LAM RESEARCH CORPORATION
- Sivananda Krishnan Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20240145272
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER
- Publication number 20240112896
- Publication date Apr 4, 2024
- LAM RESEARCH CORPORATION
- Jengyi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20240087904
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF METALLIC CONTAMINATION FROM METAL-CONTAINING PHOTORESIST
- Publication number 20240036474
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Daniel PETER
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST
- Publication number 20230314954
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Daniel PETER
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20230290657
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION
- Publication number 20230230811
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING A CHAMBER
- Publication number 20230230819
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Ran LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20230197459
- Publication date Jun 22, 2023
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER
- Publication number 20230148265
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- Jengyi YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20230045336
- Publication date Feb 9, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PER...
- Publication number 20230031955
- Publication date Feb 2, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY CHAMBER CLEAN OF PHOTORESIST FILMS
- Publication number 20220344136
- Publication date Oct 27, 2022
- LAM RESEARCH CORPORATION
- Daniel Peter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20220270877
- Publication date Aug 25, 2022
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES
- Publication number 20220244645
- Publication date Aug 4, 2022
- LAM RESEARCH CORPORATION
- Samantha SiamHwa Tan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
- Publication number 20220216050
- Publication date Jul 7, 2022
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20220208551
- Publication date Jun 30, 2022
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20220165571
- Publication date May 26, 2022
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELIMINATING YIELD IMPACT OF STOCHASTICS IN LITHOGRAPHY
- Publication number 20220122846
- Publication date Apr 21, 2022
- LAM RESEARCH CORPORATION
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCH USING A SACRIFICIAL MASK
- Publication number 20220122848
- Publication date Apr 21, 2022
- LAM RESEARCH CORPORATION
- Daniel PETER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20220043334
- Publication date Feb 10, 2022
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER
- Publication number 20220037132
- Publication date Feb 3, 2022
- LAM RESEARCH CORPORATION
- Jengyi YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION
- Publication number 20220035247
- Publication date Feb 3, 2022
- LAM RESEARCH CORPORATION
- Samantha S.H. Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20210265163
- Publication date Aug 26, 2021
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OXIDE MANDRELS IN PATTERNING
- Publication number 20210265173
- Publication date Aug 26, 2021
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Removing metal contamination from surfaces of a processing chamber

Integrated dry processes for patterning radiation photoresist patte...

Tin oxide mandrels in patterning

Photoresist development with halide chemistries

Tin oxide films in semiconductor device manufacturing

Atomic layer etch and selective deposition process for extreme ultr...

Selective etch using a sacrificial mask

Underlayer for photoresist adhesion and dose reduction

Alternating etch and passivation process

Removing metal contamination from surfaces of a processing chamber

Alternating etch and passivation process

Tin oxide mandrels in patterning

Tin oxide films in semiconductor device manufacturing

Underlayer for photoresist adhesion and dose reduction

Eliminating yield impact of stochastics in lithography

Eliminating yield impact of stochastics in lithography

Etching substrates using ALE and selective deposition

Tin oxide films in semiconductor device manufacturing

Etching substrates using ale and selective deposition

Atomic layer etching for enhanced bottom-up feature fill

Metal and silicon containing capping layers for interconnects

Interfacial capping layers for interconnects

Stress profile modulation in STI gap fill

Biased H2 etch process in deposition-etch-deposition gap fill

Methods of filling constrained spaces with insulating materials and...

Systems and methods to retard copper diffusion and improve film adh...

Methods of filling constrained spaces with insulating materials and...

Patents Applicationslast 30 patents

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

APPARATUS AND PROCESS FOR EUV DRY RESIST SENSITIZATION BY GAS PHASE...

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER

ALTERNATING ETCH AND PASSIVATION PROCESS

CONTROL OF METALLIC CONTAMINATION FROM METAL-CONTAINING PHOTORESIST

DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION

METHOD FOR CLEANING A CHAMBER

ALTERNATING ETCH AND PASSIVATION PROCESS

REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

POST APPLICATION/EXPOSURE TREATMENTS TO IMPROVE DRY DEVELOPMENT PER...

DRY CHAMBER CLEAN OF PHOTORESIST FILMS

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

ALTERNATING ETCH AND PASSIVATION PROCESS

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

ELIMINATING YIELD IMPACT OF STOCHASTICS IN LITHOGRAPHY

SELECTIVE ETCH USING A SACRIFICIAL MASK

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

REMOVING METAL CONTAMINATION FROM SURFACES OF A PROCESSING CHAMBER

UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING

TIN OXIDE MANDRELS IN PATTERNING