Jens Hahn

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitors with barrier dielectric layers, and methods of formation...
- Patent number 9,831,171
- Issue date Nov 28, 2017
- Infineon Technologies AG
- Bernd Landgraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive structures using a dual metal hard ma...
- Patent number 8,859,418
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising through hole vias having a stress r...
- Patent number 8,598,714
- Issue date Dec 3, 2013
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor, memory cell, memory cell array and method of forming a...
- Patent number 7,700,983
- Issue date Apr 20, 2010
- Qimonda AG
- Martin Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing aluminum-filled contact holes
- Patent number 7,214,610
- Issue date May 8, 2007
- Infineon Technologies AG
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing whisker-free aluminum metal lines or aluminum...
- Patent number 7,157,381
- Issue date Jan 2, 2007
- Infineon Technologies AG
- Dirk Efferenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an interconnect for contact holes
- Patent number 6,602,788
- Issue date Aug 5, 2003
- Infineon Technologies AG
- Axel Bürke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Capacitors with Barrier Dielectric Layers, and Methods of Formation...
- Publication number 20180033723
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Bernd Landgraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitors with Barrier Dielectric Layers, and Methods of Formation...
- Publication number 20160133560
- Publication date May 12, 2016
- INFINEON TECHNOLOGIES AG
- Bernd Landgraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE FILL AT REDUCED TEMPERATURES
- Publication number 20130302974
- Publication date Nov 14, 2013
- GLOBALFOUNDRIES INC.
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive Structures Using a Dual Metal Hard Ma...
- Publication number 20130178057
- Publication date Jul 11, 2013
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Voids in Copper Structures
- Publication number 20130108779
- Publication date May 2, 2013
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUITS HAVING INTERCONNECT STRUCTURES AND METHODS FOR...
- Publication number 20120199980
- Publication date Aug 9, 2012
- GLOBALFOUNDRIES INC.
- Egon R. PFUETZNER
Information Patent Application
Semiconductor Device Comprising Through Hole Vias Having a Stress R...
- Publication number 20120001330
- Publication date Jan 5, 2012
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for an integrated circuit structure
- Publication number 20080124920
- Publication date May 29, 2008
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an integrated semiconductor contact struct...
- Publication number 20070243708
- Publication date Oct 18, 2007
- Jens Hahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Transistor, memory cell, memory cell array and method of forming a...
- Publication number 20070138523
- Publication date Jun 21, 2007
- Martin Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20060228876
- Publication date Oct 12, 2006
- Infineon Technologies AG
- Olaf Storbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING WHISKER-FREE ALUMINUM METAL LINES OR ALUMINUM...
- Publication number 20050277300
- Publication date Dec 15, 2005
- Infineon Technologies AG
- Dirk Efferenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate structure for a transistor and method for fabricating the gate...
- Publication number 20050202617
- Publication date Sep 15, 2005
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing aluminum-filled contact holes
- Publication number 20040242007
- Publication date Dec 2, 2004
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating an interconnect for contact holes
- Publication number 20020006720
- Publication date Jan 17, 2002
- Axel Burke
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Capacitors with barrier dielectric layers, and methods of formation...

Methods of forming conductive structures using a dual metal hard ma...

Semiconductor device comprising through hole vias having a stress r...

Transistor, memory cell, memory cell array and method of forming a...

Process for producing aluminum-filled contact holes

Method for providing whisker-free aluminum metal lines or aluminum...

Process for fabricating an interconnect for contact holes

Patents Applicationslast 30 patents

Capacitors with Barrier Dielectric Layers, and Methods of Formation...

Capacitors with Barrier Dielectric Layers, and Methods of Formation...

REPLACEMENT GATE ELECTRODE FILL AT REDUCED TEMPERATURES

Methods of Forming Conductive Structures Using a Dual Metal Hard Ma...

Methods of Filling Voids in Copper Structures

INTEGRATED CIRCUITS HAVING INTERCONNECT STRUCTURES AND METHODS FOR...

Semiconductor Device Comprising Through Hole Vias Having a Stress R...

Fabrication method for an integrated circuit structure

Manufacturing method for an integrated semiconductor contact struct...

Transistor, memory cell, memory cell array and method of forming a...

Method of manufacturing a semiconductor device

METHOD FOR PROVIDING WHISKER-FREE ALUMINUM METAL LINES OR ALUMINUM...

Gate structure for a transistor and method for fabricating the gate...

Process for producing aluminum-filled contact holes

Process for fabricating an interconnect for contact holes