Jeonghoon Ahn

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of designing interconnect structure of semiconductor apparat...
- Patent number 12,159,095
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Joonnyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip and semiconductor package including same
- Patent number 12,107,034
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor
- Patent number 11,955,509
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jihyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of estimating warpage of interposers and methods of manufac...
- Patent number 11,429,777
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Wonji Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having capacitor
- Patent number 11,094,624
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...
- Publication number 20250061262
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonnyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20240395672
- Publication date Nov 28, 2024
- Name SAMSUNG ELECTRONICS CO.,LTD.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR
- Publication number 20240222421
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jihyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE
- Publication number 20240178131
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Sunoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240071924
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240055378
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230148222
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- BOIN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE
- Publication number 20230030589
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- BOIN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220384563
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- JIHYUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...
- Publication number 20220366122
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Joonnyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20220336326
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- SHAOFENG DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ESTIMATING WARPAGE OF INTERPOSERS AND METHODS OF MANUFAC...
- Publication number 20220035984
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Wonji Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR
- Publication number 20200343178
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS

Jeonghoon Ahn

Person

Patents Grantslast 30 patents

Method of designing interconnect structure of semiconductor apparat...

Semiconductor chip and semiconductor package including same

Metal-insulator-metal capacitor

Methods of estimating warpage of interposers and methods of manufac...

Semiconductor device having capacitor

Patents Applicationslast 30 patents

METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME

METAL-INSULATOR-METAL CAPACITOR

SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE

INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE

METAL-INSULATOR-METAL CAPACITOR

METHOD OF DESIGNING INTERCONNECT STRUCTURE OF SEMICONDUCTOR APPARAT...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING SAME

METHODS OF ESTIMATING WARPAGE OF INTERPOSERS AND METHODS OF MANUFAC...

SEMICONDUCTOR DEVICE HAVING CAPACITOR