Jeremias Perez Libres

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for thermal control of semiconductor chip assembly and un...
- Patent number 8,378,503
- Issue date Feb 19, 2013
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal method to control underfill flow in semiconductor devices
- Patent number 8,110,438
- Issue date Feb 7, 2012
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grooved substrates for uniform underfilling solder ball assembled e...
- Patent number 7,550,856
- Issue date Jun 23, 2009
- Texas Instruments Incorporated
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,309,648
- Issue date Dec 18, 2007
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,135,781
- Issue date Nov 14, 2006
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grooved substrates for uniform underfilling solder ball assembled e...
- Patent number 7,033,864
- Issue date Apr 25, 2006
- Texas Instruments Incorporated
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink-substrate-spacer structure for an integrated-circuit package
- Patent number 6,936,919
- Issue date Aug 30, 2005
- Texas Instruments Incorporated
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating flip chip IC packages with heat spreaders in...
- Patent number 6,432,749
- Issue date Aug 13, 2002
- Texas Instruments Incorporated
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical interlocking of fillers and epoxy/resin
- Patent number 5,644,168
- Issue date Jul 1, 1997
- Texas Instruments Incorporated
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Method to Control Underfill Flow in Semiconductor Devices
- Publication number 20120097095
- Publication date Apr 26, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL METHOD TO CONTROL UNDERFILL FLOW IN SEMICONDUCTOR DEVICES
- Publication number 20080038870
- Publication date Feb 14, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grooved substrates for uniform underfilling solder ball assembled e...
- Publication number 20070054506
- Publication date Mar 8, 2007
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile, Chip-Scale Package and Method of Fabrication
- Publication number 20070020808
- Publication date Jan 25, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROOVED SUBSTRATES FOR UNIFORM UNDERFILLING SOLDER BALL ASSEMBLED E...
- Publication number 20060049522
- Publication date Mar 9, 2006
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile, chip-scale package and method of fabrication
- Publication number 20060033219
- Publication date Feb 16, 2006
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated interconnect package
- Publication number 20050093170
- Publication date May 5, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with spacer
- Publication number 20040037059
- Publication date Feb 26, 2004
- Leon Stiborek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with heatsink support
- Publication number 20040036162
- Publication date Feb 26, 2004
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Jeremias Perez Libres

Person

Patents Grantslast 30 patents

Apparatus for thermal control of semiconductor chip assembly and un...

Thermal method to control underfill flow in semiconductor devices

Grooved substrates for uniform underfilling solder ball assembled e...

Low profile, chip-scale package and method of fabrication

Low profile, chip-scale package and method of fabrication

Grooved substrates for uniform underfilling solder ball assembled e...

Heatsink-substrate-spacer structure for an integrated-circuit package

Method of fabricating flip chip IC packages with heat spreaders in...

Mechanical interlocking of fillers and epoxy/resin

Patents Applicationslast 30 patents

Thermal Method to Control Underfill Flow in Semiconductor Devices

THERMAL METHOD TO CONTROL UNDERFILL FLOW IN SEMICONDUCTOR DEVICES

Grooved substrates for uniform underfilling solder ball assembled e...

Low Profile, Chip-Scale Package and Method of Fabrication

GROOVED SUBSTRATES FOR UNIFORM UNDERFILLING SOLDER BALL ASSEMBLED E...

Low profile, chip-scale package and method of fabrication

Integrated interconnect package

Integrated circuit package with spacer

Integrated circuit package with heatsink support