Jeroen Johannes Maria Zaal

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved circuit structure thermal reliabi...
- Patent number 11,508,669
- Issue date Nov 22, 2022
- NXP B.V.
- Leo van Gemert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underbump metallization dimension variation with improved reliability
- Patent number 10,825,789
- Issue date Nov 3, 2020
- NXP B.V.
- Leo Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die and antenna array device
- Patent number 10,593,635
- Issue date Mar 17, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die array device
- Patent number 10,431,575
- Issue date Oct 1, 2019
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component carrier
- Patent number 10,315,821
- Issue date Jun 11, 2019
- NXP B.V.
- Jeroen Johannes Maria Zaal
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Integrated circuit dies with through-die vias
- Patent number 9,799,629
- Issue date Oct 24, 2017
- NXP B.V.
- Jeroen Johannes Maria Zaal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for improved Circuit Structure Thermal Reliabi...
- Publication number 20210066209
- Publication date Mar 4, 2021
- NXP B.V.
- Leo van Gemert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-DIE AND ANTENNA ARRAY DEVICE
- Publication number 20190304934
- Publication date Oct 3, 2019
- NXP B.V.
- Antonius Hendrikus Jozef KAMPHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ARRAY DEVICE
- Publication number 20190189606
- Publication date Jun 20, 2019
- NXP B.V.
- Antonius Hendrikus Jozef KAMPHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER
- Publication number 20180134473
- Publication date May 17, 2018
- NXP B.V.
- Jeroen Johannes Maria Zaal
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THROUGH-DIE VIAS
- Publication number 20170236803
- Publication date Aug 17, 2017
- NXP B.V.
- Jeroen Johannes Maria Zaal
- H01 - BASIC ELECTRIC ELEMENTS

Jeroen Johannes Maria Zaal

Person

Patents Grantslast 30 patents

Patterned and planarized under-bump metallization

Method and apparatus for improved circuit structure thermal reliabi...

Underbump metallization dimension variation with improved reliability

Multi-die and antenna array device

Multi-die array device

Component carrier

Integrated circuit dies with through-die vias

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

Method and Apparatus for improved Circuit Structure Thermal Reliabi...

MULTI-DIE AND ANTENNA ARRAY DEVICE

MULTI-DIE ARRAY DEVICE

COMPONENT CARRIER

INTEGRATED CIRCUIT DIES WITH THROUGH-DIE VIAS