Jerry M. Brooks

Person

Caldwell, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Satellite cable box
- Patent number D777678
- Issue date Jan 31, 2017
- Jerry L Brooks
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Integrated circuit package having reduced interconnects
- Patent number 8,115,269
- Issue date Feb 14, 2012
- Round Rock Research, LLC
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable ball grid array package
- Patent number RE43112
- Issue date Jan 17, 2012
- Round Rock Research, LLC
- David J. Corisis
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Semiconductor device and method of fabrication thereof
- Patent number 8,049,342
- Issue date Nov 1, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and methods
- Patent number 8,048,715
- Issue date Nov 1, 2011
- Round Rock Research, LLC
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including semiconductor dice in laterally off...
- Patent number 7,999,378
- Issue date Aug 16, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies, electronic devices including the s...
- Patent number 7,998,792
- Issue date Aug 16, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
- Patent number 7,944,057
- Issue date May 17, 2011
- Round Rock Research, LLC
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical surface mount assembly and methods
- Patent number 7,871,859
- Issue date Jan 18, 2011
- Round Rock Research, LLC
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
- Patent number 7,851,922
- Issue date Dec 14, 2010
- Round Rock Research, LLC
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 7,704,794
- Issue date Apr 27, 2010
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an integrated circuit package
- Patent number 7,674,652
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and methods
- Patent number 7,619,313
- Issue date Nov 17, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad rerouting element, rerouted semiconductor devices includin...
- Patent number 7,423,336
- Issue date Sep 9, 2008
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked mass storage flash memory package
- Patent number 7,375,419
- Issue date May 20, 2008
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing element for use in semiconductor device assemblies
- Patent number 7,372,131
- Issue date May 13, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Routing element for use in multi-chip modules, multi-chip modules i...
- Patent number 7,372,138
- Issue date May 13, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-part lead frame
- Patent number 7,321,160
- Issue date Jan 22, 2008
- Micron Technology, Inc.
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for designing bond pad rerouting elements for use in stacke...
- Patent number 7,282,397
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad rerouting element and stacked semiconductor device assembl...
- Patent number 7,282,805
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor die package having improved i...
- Patent number 7,268,013
- Issue date Sep 11, 2007
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked mass storage flash memory package
- Patent number 7,262,506
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer bumping for enabling a stitch wire bond in the abse...
- Patent number 7,232,747
- Issue date Jun 19, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical surface mount assembly and methods
- Patent number 7,227,261
- Issue date Jun 5, 2007
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure having stacked semiconductor devices
- Patent number 7,193,306
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varied-thickness heat sink for integrated circuit (IC) packages and...
- Patent number 7,125,749
- Issue date Oct 24, 2006
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method for semiconductor die and lead frame
- Patent number 7,112,252
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package electrical enhancement with improved lea...
- Patent number 7,098,527
- Issue date Aug 29, 2006
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for designing bond pad rerouting elements for use in stacke...
- Patent number 7,094,631
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a stack of packaged memory dice
- Patent number 7,091,061
- Issue date Aug 15, 2006
- Micron Technology, Inc.
- Jerrold L. King
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS
- Publication number 20110101514
- Publication date May 5, 2011
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING REDUCED INTERCONNECTS
- Publication number 20100148372
- Publication date Jun 17, 2010
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFF...
- Publication number 20100148331
- Publication date Jun 17, 2010
- ROUND ROCK RESEARCH, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...
- Publication number 20100078792
- Publication date Apr 1, 2010
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE S...
- Publication number 20100078793
- Publication date Apr 1, 2010
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE AND METHODS
- Publication number 20100055837
- Publication date Mar 4, 2010
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MASS STORAGE FLASH MEMORY PACKAGE
- Publication number 20090286356
- Publication date Nov 19, 2009
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...
- Publication number 20090008797
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making semiconductor fuses
- Publication number 20080003712
- Publication date Jan 3, 2008
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stacked mass storage flash memory package
- Publication number 20070065987
- Publication date Mar 22, 2007
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20070057353
- Publication date Mar 15, 2007
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20070057354
- Publication date Mar 15, 2007
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity ball grid array apparatus having improved inductance charact...
- Publication number 20070007517
- Publication date Jan 11, 2007
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20070001274
- Publication date Jan 4, 2007
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly method for semiconductor die and lead frame
- Publication number 20070000599
- Publication date Jan 4, 2007
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Varied-thickness heat sink for integrated circuit (IC) package
- Publication number 20060267184
- Publication date Nov 30, 2006
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module and methods
- Publication number 20060261492
- Publication date Nov 23, 2006
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a stack of packaged memory dice
- Publication number 20060252181
- Publication date Nov 9, 2006
- Jerrold L. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for a low profile multi-IC chip package connector
- Publication number 20060252180
- Publication date Nov 9, 2006
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for designing bond pad rerouting elements for use in stacke...
- Publication number 20060166404
- Publication date Jul 27, 2006
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20060125065
- Publication date Jun 15, 2006
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad rerouting element and stacked semiconductor device assembl...
- Publication number 20060113650
- Publication date Jun 1, 2006
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity ball grid array apparatus having improved inductance charact...
- Publication number 20060055040
- Publication date Mar 16, 2006
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package having reduced interconnects
- Publication number 20060014317
- Publication date Jan 19, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing methods for semiconductor structures having stacked s...
- Publication number 20050266610
- Publication date Dec 1, 2005
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-part lead frame with dissimilar materials
- Publication number 20050224928
- Publication date Oct 13, 2005
- S. Derek Hinkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip semiconductor package
- Publication number 20050212143
- Publication date Sep 29, 2005
- Micron Technology, Inc.
- Jerrold L. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a stack of packaged memory dice
- Publication number 20050170558
- Publication date Aug 4, 2005
- Jerrold L. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing element for use in semiconductor device assemblies
- Publication number 20050156295
- Publication date Jul 21, 2005
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low profile multi-IC chip package connector
- Publication number 20050158912
- Publication date Jul 21, 2005
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Jerry M. Brooks

Person

Patents Grantslast 30 patents

Satellite cable box

Integrated circuit package having reduced interconnects

Stackable ball grid array package

Semiconductor device and method of fabrication thereof

Multi-chip module and methods

Semiconductor devices including semiconductor dice in laterally off...

Semiconductor device assemblies, electronic devices including the s...

Bond pad rerouting element, rerouted semiconductor devices includin...

Vertical surface mount assembly and methods

Bond pad rerouting element, rerouted semiconductor devices includin...

Method of forming a semiconductor device

Methods of forming an integrated circuit package

Multi-chip module and methods

Bond pad rerouting element, rerouted semiconductor devices includin...

Stacked mass storage flash memory package

Routing element for use in semiconductor device assemblies

Routing element for use in multi-chip modules, multi-chip modules i...

Multi-part lead frame

Methods for designing bond pad rerouting elements for use in stacke...

Bond pad rerouting element and stacked semiconductor device assembl...

Method of fabricating a semiconductor die package having improved i...

Stacked mass storage flash memory package

Method of wafer bumping for enabling a stitch wire bond in the abse...

Vertical surface mount assembly and methods

Semiconductor structure having stacked semiconductor devices

Varied-thickness heat sink for integrated circuit (IC) packages and...

Assembly method for semiconductor die and lead frame

Integrated circuit package electrical enhancement with improved lea...

Methods for designing bond pad rerouting elements for use in stacke...

Method of forming a stack of packaged memory dice

Patents Applicationslast 30 patents

VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS

INTEGRATED CIRCUIT PACKAGE HAVING REDUCED INTERCONNECTS

SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFF...

BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...

SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE S...

MULTI-CHIP MODULE AND METHODS

STACKED MASS STORAGE FLASH MEMORY PACKAGE

BOND PAD REROUTING ELEMENT, REROUTED SEMICONDUCTOR DEVICES INCLUDIN...

Methods of making semiconductor fuses

Stacked mass storage flash memory package

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Cavity ball grid array apparatus having improved inductance charact...

Multi-part lead frame with dissimilar materials

Assembly method for semiconductor die and lead frame

Varied-thickness heat sink for integrated circuit (IC) package

Multi-chip module and methods

Method of forming a stack of packaged memory dice

Method for a low profile multi-IC chip package connector

Methods for designing bond pad rerouting elements for use in stacke...

Multi-part lead frame with dissimilar materials

Bond pad rerouting element and stacked semiconductor device assembl...

Cavity ball grid array apparatus having improved inductance charact...

Integrated circuit package having reduced interconnects

Manufacturing methods for semiconductor structures having stacked s...

Multi-part lead frame with dissimilar materials

Multichip semiconductor package

Method of forming a stack of packaged memory dice

Routing element for use in semiconductor device assemblies

Low profile multi-IC chip package connector