Jesse M. Hefner

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metallized particle interconnect with solder components
- Patent number 10,588,219
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallized particle interconnect with solder components
- Patent number 10,104,772
- Issue date Oct 16, 2018
- International Business Machines Incorporated
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retractable interconnect device including multiple electrical paths
- Patent number 9,197,053
- Issue date Nov 24, 2015
- International Business Machines Corporation
- Darcy Berger
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Retractable interconnect device configured to switch between electr...
- Patent number 9,166,346
- Issue date Oct 20, 2015
- International Business Machines Corporation
- Darcy Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing enhanced optical mirror coupling and alignment utilizi...
- Patent number 8,968,987
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Emmanuel Atta
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Programmable optical interconnect for multi-node computer systems
- Patent number 8,488,968
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Emmanuel Atta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus for accessing and probing the connections between a chip...
- Patent number 7,525,299
- Issue date Apr 28, 2009
- International Business Machines Corporation
- Paul W. Rudrud
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS
- Publication number 20160057860
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS
- Publication number 20160057861
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Layne A. Berge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RETRACTABLE INTERCONNECT DEVICE INCLUDING MULTIPLE ELECTRICAL PATHS
- Publication number 20150200528
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Darcy Berger
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RETRACTABLE INTERCONNECT DEVICE CONFIGURED TO SWITCH BETWEEN ELECTR...
- Publication number 20150200500
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Darcy Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING ENHANCED OPTICAL MIRROR COUPLING AND ALIGNMENT UTILIZI...
- Publication number 20130177697
- Publication date Jul 11, 2013
- International Business Machines Corporation
- Emmanuel Atta
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PROGRAMMABLE OPTICAL INTERCONNECT FOR MULTI-NODE COMPUTER SYSTEMS
- Publication number 20120275798
- Publication date Nov 1, 2012
- International Business Machines Corporation
- Emmanuel Atta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
High Density Printed Circuit Board Interconnect and Method of Assembly
- Publication number 20090277670
- Publication date Nov 12, 2009
- Roger A. Booth, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR IMPLEMENTING REDUCED COUPLING EFFECTS ON S...
- Publication number 20090189635
- Publication date Jul 30, 2009
- Roger Allen Booth, JR.
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS FOR MANUFACTURING A SEMI-BURIED VIA AND ARTICLES COMPRISING...
- Publication number 20090056998
- Publication date Mar 5, 2009
- International Business Machines Corporation
- Roger A. Booth, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and System for Controlled Plating of Vias
- Publication number 20070298601
- Publication date Dec 27, 2007
- Roger A. Booth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Jesse M. Hefner

Person

Patents Grantslast 30 patents

Metallized particle interconnect with solder components

Metallized particle interconnect with solder components

Retractable interconnect device including multiple electrical paths

Retractable interconnect device configured to switch between electr...

Implementing enhanced optical mirror coupling and alignment utilizi...

Programmable optical interconnect for multi-node computer systems

Apparatus for accessing and probing the connections between a chip...

Patents Applicationslast 30 patents

METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS

METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS

RETRACTABLE INTERCONNECT DEVICE INCLUDING MULTIPLE ELECTRICAL PATHS

RETRACTABLE INTERCONNECT DEVICE CONFIGURED TO SWITCH BETWEEN ELECTR...

IMPLEMENTING ENHANCED OPTICAL MIRROR COUPLING AND ALIGNMENT UTILIZI...

PROGRAMMABLE OPTICAL INTERCONNECT FOR MULTI-NODE COMPUTER SYSTEMS

High Density Printed Circuit Board Interconnect and Method of Assembly

METHOD AND APPARATUS FOR IMPLEMENTING REDUCED COUPLING EFFECTS ON S...

METHODS FOR MANUFACTURING A SEMI-BURIED VIA AND ARTICLES COMPRISING...

Method and System for Controlled Plating of Vias