Jesus Bajo Bautista

Person

Baguio City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making a flip-chip assembly with bond fingers
- Patent number 9,219,052
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with bond fingers
- Patent number 8,766,461
- Issue date Jul 1, 2014
- Texas Instruments Incorporated
- Raymond Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding a solder bump to a lead using compression and retraction fo...
- Patent number 8,381,967
- Issue date Feb 26, 2013
- Texas Instruments Incorporated
- Mutsumi Masumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES
- Publication number 20230386979
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION
- Publication number 20230245928
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jeniffer ASPURIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...
- Publication number 20230207390
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
- Publication number 20220157678
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
- Publication number 20190206752
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS
- Publication number 20140248746
- Publication date Sep 4, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BOND FINGERS
- Publication number 20140197534
- Publication date Jul 17, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Singulation Process for Block-Molded Packages
- Publication number 20080003718
- Publication date Jan 3, 2008
- Erwin Remoblas Estepa
- H01 - BASIC ELECTRIC ELEMENTS

Jesus Bajo Bautista

Person

Patents Grantslast 30 patents

Integrated circuit packages with cavities and methods of manufactur...

Making a flip-chip assembly with bond fingers

Substrate with bond fingers

Bonding a solder bump to a lead using compression and retraction fo...

Patents Applicationslast 30 patents

DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES

TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION

METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS

SUBSTRATE WITH BOND FINGERS

Singulation Process for Block-Molded Packages