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Ji Cheng Yang
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Singapore, SG
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last 30 patents
Information
Patent Grant
Multichip semiconductor assembly
Patent number
6,388,336
Issue date
May 14, 2002
Texas Instruments Incorporated
Vaiyapuri Venkateshwaran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked flip-chip integrated circuit assemblage
Patent number
6,339,254
Issue date
Jan 15, 2002
Texas Instruments Incorporated
Vaiyapuri Venkateshwaran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip assembly semiconductor
Patent number
6,316,822
Issue date
Nov 13, 2001
Texas Instruments Incorporated
Vaiyapuri Venkateshwaran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridging method of interconnects for integrated circuit packages
Patent number
6,084,306
Issue date
Jul 4, 2000
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS