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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming semiconductor device
Patent number
11,127,621
Issue date
Sep 21, 2021
United Microelectronics Corp.
Ji Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure and fabricating method thereof
Patent number
10,332,839
Issue date
Jun 25, 2019
United Microelectronics Corp.
Keen Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling threshold voltage and method of fabricating s...
Patent number
9,082,660
Issue date
Jul 14, 2015
United Microelectronics Corp.
Ji Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-insulator-metal capacitor structure and method for manufactur...
Patent number
8,946,854
Issue date
Feb 3, 2015
United Microelectronics Corporation
Ji Feng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
Publication number
20210134653
Publication date
May 6, 2021
UNITED MICROELECTRONICS CORP.
JI FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND FABRICATING METHOD THEREOF
Publication number
20180197819
Publication date
Jul 12, 2018
United Microelectronics Corp.
Keen Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING METAL-INSULATOR-METAL CAPACITOR STRUCTURE
Publication number
20150140778
Publication date
May 21, 2015
UNITED MICROELECTRONICS CORPORATION
Ji FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF CONTROLLING THRESHOLD VOLTAGE AND METHOD OF FABRICATING S...
Publication number
20150050751
Publication date
Feb 19, 2015
United Microelectronics Corp.
Ji Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING ISOLATING STRUCTURE AND THROUGH SILICON VIA
Publication number
20140357050
Publication date
Dec 4, 2014
JI FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through silicon via structure and method of fabricating the same
Publication number
20130200519
Publication date
Aug 8, 2013
Ji Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FOR MANUFACTUR...
Publication number
20130113075
Publication date
May 9, 2013
UNITED MICROELECTRONICS CORPORATION
Ji FENG
H01 - BASIC ELECTRIC ELEMENTS