Ji-Zoo Lin

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Level shifter circuit and method of operating the same
- Patent number 12,081,215
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Level shifter circuit and method of operating the same
- Patent number 11,677,400
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Level shifter circuit and method of operating the same
- Patent number 11,362,660
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Level shifter circuit and method of operating the same
- Patent number 11,012,073
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Lun Ou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked chip package structure and manufacturing method thereof
- Patent number 10,950,557
- Issue date Mar 16, 2021
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Level shifter circuit and method of operating the same
- Patent number 10,735,001
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Lun Ou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package structure and chip structure
- Patent number 10,607,860
- Issue date Mar 31, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure having conductive shield
- Patent number 10,276,510
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressor circuit and compressor circuit layout
- Patent number 10,003,342
- Issue date Jun 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked chip package structure and manufacturing method thereof
- Patent number 9,825,010
- Issue date Nov 21, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing stress for vias and fabricating method thereof
- Patent number 7,754,599
- Issue date Jul 13, 2010
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for protecting electronic packaging contacts from stress
- Patent number 7,732,928
- Issue date Jun 8, 2010
- Instrument Technology Research Center
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold array process for semiconductor packages
- Patent number 7,691,676
- Issue date Apr 6, 2010
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing stress for vias and fabricating method thereof
- Patent number 7,545,039
- Issue date Jun 9, 2009
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure for electronic device
- Patent number 7,531,900
- Issue date May 12, 2009
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite bump
- Patent number 7,378,746
- Issue date May 27, 2008
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single sign-on system for application program
- Patent number 7,278,155
- Issue date Oct 2, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Chuan Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fast-working LCD residual display suppression circuit and a method...
- Patent number 6,731,258
- Issue date May 4, 2004
- Winbond Electronics Corp.
- Ji-Zoo Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Silicon pressure micro-sensing device and the fabrication process
- Patent number 6,541,834
- Issue date Apr 1, 2003
- Integrated Crystal Technology Corp.
- Jin-shown Shie
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL PROCESSING METHOD AND ASSOCIATED RELAY DEVICE
- Publication number 20240422247
- Publication date Dec 19, 2024
- Realtek Semiconductor Corp.
- Che-Yen Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME
- Publication number 20240372550
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun OU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
IMAGE DATA PROCESSING METHOD AND ASSOCIATED ELECTRONIC DEVICE
- Publication number 20240205364
- Publication date Jun 20, 2024
- Realtek Semiconductor Corp.
- Wan-Cheng Yi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME
- Publication number 20230336177
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun OU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME
- Publication number 20220321126
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun OU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME
- Publication number 20210273640
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun OU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME
- Publication number 20200350916
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun OU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200176395
- Publication date Jun 4, 2020
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME
- Publication number 20190319624
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lun OU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20190096821
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND CHIP STRUCTURE
- Publication number 20190096699
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170287874
- Publication date Oct 5, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170287870
- Publication date Oct 5, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSOR CIRCUIT AND COMPRESSOR CIRCUIT LAYOUT
- Publication number 20160156358
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Structure for reducing stress for vias and fabricating method thereof
- Publication number 20090156001
- Publication date Jun 18, 2009
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE FOR ELECTRONIC DEVICE
- Publication number 20070210429
- Publication date Sep 13, 2007
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE BUMP
- Publication number 20070210457
- Publication date Sep 13, 2007
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for reducing stress for vias and fabricating method thereof
- Publication number 20070108572
- Publication date May 17, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protecting structure and manufacturing method for electronic packag...
- Publication number 20070096279
- Publication date May 3, 2007
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrate PGP and Lotus Notes to encrypt / decrypt email
- Publication number 20050086477
- Publication date Apr 21, 2005
- Taiwan Semiconductor Manufacturing Co.
- Ji Wei Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Support roaming user in lotus notes environment
- Publication number 20030200320
- Publication date Oct 23, 2003
- Taiwan Semiconductor Manufacturing Co.
- Ji-Wei Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Single sign-on system for application program
- Publication number 20030079147
- Publication date Apr 24, 2003
- Ching-Chuan Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON PRESSURE MICRO-SENSING DEVICE AND THE FABRICATION PROCESS
- Publication number 20030068838
- Publication date Apr 10, 2003
- Jin-shown Shie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fast-working LCD residual display suppression circuit and a method...
- Publication number 20030020676
- Publication date Jan 30, 2003
- WINBOND ELECTRONICS CORP.
- Ji-Zoo Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Person

Patents Grantslast 30 patents

Level shifter circuit and method of operating the same

Level shifter circuit and method of operating the same

Level shifter circuit and method of operating the same

Level shifter circuit and method of operating the same

Stacked chip package structure and manufacturing method thereof

Level shifter circuit and method of operating the same

Package structure and chip structure

Manufacturing method of package structure having conductive shield

Compressor circuit and compressor circuit layout

Stacked chip package structure and manufacturing method thereof

Structure for reducing stress for vias and fabricating method thereof

Structure for protecting electronic packaging contacts from stress

Mold array process for semiconductor packages

Structure for reducing stress for vias and fabricating method thereof

Package structure for electronic device

Composite bump

Single sign-on system for application program

Fast-working LCD residual display suppression circuit and a method...

Silicon pressure micro-sensing device and the fabrication process

Patents Applicationslast 30 patents

SIGNAL PROCESSING METHOD AND ASSOCIATED RELAY DEVICE

LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME

IMAGE DATA PROCESSING METHOD AND ASSOCIATED ELECTRONIC DEVICE

LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME

LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME

LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME

LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAME

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND CHIP STRUCTURE

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPRESSOR CIRCUIT AND COMPRESSOR CIRCUIT LAYOUT

Structure for reducing stress for vias and fabricating method thereof

PACKAGE STRUCTURE FOR ELECTRONIC DEVICE

COMPOSITE BUMP

Structure for reducing stress for vias and fabricating method thereof

Protecting structure and manufacturing method for electronic packag...

Integrate PGP and Lotus Notes to encrypt / decrypt email

Support roaming user in lotus notes environment

Single sign-on system for application program

SILICON PRESSURE MICRO-SENSING DEVICE AND THE FABRICATION PROCESS

Fast-working LCD residual display suppression circuit and a method...