Jia Lee

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to increase tensile stress of silicon nitride films using a...
- Patent number 8,753,989
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to increase tensile stress of silicon nitride films using a...
- Patent number 8,129,290
- Issue date Mar 6, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration process for fabricating stressed transistor structure
- Patent number 7,566,655
- Issue date Jul 28, 2009
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced low dielectric constant organosilicon plasma chemical vapo...
- Patent number 7,494,938
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Son V. Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced low dielectric constant organosilicon plasma chemical vapo...
- Patent number 7,202,564
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Son Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reliable low-k interconnect structure with hybrid dielectric
- Patent number 7,135,398
- Issue date Nov 14, 2006
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing dielectric films
- Patent number 7,117,064
- Issue date Oct 3, 2006
- Applied Materials, Inc.
- Srinivas D Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k interlevel dielectric layer (ILD)
- Patent number 7,009,280
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric films
- Patent number 7,001,850
- Issue date Feb 21, 2006
- Applied Materials Inc.
- Srinivas D Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Patent number 6,939,797
- Issue date Sep 6, 2005
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable low-k interconnect structure with hybrid dielectric
- Patent number 6,917,108
- Issue date Jul 12, 2005
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine-containing layers for damascene structures
- Patent number 6,777,171
- Issue date Aug 17, 2004
- Applied Materials, Inc.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric films
- Patent number 6,764,958
- Issue date Jul 20, 2004
- Applied Materials Inc.
- Srinivas D Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Patent number 6,737,747
- Issue date May 18, 2004
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A...
- Publication number 20120196452
- Publication date Aug 2, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRADIENT DEPOSITION OF LOW-K CVD MATERIALS
- Publication number 20090026587
- Publication date Jan 29, 2009
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...
- Publication number 20070128882
- Publication date Jun 7, 2007
- International Business Machines Corporation
- Son V. Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration process for fabricating stressed transistor structure
- Publication number 20060270217
- Publication date Nov 30, 2006
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method to increase tensile stress of silicon nitride films using a...
- Publication number 20060269693
- Publication date Nov 30, 2006
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...
- Publication number 20060183345
- Publication date Aug 17, 2006
- International Business Machines Corporation
- Son Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing dielectric films
- Publication number 20060141805
- Publication date Jun 29, 2006
- APPLIED MATERIALS, INC.
- Srinivas D. Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-K INTERLEVEL DIELECTRIC LAYER (ILD) AND METHOD
- Publication number 20050242414
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for removing impurities from low dielectric constant films...
- Publication number 20050087490
- Publication date Apr 28, 2005
- International Business Machines Corporation
- Mark S. Chace
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Reliable low-k interconnect structure with hybrid dielectric
- Publication number 20050023693
- Publication date Feb 3, 2005
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing dielectric films
- Publication number 20050020048
- Publication date Jan 27, 2005
- Srinivas D. Nemani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Publication number 20040173908
- Publication date Sep 9, 2004
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliable low-k interconnect structure with hybrid dielectric
- Publication number 20040094839
- Publication date May 20, 2004
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced BEOL interconnect structures with low-k PE CVD cap layer a...
- Publication number 20030132510
- Publication date Jul 17, 2003
- International Business Machines Corporation
- Edward Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration scheme for advanced BEOL metallization including low-k...
- Publication number 20030134495
- Publication date Jul 17, 2003
- International Business Machines Corporation
- Stephen Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluorine-containing layers for damascene structures
- Publication number 20020155386
- Publication date Oct 24, 2002
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Method to increase tensile stress of silicon nitride films using a...

Method to increase tensile stress of silicon nitride films using a...

Integration process for fabricating stressed transistor structure

Advanced low dielectric constant organosilicon plasma chemical vapo...

Advanced low dielectric constant organosilicon plasma chemical vapo...

Reliable low-k interconnect structure with hybrid dielectric

Method of depositing dielectric films

Low-k interlevel dielectric layer (ILD)

Method of depositing dielectric films

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Reliable low-k interconnect structure with hybrid dielectric

Fluorine-containing layers for damascene structures

Method of depositing dielectric films

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Patents Applicationslast 30 patents

METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A...

GRADIENT DEPOSITION OF LOW-K CVD MATERIALS

ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...

Integration process for fabricating stressed transistor structure

Method to increase tensile stress of silicon nitride films using a...

ADVANCED LOW DIELECTRIC CONSTANT ORGANOSILICON PLASMA CHEMICAL VAPO...

Method of depositing dielectric films

LOW-K INTERLEVEL DIELECTRIC LAYER (ILD) AND METHOD

Process for removing impurities from low dielectric constant films...

Reliable low-k interconnect structure with hybrid dielectric

Method of depositing dielectric films

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Reliable low-k interconnect structure with hybrid dielectric

Advanced BEOL interconnect structures with low-k PE CVD cap layer a...

Integration scheme for advanced BEOL metallization including low-k...

Fluorine-containing layers for damascene structures