Jiaming Ye

Person

Hangzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure applied to power converter
- Patent number 11,742,268
- Issue date Aug 29, 2023
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Chiqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming chip package
- Patent number 11,232,999
- Issue date Jan 25, 2022
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power converter and manufacture method thereof
- Patent number 11,056,421
- Issue date Jul 6, 2021
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package assembly for switching regulator
- Patent number 10,741,481
- Issue date Aug 11, 2020
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming chip package
- Patent number 10,615,106
- Issue date Apr 7, 2020
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of light emitter and light sensor with light-bloc...
- Patent number 10,333,019
- Issue date Jun 25, 2019
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Junli Shentu
- G01 - MEASURING TESTING
Information Patent Grant
Package assembly having interconnect for stacked electronic devices...
- Patent number 10,128,221
- Issue date Nov 13, 2018
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power converter and manufacture method thereof
- Patent number 10,083,895
- Issue date Sep 25, 2018
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package assembly for switching regulator
- Patent number 10,043,738
- Issue date Aug 7, 2018
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and method for manufacturing the same
- Patent number 9,699,918
- Issue date Jul 4, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package method and package assembly
- Patent number 9,595,453
- Issue date Mar 14, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level leadframe with interconnect areas for soldering conduct...
- Patent number 9,559,043
- Issue date Jan 31, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly and manufacturing method thereof
- Patent number 9,508,677
- Issue date Nov 29, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210384155
- Publication date Dec 9, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE APPLIED TO POWER CONVERTER
- Publication number 20210343628
- Publication date Nov 4, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Chiqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
- Publication number 20210296213
- Publication date Sep 23, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING CHIP PACKAGE
- Publication number 20200185311
- Publication date Jun 11, 2020
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
- Publication number 20180366395
- Publication date Dec 20, 2018
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR
- Publication number 20180277470
- Publication date Sep 27, 2018
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170345961
- Publication date Nov 30, 2017
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Junli Shentu
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE METHOD AND PACKAGE ASSEMBLY
- Publication number 20160365257
- Publication date Dec 15, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING CHIP PACKAGE
- Publication number 20160351483
- Publication date Dec 1, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20160284663
- Publication date Sep 29, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
- Publication number 20160218087
- Publication date Jul 28, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160113144
- Publication date Apr 21, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20150249068
- Publication date Sep 3, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150214200
- Publication date Jul 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR
- Publication number 20150214141
- Publication date Jul 30, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150162271
- Publication date Jun 11, 2015
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package structure applied to power converter

Chip package structure and method for forming chip package

Package structure for power converter and manufacture method thereof

Integrated package assembly for switching regulator

Chip package structure and method for forming chip package

Package structure of light emitter and light sensor with light-bloc...

Package assembly having interconnect for stacked electronic devices...

Package structure for power converter and manufacture method thereof

Integrated package assembly for switching regulator

Package assembly and method for manufacturing the same

Chip package method and package assembly

Multi-level leadframe with interconnect areas for soldering conduct...

Chip package assembly and manufacturing method thereof

Patents Applicationslast 30 patents

DIE ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE APPLIED TO POWER CONVERTER

PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING CHIP PACKAGE

PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF

INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE METHOD AND PACKAGE ASSEMBLY

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING CHIP PACKAGE

CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR

LEADFRAME, PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME