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Method to form an interconnect
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Patent number 8,115,313
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Issue date Feb 14, 2012
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Hewlett-Packard Development Company, L.P.
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Jian-Gang Weng
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Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Crossover
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Patent number 8,057,656
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Issue date Nov 15, 2011
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Hewlett-Packard Development Company, L.P.
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Jian-gang Weng
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Apparatus for forming a circuit
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Patent number 7,757,631
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Issue date Jul 20, 2010
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Hewlett-Packard Development Company, L.P.
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John A. Devos
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Projecting a luminance image
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Patent number 7,722,190
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Issue date May 25, 2010
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Hewlett-Packard Development Company, L.P.
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Jian-gang Weng
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Metal-insulator-metal device
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Patent number 7,160,745
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Issue date Jan 9, 2007
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Hewlett-Packard Development Company, L.P.
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Kurt Ulmer
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H01 - BASIC ELECTRIC ELEMENTS
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Method to form an interconnect
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Patent number 7,135,405
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Issue date Nov 14, 2006
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Hewlett-Packard Development Company, L.P.
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Jian-Gang Weng
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H01 - BASIC ELECTRIC ELEMENTS
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