Jian Zhang

Person

Brookline, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple module chip manufacturing arrangement
- Patent number 11,440,117
- Issue date Sep 13, 2022
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux-free solder ball mount arrangement
- Patent number 10,879,102
- Issue date Dec 29, 2020
- Boston Process Technologies, Inc
- Jian Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hot wall flux free solder ball treatment arrangement
- Patent number 10,607,866
- Issue date Mar 31, 2020
- Boston Process Technologies, Inc
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,283,481
- Issue date May 7, 2019
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,824,998
- Issue date Nov 21, 2017
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,741,683
- Issue date Aug 22, 2017
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow treating unit and substrate treating apparatus
- Patent number 9,629,258
- Issue date Apr 18, 2017
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow treating unit and substrate treating apparatus
- Patent number 9,572,266
- Issue date Feb 14, 2017
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,472,531
- Issue date Oct 18, 2016
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foldable cart with rear guidance arrangement
- Patent number 9,393,981
- Issue date Jul 19, 2016
- FTR Systems, Inc.
- Chunghsin Lee
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Reflow treating unit and substrate treating apparatus
- Patent number 9,226,407
- Issue date Dec 29, 2015
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tracking foldable cart
- Patent number 8,955,870
- Issue date Feb 17, 2015
- FTR Systems, Inc.
- Chunghsin Lee
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Foldable cart with tracking arrangement
- Patent number 8,789,638
- Issue date Jul 29, 2014
- FTR Systems, Inc.
- Jian Zhang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Arrangement for solder bump formation on wafers
- Patent number 8,524,593
- Issue date Sep 3, 2013
- Semigear Inc
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux-free chip to substrate joint serial linear thermal processor a...
- Patent number 8,274,161
- Issue date Sep 25, 2012
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux-free chip to wafer joint serial thermal processor arrangement
- Patent number 8,252,678
- Issue date Aug 28, 2012
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for solder bump formation on wafers
- Patent number 7,982,320
- Issue date Jul 19, 2011
- Semigear Inc.
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for solder bump formation on wafers
- Patent number 7,632,750
- Issue date Dec 15, 2009
- Semigear Inc
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Void free solder arrangement for screen printing semiconductor wafers
- Patent number 7,416,969
- Issue date Aug 26, 2008
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Serial thermal processor arrangement
- Patent number 7,358,175
- Issue date Apr 15, 2008
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation chamber arrangement for serial processing of semiconducto...
- Patent number 7,008,879
- Issue date Mar 7, 2006
- Semigear, Inc.
- Chunghsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation chamber arrangement for serial processing of semiconducto...
- Patent number 6,827,789
- Issue date Dec 7, 2004
- Semigear, Inc.
- Chunghsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ thickness and refractive index monitoring and control syste...
- Patent number 6,646,753
- Issue date Nov 11, 2003
- Unaxis, USA, Inc.
- Jian Zhang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless gang die bonding arrangement
- Publication number 20220005720
- Publication date Jan 6, 2022
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple module chip manufacturing arrangement
- Publication number 20210098401
- Publication date Apr 1, 2021
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hot wall flux free solder ball treatment arrangement
- Publication number 20200043759
- Publication date Feb 6, 2020
- Boston Process Technologies, Inc
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20190229086
- Publication date Jul 25, 2019
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux-free solder ball mount arrangement
- Publication number 20190043745
- Publication date Feb 7, 2019
- Boston Process Technologies, Inc
- Jian Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20180033766
- Publication date Feb 1, 2018
- SEMlgear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160336293
- Publication date Nov 17, 2016
- Semigear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160336294
- Publication date Nov 17, 2016
- SEMlgear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160233191
- Publication date Aug 11, 2016
- Semigear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow Treating Unit and Substrate Treating Apparatus
- Publication number 20160143155
- Publication date May 19, 2016
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow treating unit and substrate treating apparatus
- Publication number 20160143156
- Publication date May 19, 2016
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow treating unit & substrate treating apparatus
- Publication number 20150034700
- Publication date Feb 5, 2015
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow treating unit & substrate treating apparatus
- Publication number 20150034699
- Publication date Feb 5, 2015
- Semigear Inc
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus & method for treating substrate
- Publication number 20150034702
- Publication date Feb 5, 2015
- Semigear Inc
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Serial thermal linear processor arrangement
- Publication number 20130175323
- Publication date Jul 11, 2013
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Foldable cart with tracking arrangement
- Publication number 20130098700
- Publication date Apr 25, 2013
- Jian Zhang
- B60 - VEHICLES IN GENERAL
Information Patent Application
Tracking foldable cart
- Publication number 20130103245
- Publication date Apr 25, 2013
- FTR SYSTEMS, INC
- Chunghsin Lee
- B60 - VEHICLES IN GENERAL
Information Patent Application
Arrangement for solder bump formation on wafers
- Publication number 20120289042
- Publication date Nov 15, 2012
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux-free chip to substrate joint serial linear thermal processor a...
- Publication number 20110215483
- Publication date Sep 8, 2011
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux-free chip to wafer joint serial thermal processor arrangement
- Publication number 20110198388
- Publication date Aug 18, 2011
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for solder bump formation on wafers
- Publication number 20110053368
- Publication date Mar 3, 2011
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for solder bump formation on wafers
- Publication number 20080009122
- Publication date Jan 10, 2008
- Semigear Inc
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Serial thermal processor arrangement
- Publication number 20060032079
- Publication date Feb 16, 2006
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void free solder arrangement for screen printing semiconductor wafers
- Publication number 20050255685
- Publication date Nov 17, 2005
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Isolation chamber arrangement for serial processing of semiconducto...
- Publication number 20040203178
- Publication date Oct 14, 2004
- Chunghsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation chamber arrangement for serial processing of semiconducto...
- Publication number 20040000378
- Publication date Jan 1, 2004
- Chunghsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ thickness and refractive index monitoring and control syste...
- Publication number 20020075486
- Publication date Jun 20, 2002
- Jian Zhang
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Fluxless gang die bonding arrangement

Multiple module chip manufacturing arrangement

Device packaging facility and method, and device processing apparat...

Flux-free solder ball mount arrangement

Hot wall flux free solder ball treatment arrangement

Device packaging facility and method, and device processing apparat...

Device packaging facility and method, and device processing apparat...

Device packaging facility and method, and device processing apparat...

Reflow treating unit and substrate treating apparatus

Reflow treating unit and substrate treating apparatus

Device packaging facility and method, and device processing apparat...

Foldable cart with rear guidance arrangement

Reflow treating unit and substrate treating apparatus

Tracking foldable cart

Foldable cart with tracking arrangement

Arrangement for solder bump formation on wafers

Flux-free chip to substrate joint serial linear thermal processor a...

Flux-free chip to wafer joint serial thermal processor arrangement

Arrangement for solder bump formation on wafers

Arrangement for solder bump formation on wafers

Void free solder arrangement for screen printing semiconductor wafers

Serial thermal processor arrangement

Isolation chamber arrangement for serial processing of semiconducto...

Isolation chamber arrangement for serial processing of semiconducto...

In-situ thickness and refractive index monitoring and control syste...

Patents Applicationslast 30 patents

FLUXLESS GANG DIE BONDING ARRANGEMENT

Fluxless gang die bonding arrangement

Multiple module chip manufacturing arrangement

Hot wall flux free solder ball treatment arrangement

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

Flux-free solder ball mount arrangement

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

Reflow Treating Unit and Substrate Treating Apparatus

Reflow treating unit and substrate treating apparatus

Reflow treating unit & substrate treating apparatus

Reflow treating unit & substrate treating apparatus

Apparatus & method for treating substrate

Serial thermal linear processor arrangement

Foldable cart with tracking arrangement

Tracking foldable cart

Arrangement for solder bump formation on wafers

Flux-free chip to substrate joint serial linear thermal processor a...

Flux-free chip to wafer joint serial thermal processor arrangement

Arrangement for solder bump formation on wafers

Arrangement for solder bump formation on wafers

Serial thermal processor arrangement

Void free solder arrangement for screen printing semiconductor wafers

Isolation chamber arrangement for serial processing of semiconducto...

Isolation chamber arrangement for serial processing of semiconducto...

In-situ thickness and refractive index monitoring and control syste...