Jian Zhou

Person

West Linn, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low copper electroplating solutions for fill and defect control
- Patent number 10,214,826
- Issue date Feb 26, 2019
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte flow dynamics for uniform electroplating
- Patent number 9,816,194
- Issue date Nov 14, 2017
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Geometry and process optimization for ultra-high RPM plating
- Patent number 9,481,942
- Issue date Nov 1, 2016
- Lam Research Corporation
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Current ramping and current pulsing entry of substrates for electro...
- Patent number 9,385,035
- Issue date Jul 5, 2016
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating solutions with halides
- Patent number 8,268,155
- Issue date Sep 18, 2012
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless copper fill process
- Patent number 7,456,102
- Issue date Nov 25, 2008
- Novellus Systems, Inc.
- Seshasayee Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...
- Publication number 20220208604
- Publication date Jun 30, 2022
- LAM RESEARCH CORPORATION
- Huanfeng Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL
- Publication number 20190145017
- Publication date May 16, 2019
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING
- Publication number 20160273119
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING
- Publication number 20160222535
- Publication date Aug 4, 2016
- LAM RESEARCH CORPORATION
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT...
- Publication number 20160102416
- Publication date Apr 14, 2016
- Novellus Systems, Inc.
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CURRENT RAMPING AND CURRENT PULSING ENTRY OF SUBSTRATES FOR ELECTRO...
- Publication number 20140224661
- Publication date Aug 14, 2014
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL
- Publication number 20140209476
- Publication date Jul 31, 2014
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Low copper electroplating solutions for fill and defect control

Control of electrolyte flow dynamics for uniform electroplating

Geometry and process optimization for ultra-high RPM plating

Current ramping and current pulsing entry of substrates for electro...

Copper electroplating solutions with halides

Electroless copper fill process

Patents Applicationslast 30 patents

PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...

LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL

CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING

GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING

LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT...

CURRENT RAMPING AND CURRENT PULSING ENTRY OF SUBSTRATES FOR ELECTRO...

LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL