Jianguo Li

Person

Scarborough, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package assembly using a passive device as a standoff
- Patent number 11,942,405
- Issue date Mar 26, 2024
- ATI Technologies ULC
- Jianguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit product customizations for identification code v...
- Patent number 11,315,883
- Issue date Apr 26, 2022
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with corner hollows
- Patent number 9,867,282
- Issue date Jan 9, 2018
- ATI Technologies ULC
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LID ASSEMBLY FOR A CHIP PACKAGE
- Publication number 20240332098
- Publication date Oct 3, 2024
- ADVANCED MICRO DEVICES, INC.
- Suming HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS
- Publication number 20240038703
- Publication date Feb 1, 2024
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY USING A PASSIVE DEVICE AS A STANDOFF
- Publication number 20230154834
- Publication date May 18, 2023
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PRODUCT CUSTOMIZATIONS FOR IDENTIFICATION CODE V...
- Publication number 20210143104
- Publication date May 13, 2021
- ADVANCED MICRO DEVICES, INC.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER RING FOR CIRCUIT BOARD
- Publication number 20160073493
- Publication date Mar 10, 2016
- Andrew KW Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH CORNER HOLLOWS
- Publication number 20150049441
- Publication date Feb 19, 2015
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH VENTED LID
- Publication number 20130258610
- Publication date Oct 3, 2013
- Jianguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER
- Publication number 20130113084
- Publication date May 9, 2013
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package assembly using a passive device as a standoff

Integrated circuit product customizations for identification code v...

Circuit board with corner hollows

Patents Applicationslast 30 patents

LID ASSEMBLY FOR A CHIP PACKAGE

SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS

SEMICONDUCTOR PACKAGE ASSEMBLY USING A PASSIVE DEVICE AS A STANDOFF

INTEGRATED CIRCUIT PRODUCT CUSTOMIZATIONS FOR IDENTIFICATION CODE V...

STIFFENER RING FOR CIRCUIT BOARD

CIRCUIT BOARD WITH CORNER HOLLOWS

SEMICONDUCTOR CHIP DEVICE WITH VENTED LID

SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER