Jiantao Zheng

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for shaping a laminate substrate
- Patent number 9,543,253
- Issue date Jan 10, 2017
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining magnitude of compressive loading
- Patent number 9,366,591
- Issue date Jun 14, 2016
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Grant
Fixture for shaping a laminate substrate
- Patent number 9,059,240
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shaping a laminate substrate
- Patent number 9,048,245
- Issue date Jun 2, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining magnitude of compressive loading
- Patent number 8,794,079
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Grant
Determining thermal interface material (TIM) thickness change
- Patent number 8,717,043
- Issue date May 6, 2014
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced thermal management of 3-D stacked die packaging
- Patent number 8,299,608
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of metal thermal interface
- Patent number 8,232,636
- Issue date Jul 31, 2012
- International Business Machines Corporation
- James N Humenik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly having a stress-relieving buffer layer
- Patent number 7,875,972
- Issue date Jan 25, 2011
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package method and structure with cure-melt hierarchy
- Patent number 7,834,442
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Bruce K Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via offsetting to reduce stress under the first level interconnect...
- Patent number 7,812,438
- Issue date Oct 12, 2010
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid edge capping load
- Patent number 7,733,655
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20150136838
- Publication date May 21, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING MAGNITUDE OF COMPRESSIVE LOADING
- Publication number 20140331792
- Publication date Nov 13, 2014
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Application
FIXTURE FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130323345
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130320069
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING MAGNITUDE OF COMPRESSIVE LOADING
- Publication number 20130112006
- Publication date May 9, 2013
- International Business Machines Corporation
- PAUL F. BODENWEBER
- G01 - MEASURING TESTING
Information Patent Application
DETERMINING THERMAL INTERFACE MATERIAL (TIM) THICKNESS CHANGE
- Publication number 20130027063
- Publication date Jan 31, 2013
- International Business Machines Corporation
- PAUL F. BODENWEBER
- G01 - MEASURING TESTING
Information Patent Application
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
- Publication number 20120007229
- Publication date Jan 12, 2012
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE
- Publication number 20110180923
- Publication date Jul 28, 2011
- International Business Machines Corporation
- JAMES N. HUMENIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY HAVING A STRESS-RELIEVING BUFFER LAYER
- Publication number 20100327430
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID EDGE CAPPING LOAD
- Publication number 20100020503
- Publication date Jan 28, 2010
- International Business Machines Corporation
- MARTIN BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY
- Publication number 20090179322
- Publication date Jul 16, 2009
- International Business Machines Corporation
- BRUCE K FURMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA OFFSETTING TO REDUCE STRESS UNDER THE FIRST LEVEL INTERCONNECT...
- Publication number 20090174084
- Publication date Jul 9, 2009
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS

Jiantao Zheng

Person

Patents Grantslast 30 patents

Method for shaping a laminate substrate

Determining magnitude of compressive loading

Fixture for shaping a laminate substrate

Method for shaping a laminate substrate

Determining magnitude of compressive loading

Determining thermal interface material (TIM) thickness change

Enhanced thermal management of 3-D stacked die packaging

Reliability enhancement of metal thermal interface

Semiconductor device assembly having a stress-relieving buffer layer

Electronic package method and structure with cure-melt hierarchy

Via offsetting to reduce stress under the first level interconnect...

Lid edge capping load

Patents Applicationslast 30 patents

METHOD FOR SHAPING A LAMINATE SUBSTRATE

DETERMINING MAGNITUDE OF COMPRESSIVE LOADING

FIXTURE FOR SHAPING A LAMINATE SUBSTRATE

METHOD FOR SHAPING A LAMINATE SUBSTRATE

DETERMINING MAGNITUDE OF COMPRESSIVE LOADING

DETERMINING THERMAL INTERFACE MATERIAL (TIM) THICKNESS CHANGE

ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING

RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE

SEMICONDUCTOR DEVICE ASSEMBLY HAVING A STRESS-RELIEVING BUFFER LAYER

LID EDGE CAPPING LOAD

ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY

VIA OFFSETTING TO REDUCE STRESS UNDER THE FIRST LEVEL INTERCONNECT...