Jianxin LEI

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,908,696
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,898,236
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Zhiyong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for passivating a target
- Patent number 11,661,651
- Issue date May 30, 2023
- Applied Materials, Inc.
- Chao Du
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for reducing tungsten resistivity
- Patent number 11,655,534
- Issue date May 23, 2023
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon-containing layer for bit line resistance reduction
- Patent number 11,637,107
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-containing layer for bit line resistance reduction
- Patent number 11,626,410
- Issue date Apr 11, 2023
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for passivating a target
- Patent number 11,512,387
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Chao Du
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for treating magnesium oxide film
- Patent number 11,489,110
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Xiaodong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for reducing tungsten resistivity
- Patent number 11,447,857
- Issue date Sep 20, 2022
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,257,677
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma chamber target for reducing defects in workpiece during diel...
- Patent number 11,227,751
- Issue date Jan 18, 2022
- Applied Materials, Inc.
- Xiaodong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing system and method of forming a contact
- Patent number 11,114,320
- Issue date Sep 7, 2021
- Applied Materials, Inc.
- Gaurav Thareja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for filling a feature disposed in a substrate
- Patent number 10,950,500
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for smoothing dynamic random access memory bi...
- Patent number 10,903,112
- Issue date Jan 26, 2021
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt removal for bottom up gapfill
- Patent number 10,770,346
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low resistivity physical vapor deposition o...
- Patent number 10,734,235
- Issue date Aug 4, 2020
- Applied Materials, Inc.
- Jothilingam Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap layer for bit line resistance reduction
- Patent number 10,700,072
- Issue date Jun 30, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices using PVD ruthenium
- Patent number 10,388,532
- Issue date Aug 20, 2019
- Applied Materials, Inc.
- Jothilingam Ramalingam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for filling substrate features with cobalt
- Patent number 10,304,732
- Issue date May 28, 2019
- Applied Materials, Inc.
- Wenting Hou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective cobalt removal for bottom up gapfill
- Patent number 10,163,696
- Issue date Dec 25, 2018
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low resistivity physical vapor deposition o...
- Patent number 10,043,670
- Issue date Aug 7, 2018
- Applied Materials, Inc.
- Jothilingam Ramalingam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lowering tungsten resistivity by replacing titanium nitride with ti...
- Patent number 9,583,349
- Issue date Feb 28, 2017
- APPLIED MATERIALS, INC.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten silicide nitride films and methods of formation
- Patent number 9,461,137
- Issue date Oct 4, 2016
- Applied Materials, Inc.
- Jothilingam Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metal gate structure on a substrate
- Patent number 8,580,630
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Jianxin Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetron design for RF/DC physical vapor deposition
- Patent number 8,580,094
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Rongjun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming metal silicide on silicon-containing features of a substrate
- Patent number 7,485,556
- Issue date Feb 3, 2009
- Applied Materials, Inc.
- Jeong Soo Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING KIT SHIELD
- Publication number 20240352574
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Sundarapandian Ramaling Vijayalaskshmi REDDY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Layered Substrate with Ruthenium Layer and Method for Producing
- Publication number 20240282709
- Publication date Aug 22, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS I...
- Publication number 20240249920
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Wenting HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240234204
- Publication date Jul 11, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240136223
- Publication date Apr 25, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber
- Publication number 20240093355
- Publication date Mar 21, 2024
- Applied Materials, Inc.
- Zhiyong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20240038859
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20230122956
- Publication date Apr 20, 2023
- Zhiyong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHUTTER DISK FOR PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER
- Publication number 20230073011
- Publication date Mar 9, 2023
- Zhiyong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon-Containing Layer for Bit Line Resistance Reduction
- Publication number 20220406788
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Containing Layer for Bit Line Resistance Reduction
- Publication number 20220406790
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Tom Ho Wing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR REDUCING TUNGSTEN RESITIVITY
- Publication number 20220341025
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Wenting HOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PASSIVATING A TARGET
- Publication number 20220307126
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Chao DU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220310364
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Halbert CHONG
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220310363
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Halbert CHONG
- B08 - CLEANING
Information Patent Application
METAL CAP FOR CONTACT RESISTANCE REDUCTION
- Publication number 20220231137
- Publication date Jul 21, 2022
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20220130676
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR IN-SITU DEPOSITION MONITORING
- Publication number 20220081758
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Xiaodong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR REDUCING TUNGSTEN RESITIVITY
- Publication number 20220081756
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Wenting HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CHAMBER TARGET FOR REDUCING DEFECTS IN WORKPIECE DURING DIEL...
- Publication number 20220005679
- Publication date Jan 6, 2022
- Applied Materials, Inc.
- Xiaodong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PASSIVATING A TARGET
- Publication number 20210317568
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Chao DU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20210319989
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Halbert CHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR TREATING MAGNESIUM OXIDE FILM
- Publication number 20210320246
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Xiaodong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20210233770
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cap Layer For Bit Line Resistance Reduction
- Publication number 20200235104
- Publication date Jul 23, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND METHOD OF FORMING A CONTACT
- Publication number 20200203481
- Publication date Jun 25, 2020
- Applied Materials, Inc.
- Gaurav THAREJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cap Layer For Bit Line Resistance Reduction
- Publication number 20200126996
- Publication date Apr 23, 2020
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS MEMORY BI...
- Publication number 20200126844
- Publication date Apr 23, 2020
- Applied Materials, Inc.
- PRIYADARSHI PANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER IMPULSE MAGNETRON SPUTTERING PHYSICAL VAPOR DEPOSITION O...
- Publication number 20200048760
- Publication date Feb 13, 2020
- KISHOR KALATHIPARAMBIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL
- Publication number 20190122923
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS

Jianxin LEI

Person

Patents Grantslast 30 patents

Methods and devices for subtractive self-alignment

Methods and apparatus for processing a substrate

Methods and apparatus for passivating a target

Apparatus for reducing tungsten resistivity

Silicon-containing layer for bit line resistance reduction

Silicon-containing layer for bit line resistance reduction

Methods and apparatus for passivating a target

Methods for treating magnesium oxide film

Methods and apparatus for reducing tungsten resistivity

Methods and devices for subtractive self-alignment

Plasma chamber target for reducing defects in workpiece during diel...

Processing system and method of forming a contact

Methods and apparatus for filling a feature disposed in a substrate

Methods and apparatus for smoothing dynamic random access memory bi...

Selective cobalt removal for bottom up gapfill

Systems and methods for low resistivity physical vapor deposition o...

Cap layer for bit line resistance reduction

Methods and devices using PVD ruthenium

Methods and apparatus for filling substrate features with cobalt

Selective cobalt removal for bottom up gapfill

Systems and methods for low resistivity physical vapor deposition o...

Lowering tungsten resistivity by replacing titanium nitride with ti...

Tungsten silicide nitride films and methods of formation

Methods for forming a metal gate structure on a substrate

Magnetron design for RF/DC physical vapor deposition

Forming metal silicide on silicon-containing features of a substrate

Patents Applicationslast 30 patents

PROCESSING KIT SHIELD

Layered Substrate with Ruthenium Layer and Method for Producing

REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS I...

Ru Liner above a Barrier Layer

Ru Liner above a Barrier Layer

Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber

METAL CAP FOR CONTACT RESISTANCE REDUCTION

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

SHUTTER DISK FOR PHYSICAL VAPOR DEPOSITION (PVD) CHAMBER

Silicon-Containing Layer for Bit Line Resistance Reduction

Silicon-Containing Layer for Bit Line Resistance Reduction

APPARATUS FOR REDUCING TUNGSTEN RESITIVITY

METHODS AND APPARATUS FOR PASSIVATING A TARGET

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METAL CAP FOR CONTACT RESISTANCE REDUCTION

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHODS AND APPARATUS FOR IN-SITU DEPOSITION MONITORING

METHODS AND APPARATUS FOR REDUCING TUNGSTEN RESITIVITY

PLASMA CHAMBER TARGET FOR REDUCING DEFECTS IN WORKPIECE DURING DIEL...

METHODS AND APPARATUS FOR PASSIVATING A TARGET

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS FOR TREATING MAGNESIUM OXIDE FILM

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

Cap Layer For Bit Line Resistance Reduction

PROCESSING SYSTEM AND METHOD OF FORMING A CONTACT

Cap Layer For Bit Line Resistance Reduction

METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS MEMORY BI...

HIGH POWER IMPULSE MAGNETRON SPUTTERING PHYSICAL VAPOR DEPOSITION O...

SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL