Jiao WANG

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Kunshan, CN

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Patents Applicationslast 30 patents

Information Patent Application
PANEL-LEVEL PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240332240
- Publication date Oct 3, 2024
- JIANGSU PANGU SEMICONDUCTOR TECHNOLOGY CO., LTD
- Zhiyi XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-CHIP INTEGRATED PACKAGING STRUCTURE, MANUFACTURING METHOD...
- Publication number 20230022427
- Publication date Jan 26, 2023
- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
- Shuying MA
- H01 - BASIC ELECTRIC ELEMENTS