Jiech-Fun Lu

Person

Madou Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Absorption enhancement structure to increase quantum efficiency of...
- Patent number 12,002,828
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
- Patent number 11,948,962
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave reflector for complementary metal oxide semiconductor image...
- Patent number 11,923,394
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,916,091
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 11,869,761
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,855,159
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,830,764
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming self aligned grids in BSI image sensor
- Patent number 11,776,985
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming light pipe structure with high quantum efficiency
- Patent number 11,769,778
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal grid structure to improve image sensor performance
- Patent number 11,756,970
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar junction transistor (BJT) comprising a multilayer base diel...
- Patent number 11,710,783
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via formation to enlarge electrochemical plating...
- Patent number 11,652,025
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Absorption enhancement structure to increase quantum efficiency of...
- Patent number 11,600,647
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Absorption enhancement structure for image sensor
- Patent number 11,522,004
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,495,489
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor pixel isolation structure for reducing c...
- Patent number 11,450,700
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge release layer to remove charge carriers from dielectric grid...
- Patent number 11,380,728
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens structure configured to increase quantum efficiency of image s...
- Patent number 11,335,726
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiech-Fun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,315,972
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy vertical transistor structure to reduce cross talk in pixel s...
- Patent number 11,309,342
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,264,469
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave reflector for complementary metal oxide semiconductor image...
- Patent number 11,251,213
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring structure for film resistor
- Patent number 11,233,117
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure with reduced step height and increased electrica...
- Patent number 11,217,547
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar junction transistor (BJT) comprising a multilayer base diel...
- Patent number 11,183,587
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed inductor structure to reduce step height
- Patent number 11,139,239
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating magnetic core
- Patent number 11,133,374
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Shuo Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light pipe structure with high quantum efficiency
- Patent number 11,121,162
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned grids in BSI image sensor
- Patent number 11,031,434
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical isolation structure for reducing crosstalk between pixels a...
- Patent number 10,872,918
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240120363
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chyi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL
- Publication number 20240088187
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SELF ALIGNED GRIDS IN BSI IMAGE SENSOR
- Publication number 20240021653
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY
- Publication number 20230387163
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE
- Publication number 20230387148
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED BLOCKING STRUCTURE FOR BLC PIXELS
- Publication number 20230378230
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20230377948
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM TRENCHES IN SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD...
- Publication number 20230230993
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Chyi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...
- Publication number 20230063793
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20220384496
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...
- Publication number 20220375828
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF...
- Publication number 20220359595
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20220359273
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGE RELEASE LAYER TO REMOVE CHARGE CARRIERS FROM DIELECTRIC GRID...
- Publication number 20220310692
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Chung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE
- Publication number 20220285412
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCAVE REFLECTOR FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR IMAGE...
- Publication number 20220278158
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS STRUCTURE CONFIGURED TO INCREASE QUANTUM EFFICIENCY OF IMAGE S...
- Publication number 20220262845
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiech-Fun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY VERTICAL TRANSISTOR STRUCTURE TO REDUCE CROSS TALK IN PIXEL S...
- Publication number 20220238575
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES
- Publication number 20220238662
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...
- Publication number 20220230939
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING STRUCTURE FOR FILM RESISTOR
- Publication number 20220149147
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE WITH REDUCED STEP HEIGHT AND INCREASED ELECTRICA...
- Publication number 20220115345
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Pei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR JUNCTION TRANSISTOR (BJT) COMPRISING A MULTILAYER BASE DIEL...
- Publication number 20220077305
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ISOLATION STRUCTURE
- Publication number 20220037387
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY
- Publication number 20210384244
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20210335861
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SELF ALIGNED GRIDS IN BSI IMAGE SENSOR
- Publication number 20210280630
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF...
- Publication number 20210272996
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI Image Sensor and Method of Forming Same
- Publication number 20210233945
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS STRUCTURE CONFIGURED TO INCREASE QUANTUM EFFICIENCY OF IMAGE S...
- Publication number 20210134875
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiech-Fun Lu
- H01 - BASIC ELECTRIC ELEMENTS

Jiech-Fun Lu

Person

Patents Grantslast 30 patents

Absorption enhancement structure to increase quantum efficiency of...

Charge release layer to remove charge carriers from dielectric grid...

Concave reflector for complementary metal oxide semiconductor image...

BSI image sensor and method of forming same

Back-side deep trench isolation structure for image sensor

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method for forming a semiconductor-on-insulator (SOI) substrate

Method of forming self aligned grids in BSI image sensor

Method for forming light pipe structure with high quantum efficiency

Metal grid structure to improve image sensor performance

Bipolar junction transistor (BJT) comprising a multilayer base diel...

Through-substrate via formation to enlarge electrochemical plating...

Absorption enhancement structure to increase quantum efficiency of...

Absorption enhancement structure for image sensor

Method for forming a semiconductor-on-insulator (SOI) substrate

Semiconductor image sensor pixel isolation structure for reducing c...

Charge release layer to remove charge carriers from dielectric grid...

Lens structure configured to increase quantum efficiency of image s...

BSI image sensor and method of forming same

Dummy vertical transistor structure to reduce cross talk in pixel s...

Method for forming thin semiconductor-on-insulator (SOI) substrates

Concave reflector for complementary metal oxide semiconductor image...

Ring structure for film resistor

Bond pad structure with reduced step height and increased electrica...

Bipolar junction transistor (BJT) comprising a multilayer base diel...

Recessed inductor structure to reduce step height

Method for fabricating magnetic core

Light pipe structure with high quantum efficiency

Self aligned grids in BSI image sensor

Optical isolation structure for reducing crosstalk between pixels a...

Patents Applicationslast 30 patents

PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL

METHOD OF FORMING SELF ALIGNED GRIDS IN BSI IMAGE SENSOR

METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY

METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE

RECESSED BLOCKING STRUCTURE FOR BLC PIXELS

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

UNIFORM TRENCHES IN SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD...

METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...

ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF...

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

CHARGE RELEASE LAYER TO REMOVE CHARGE CARRIERS FROM DIELECTRIC GRID...

METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE

CONCAVE REFLECTOR FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR IMAGE...

LENS STRUCTURE CONFIGURED TO INCREASE QUANTUM EFFICIENCY OF IMAGE S...

DUMMY VERTICAL TRANSISTOR STRUCTURE TO REDUCE CROSS TALK IN PIXEL S...

METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES

THROUGH-SUBSTRATE VIA FORMATION TO ENLARGE ELECTROCHEMICAL PLATING...

RING STRUCTURE FOR FILM RESISTOR

BOND PAD STRUCTURE WITH REDUCED STEP HEIGHT AND INCREASED ELECTRICA...

BIPOLAR JUNCTION TRANSISTOR (BJT) COMPRISING A MULTILAYER BASE DIEL...

PIXEL ISOLATION STRUCTURE

METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

METHOD OF FORMING SELF ALIGNED GRIDS IN BSI IMAGE SENSOR

ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF...

BSI Image Sensor and Method of Forming Same

LENS STRUCTURE CONFIGURED TO INCREASE QUANTUM EFFICIENCY OF IMAGE S...